| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 02/24/2010 | EP2157605A1 Electronic part apparatus and process for manufacturing the same |
| 02/24/2010 | EP2156467A1 Microwave integrated circuit package and method for forming such package |
| 02/24/2010 | EP2156465A1 Electrical interconnect structure and method of forming the same |
| 02/24/2010 | EP2155618A1 Insulation paste for a metal core substrate and electronic device |
| 02/24/2010 | EP1644975B1 Method and arrangement in an inverter to minimise thermal stress at the components |
| 02/24/2010 | EP1573403B1 Resistor structures to electrically measure unidirectional misalignment of stitched masks |
| 02/24/2010 | EP1499905B1 Method and arrangement for protecting a chip and checking its authenticity |
| 02/24/2010 | EP1392449B1 Over-clocking in a microdeposition control system to improve resolution |
| 02/24/2010 | CN201414073Y M-type minitype semiconductor bridge rectifier |
| 02/24/2010 | CN201413832Y Radiating fin of high-power LED radiator |
| 02/24/2010 | CN201413826Y Mesa type glass passivated diode chip |
| 02/24/2010 | CN201413825Y Joint type field effect tube |
| 02/24/2010 | CN201413824Y Environment-friendly storing device |
| 02/24/2010 | CN201413823Y Surface-mounted dual-chip diode rectifying device |
| 02/24/2010 | CN201413822Y Pin layout of step-down circuit |
| 02/24/2010 | CN201413821Y Radiator of explosion-proof variable-frequency speed controller |
| 02/24/2010 | CN201413820Y Power module radiator of battery charger |
| 02/24/2010 | CN201412988Y Semiconductor refrigeration cooler for head |
| 02/24/2010 | CN101657898A Method and structure for making a top-side contact to a substrate |
| 02/24/2010 | CN101657897A Method for manufacturing an element having electrically conductive members for application in a microelectronic package |
| 02/24/2010 | CN101657896A 电子电路封装 Electronic circuit package |
| 02/24/2010 | CN101656245A Semiconductor memory device having pads |
| 02/24/2010 | CN101656244A Multilayer interconnection packaging structure of silica-based embedded microwave multi chip module and manufacturing method |
| 02/24/2010 | CN101656243A Lead frame, resin package, semiconductor device and resin package manufacturing method |
| 02/24/2010 | CN101656242A Lead frame for physical quantity sensor, and manufacturing method therefor |
| 02/24/2010 | CN101656241A Packaging structure with substrate post and packaging method thereof |
| 02/24/2010 | CN101656240A Single-crystal grain size semiconductor element insulating covering structure and manufacturing process thereof |
| 02/24/2010 | CN101656239A Bonding welding disk lowering parasitic capacitance and preparing method thereof |
| 02/24/2010 | CN101656238A Advanced quad flat non-leaded package structure and manufacturing method thereof |
| 02/24/2010 | CN101656237A Radiator and manufacturing method thereof |
| 02/24/2010 | CN101656236A Submount and method for manufacturing same |
| 02/24/2010 | CN101656235A Flex-rigid integrated circuit (IC) package substrate and manufacturing method thereof |
| 02/24/2010 | CN101656234A Advanced quad flat non-leaded package structure and manufacturing method thereof |
| 02/24/2010 | CN100592860C Electronic device |
| 02/24/2010 | CN100592541C Thermoelectric nano-wire devices |
| 02/24/2010 | CN100592524C Image display unit and method for manufacturing the same |
| 02/24/2010 | CN100592508C Ta-Al-N diffusion blocking layer thin film for copper wiring and preparation thereof |
| 02/24/2010 | CN100592507C Metal conducting wire mosaic structure and method of manufacture |
| 02/24/2010 | CN100592506C Non-planar base grate and method for semiconductor package using same |
| 02/24/2010 | CN100592505C Thin membrane flip chip encapsulation |
| 02/24/2010 | CN100592504C Radiation module fixing structure |
| 02/24/2010 | CN100592503C Pin type electronic element radiation element |
| 02/24/2010 | CN100592502C Light-emitting device, electronic equipment, and method of manufacturing thereof |
| 02/24/2010 | CN100592501C Conductive substrate, semiconductor device and manufacturing method thereof |
| 02/24/2010 | CN100592302C Integrated circuit including nested voltage island |
| 02/24/2010 | CN100592196C Cooling for projection light emitting diode |
| 02/23/2010 | US7669159 IC tiling pattern method, IC so formed and analysis method |
| 02/23/2010 | US7667974 Module and mounted structure using the same |
| 02/23/2010 | US7667477 Circuit for detecting and measuring noise in semiconductor integrated circuit |
