| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 02/23/2010 | US7666765 Method for forming a group III nitride material on a silicon substrate |
| 02/23/2010 | US7666734 Semiconductor device having a fuse |
| 02/23/2010 | US7666728 Manufacturing method of semiconductor device |
| 02/23/2010 | US7666722 Manufacturing method of semiconductor device, and IC card, IC tag, RFID, transponder, bill, securities, passport, electronic apparatus, bag, and garment |
| 02/23/2010 | US7666718 Wiring and manufacturing method thereof, semiconductor device comprising said wiring, and dry etching method |
| 02/23/2010 | US7666717 Non-volatile memory devices including fuse covered field regions |
| 02/23/2010 | US7666715 Radiation-emitting and/or radiation-receiving semiconductor component and method for the production thereof |
| 02/23/2010 | US7666711 Semiconductor device and method of forming double-sided through vias in saw streets |
| 02/23/2010 | US7666708 Doped elongated semiconductors, growing such semiconductors, devices including such semiconductors, and fabricating such devices |
| 02/23/2010 | US7666690 System, apparatus and method of selective laser repair for metal bumps of semiconductor device stack |
| 02/23/2010 | US7666016 IC socket |
| 02/23/2010 | US7665652 Electronic devices including metallurgy structures for wire and solder bonding |
| 02/23/2010 | US7665511 Orientation insensitive thermosiphon capable of operation in upside down position |
| 02/23/2010 | US7665510 Fluid drive unit and heat transport system |
| 02/23/2010 | US7665209 Method manufacturing wiring substrate |
| 02/23/2010 | US7665207 Method of making a multi-chip electronic package having laminate carrier |
| 02/18/2010 | WO2010019889A1 Corrosion control of stacked integrated circuits |
| 02/18/2010 | WO2010019663A1 System and method for excess voltage protection in a multi-die package |
| 02/18/2010 | WO2010019517A1 Liquid submerged, horizontal computer server rack and systems and methods of cooling such a server rack |
| 02/18/2010 | WO2010019490A1 Conformal adhesion promoter liner for metal interconnects |
| 02/18/2010 | WO2010019067A1 Personal data carrier |
| 02/18/2010 | WO2010018864A1 Display device, cu alloy film for use in the display device, and cu alloy sputtering target |
| 02/18/2010 | WO2010018008A1 Thermosetting composition |
| 02/18/2010 | WO2010017655A1 A light emitting diode base structure with embedded capacitor |
| 02/18/2010 | WO2009137653A3 Heat transfer assembly and methods therefor |
| 02/18/2010 | WO2008154526A3 Method to make low resistance contact |
| 02/18/2010 | US20100039843 Semiconductor module for use in power supply |
| 02/18/2010 | US20100039772 Cooling device and electronic device |
| 02/18/2010 | US20100039767 Expansion tank device, process for fabricating expansion tank device, and liquid cooling radiator |
| 02/18/2010 | US20100038804 Integrated circuit package system with mold gate |
| 02/18/2010 | US20100038803 Low fabrication cost, high performance, high reliability chip scale package |
| 02/18/2010 | US20100038802 Stacked semiconductor device and method |
| 02/18/2010 | US20100038801 Corrosion Control of Stacked Integrated Circuits |
| 02/18/2010 | US20100038800 Through-silicon via structures including conductive protective layers and methods of forming the same |
| 02/18/2010 | US20100038799 Semiconductor integrated circuit device, mounting structure of semiconductor integrated circuit device, and method for manufacturing semiconductor integrated circuit device |
| 02/18/2010 | US20100038798 Method for correcting mask pattern, photomask, method for fabricating photomask, electron beam writing method for fabricating photomask, exposure method, semiconductor device, and method for fabricating semiconductor device |
| 02/18/2010 | US20100038797 Controlling lateral distribution of air gaps in interconnects |
| 02/18/2010 | US20100038796 High aspect ratio contacts |
| 02/18/2010 | US20100038795 Method of fabricating semiconductor device and semiconductor device |
| 02/18/2010 | US20100038794 Three dimensional nanoscale circuit interconnect and method of assembly by dielectrophoresis |
| 02/18/2010 | US20100038793 Interconnect structures comprising capping layers with low dielectric constants and methods of making the same |
| 02/18/2010 | US20100038792 Semiconductor device |
| 02/18/2010 | US20100038790 reliability of wide interconnects |
| 02/18/2010 | US20100038789 Conformal adhesion promoter liner for metal interconnects |
| 02/18/2010 | US20100038788 Multi-layered metal line of semiconductor device for preventing diffusion between metal lines and method for forming the same |
| 02/18/2010 | US20100038787 Semiconductor device and method of manufacturing the same |
| 02/18/2010 | US20100038786 Method for manufacturing a semiconductor device |
| 02/18/2010 | US20100038785 Materials for Adhesion Enhancement of Copper Film on Diffusion Barriers |
| 02/18/2010 | US20100038784 Redundant barrier structure for interconnect and wiring applications, design structure and method of manufacture |
| 02/18/2010 | US20100038783 Metal cap for back end of line (beol) interconnects, design structure and method of manufacture |
| 02/18/2010 | US20100038782 Nitrogen-containing metal cap for interconnect structures |
| 02/18/2010 | US20100038781 Integrated circuit packaging system having a cavity |