| 02/23/2010 | US7667339 Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same |
| 02/23/2010 | US7667338 Package with solder-filled via holes in molding layers |
| 02/23/2010 | US7667337 Semiconductor device with conductive die attach material |
| 02/23/2010 | US7667336 Semiconductor device and method for manufacturing the same |
| 02/23/2010 | US7667335 Semiconductor package with passivation island for reducing stress on solder bumps |
| 02/23/2010 | US7667333 Stack of semiconductor chips |
| 02/23/2010 | US7667332 Method for generating pattern, method for manufacturing semiconductor device, semiconductor device, and computer program product |
| 02/23/2010 | US7667331 Interposer chip, method of manufacturing the interposer chip, and multi-chip package having the interposer chip |
| 02/23/2010 | US7667328 Integration circuits for reducing electromigration effect |
| 02/23/2010 | US7667326 Power semiconductor component, power semiconductor device as well as methods for their production |
| 02/23/2010 | US7667325 Circuit board including solder ball land having hole and semiconductor package having the circuit board |
| 02/23/2010 | US7667324 Systems, devices, components and methods for hermetically sealing electronic modules and packages |
| 02/23/2010 | US7667323 Spaced, bumped component structure |
| 02/23/2010 | US7667322 High-frequency semiconductor device |
| 02/23/2010 | US7667320 Integrated circuit package with improved power signal connection |
| 02/23/2010 | US7667319 Electroosmotic pump using nanoporous dielectric frit |
| 02/23/2010 | US7667318 Fan out type wafer level package structure and method of the same |
| 02/23/2010 | US7667317 Semiconductor package with bypass capacitor |
| 02/23/2010 | US7667316 Semiconductor integrated circuit and method for manufacturing the same |
| 02/23/2010 | US7667315 Semiconductor device having a frame portion and an opening portion with mountable semiconductor chips therein |
| 02/23/2010 | US7667314 Integrated circuit package system with mold lock subassembly |
| 02/23/2010 | US7667313 Stacked semiconductor module |
| 02/23/2010 | US7667312 Semiconductor device including a heat-transmitting and electromagnetic-noise-blocking substance and method of manufacturing the same |
| 02/23/2010 | US7667311 LSI package provided with interface module, and transmission line header employed in the package |
| 02/23/2010 | US7667310 Paper including semiconductor device and manufacturing method thereof |
| 02/23/2010 | US7667309 Space-efficient package for laterally conducting device |
| 02/23/2010 | US7667308 Leaded stacked packages having integrated upper lead |
| 02/23/2010 | US7667307 Semiconductor device |
| 02/23/2010 | US7667306 Leadframe-based semiconductor package |
| 02/23/2010 | US7667305 Semiconductor device |
| 02/23/2010 | US7667304 Inkjet printed leadframes |
| 02/23/2010 | US7667303 Multi-chip package |
| 02/23/2010 | US7667302 Integrated circuit chip with seal ring structure |
| 02/23/2010 | US7667301 Thermal treatment apparatus, method for manufacturing semiconductor device, and method for manufacturing substrate |
| 02/23/2010 | US7667288 Systems and methods for voltage distribution via epitaxial layers |
| 02/23/2010 | US7667279 Semiconductor device |
| 02/23/2010 | US7667275 Using oxynitride spacer to reduce parasitic capacitance in CMOS devices |
| 02/23/2010 | US7667273 Semiconductor device and method for manufacturing the same |
| 02/23/2010 | US7667272 Semiconductor device including a current mirror circuit |
| 02/23/2010 | US7667271 Fin field-effect transistors |
| 02/23/2010 | US7667269 Trench gate type semiconductor device |
| 02/23/2010 | US7667268 Isolated transistor |
| 02/23/2010 | US7667245 Driving circuit of a liquid crystal display panel |
| 02/23/2010 | US7667243 Local ESD protection for low-capicitance applications |
| 02/23/2010 | US7667240 Radiation-emitting semiconductor chip and method for producing such a semiconductor chip |
| 02/23/2010 | US7667231 Automatic on-die defect isolation |
| 02/23/2010 | US7667182 Semiconductor photodetector with converging structure on light receiving surface sealed with optical transmitting resin containing micro particles |
| 02/23/2010 | US7666788 Methods for forming conductive vias in semiconductor device components |
| 02/23/2010 | US7666783 Method and arrangement for contacting terminals |
| 02/23/2010 | US7666778 Method of arranging solder balls for ball grid array packages |
| 02/23/2010 | US7666772 Heat treatment apparatus and method of manufacturing a semiconductor device |