| 02/18/2010 | US20100038780 Underfill flow guide structures and method of using same |
| 02/18/2010 | US20100038779 Semiconductor device |
| 02/18/2010 | US20100038778 Integrated circuit structures and fabricating methods that use voids in through holes as joining interfaces |
| 02/18/2010 | US20100038777 Method of making a sidewall-protected metallic pillar on a semiconductor substrate |
| 02/18/2010 | US20100038776 Miniature microwave package and process for fabricating the package |
| 02/18/2010 | US20100038775 Miniature electronic component for microwave applications |
| 02/18/2010 | US20100038774 Advanced and integrated cooling for press-packages |
| 02/18/2010 | US20100038773 Bond pad for wafer and package for cmos imager |
| 02/18/2010 | US20100038772 Semiconductor package and manufacturing method thereof |
| 02/18/2010 | US20100038771 Integrated circuit package with open substrate |
| 02/18/2010 | US20100038770 Method of packaging and interconnection of integrated circuits |
| 02/18/2010 | US20100038764 Package on Package Design a Combination of Laminate and Tape Substrate with Back-to-Back Die Combination |
| 02/18/2010 | US20100038763 Semiconductor structure with communication element |
| 02/18/2010 | US20100038762 Circuit board manufacturing method, semiconductor manufacturing apparatus, circuit board and semiconductor device |
| 02/18/2010 | US20100038761 Integrated circuit package system |
| 02/18/2010 | US20100038760 Metal Leadframe Package with Secure Feature |
| 02/18/2010 | US20100038759 Leadless Package with Internally Extended Package Leads |
| 02/18/2010 | US20100038758 Semiconductor module with two cooling surfaces and method |
| 02/18/2010 | US20100038749 Contact and VIA Interconnects Using Metal Around Dielectric Pillars |
| 02/18/2010 | US20100038747 Electrically programmable fuse and fabrication method |
| 02/18/2010 | US20100038746 Semiconductor structure and method for making isolation structure therein |
| 02/18/2010 | US20100038745 Integrated circuit structure having bottle-shaped isolation |
| 02/18/2010 | US20100038744 Shallow Trench Isolation |
| 02/18/2010 | US20100038741 Semiconductor apparatus, manufacturing method of semiconductor apparatus, and camera module |
| 02/18/2010 | US20100038733 Microelectromichanical system package with strain relief bridge |
| 02/18/2010 | US20100038660 Two-phase cooling for light-emitting devices |
| 02/18/2010 | US20100037461 Patterned structure for a thermal interface |
| 02/18/2010 | DE10333251B4 Kommunikations-Halbleiterbaustein und Kommunikationssystem A communication semiconductor module and communication system |
| 02/18/2010 | DE10251411B4 Vorrichtung, umfassend eine elektronische Schaltung mit mindestens einem Halbleitermodul An apparatus comprising an electronic circuit with at least one semiconductor module |
| 02/18/2010 | DE102009030026A1 Kondensatorstruktur Capacitor structure |
| 02/18/2010 | DE102009029870A1 Verfahren zum Herstellen einer Halbleiteranordnung und Halbleiteranordnung A method of manufacturing a semiconductor device and semiconductor device |
| 02/18/2010 | DE102009029844A1 Kupferdrahtbonden auf organischen Lötschutzmaterialien (OSP) und verbesserter Drahtbondungsprozess Copper wire bonding to organic Lötschutzmaterialien (OSP) and improved Drahtbondungsprozess |
| 02/18/2010 | DE102009011349A1 Halbleiterbauelement mit inhärenten Kapazitäten und Verfahren zur Herstellung desselben Of the same semiconductor device with inherent capacity and process for preparing |
| 02/18/2010 | DE102008038750A1 Optoelektronisches Bauelement und Verfahren zu dessen Herstellung Optoelectronic component and process for its preparation |
| 02/18/2010 | DE102008038748A1 Oberflächenmontierbares, optoelektronisches Halbleiterbauteil Surface mount, optoelectronic semiconductor component |
| 02/18/2010 | DE102008038725A1 Optoelektronischer Halbleiterchip The optoelectronic semiconductor chip |
| 02/18/2010 | DE102008026347A1 Power-electronic arrangement, has electrically conducting regions arranged in edge region, where arrangement between one of conducting regions and base body comprises electrically conductive connection |
| 02/18/2010 | DE102005015454B4 Halbleitersensorbauteil mit Hohlraumgehäuse und Sensorchip sowie Verfahren zur Herstellung desselben Of the same semiconductor sensor device with housing cavity and the sensor chip and methods for preparing |
| 02/18/2010 | CA2731994A1 Liquid submerged, horizontal computer server rack and systems and methods of cooling such a server rack |
| 02/17/2010 | EP2154938A2 Sustainable endothermic heat stripping method and apparatus |
| 02/17/2010 | EP2154708A1 High-temperature bonding composition, substrate bonding method, and 3-D semiconductor device |
| 02/17/2010 | EP2154205A1 Resin composition, resin spacer film, and semiconductor device |
| 02/17/2010 | EP2154188A1 Resin composition containing fine metal oxide particles |
| 02/17/2010 | EP2154170A1 Thermosetting epoxy resin compositions and use thereof |
| 02/17/2010 | EP2154109A1 Graphite film and graphite composite film |
| 02/17/2010 | EP2153706A1 Electronic circuit device |
| 02/17/2010 | EP2153465A1 Packaged system of semiconductor chips having a semiconductor interposer |
| 02/17/2010 | EP2152784A1 Benzoxazine-formulations with reduced outgassing behaviour |