Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
02/2010
02/25/2010WO2010020105A1 Led driven by ac power directly
02/25/2010WO2010020071A1 LIGHT-EMITTING DEVICE BASED ON STRAIN-ADJUSTABLE InGaAlN FILM
02/25/2010WO2010020033A1 Integrated circuit package employing predetermined three-dimensional solder pad surface and method for making same
02/25/2010WO2010002510A3 Methods and systems for packaging integrated circuits with integrated passive components
02/25/2010WO2009158533A3 Method of wire bonding a stackof semiconductor chips in an offset configuration and device obtained by such a method
02/25/2010WO2009158098A3 Package on package using a bump-less build up layer (bbul) package
02/25/2010WO2009154969A3 Four mosfet full bridge module
02/25/2010WO2009143126A3 Integrated circuit package having integrated faraday shield
02/25/2010WO2009140252A3 Through-silicon enabled die stacking scheme
02/25/2010WO2009140238A3 Structure and method for reliable solder joints
02/25/2010WO2009098248A3 Doped tin tellurides for thermoelectric applications
02/25/2010WO2009088862A3 Systems and methods for cooling electronic devices using airflow dividers
02/25/2010WO2008156932A3 System and method for mounting a cooling device and method of fabrication
02/25/2010WO2008109524A3 System and method for increased stand-off height in stud bumping process
02/25/2010US20100049909 NAND Flash Memory Controller Exporting a NAND Interface
02/25/2010US20100047990 Method of fabricating a high q factor integrated circuit inductor
02/25/2010US20100047966 Integrated circuit apparatus, systems, and methods
02/25/2010US20100047946 Thin film array panel and manufacturing method thereof
02/25/2010US20100047588 Electronic Component Union, Electronic Circuit Module Utilizing the Same, and Process for Manufacturing the Same
02/25/2010US20100046756 Device for defeating reverse engineering of integrated circuits by optical means
02/25/2010US20100046266 High Speed Memory Architecture
02/25/2010US20100046167 Cooling an integrated circuit die with coolant flow in a microchannel and a thin film thermoelectric cooling device in the microchannel
02/25/2010US20100046138 Electrode in semiconductor device, capacitor and method of fabricating the same
02/25/2010US20100045639 Liquid crystal display panel and testing and manufacturing methods thereof
02/25/2010US20100045368 Semiconductor Integrated Circuit
02/25/2010US20100045326 Thermal monitoring and management of integrated circuits
02/25/2010US20100045325 Test Pad Design for Reducing the Effect of Contact Resistances
02/25/2010US20100044890 Semiconductor substrate manufacture apparatus, semiconductor substrate manufacture method, and semiconductor substrate
02/25/2010US20100044889 Electrical Component and Film Composite Laminated On the Component and Method for Production
02/25/2010US20100044888 Bis(aminophenol) derivative, process for producing same, polyamide resin, positive photosensitive resin composition, protective film, interlayer dielectric film, semiconductor device, and display element
02/25/2010US20100044887 Method for producing circuit substrate, and circuit substrate
02/25/2010US20100044886 Semiconductor device having pairs of pads
02/25/2010US20100044885 Semiconductor device and manufacturing method
02/25/2010US20100044884 Integrated circuit package employing predetermined three-dimensional solder pad surface and method for making same
02/25/2010US20100044882 Integrated circuit package system flip chip
02/25/2010US20100044881 Semiconductor device and fabrication method thereof
02/25/2010US20100044880 Semiconductor device and semiconductor module
02/25/2010US20100044879 Layered chip package and method of manufacturing same
02/25/2010US20100044878 Integrated circuit package system having cavity
02/25/2010US20100044877 Electronic device having a chip stack
02/25/2010US20100044876 Conductive structures for microfeature devices and methods for fabricating microfeature devices
02/25/2010US20100044875 Methods and apparatus for defining manhattan power grid structures having a reduced number of vias
02/25/2010US20100044874 Integrated circuit of decreased size
02/25/2010US20100044873 Semiconductor device and method of manufacturing the same
02/25/2010US20100044872 Semiconductor memory device having pads
02/25/2010US20100044871 Semiconductor device, display device, and electronic device
02/25/2010US20100044870 Electrode connection structure of semiconductor chip, conductive member, and semiconductor device and method for manufacturing the same
02/25/2010US20100044869 Reliable interconnects
02/25/2010US20100044868 Semiconductor device
02/25/2010US20100044867 Methods of post-contact back end of line through-hole via integration
02/25/2010US20100044866 Semiconductor device having via connecting between interconnects
02/25/2010US20100044865 Fabrication of a diffusion barrier cap on copper containing conductive elements
02/25/2010US20100044864 Method of manufacturing semiconductor device, and semiconductor device
02/25/2010US20100044863 Semiconductor device
02/25/2010US20100044862 Method of forming collapse chip connection bumps on a semiconductor substrate
02/25/2010US20100044861 Semiconductor die support in an offset die stack
02/25/2010US20100044860 Microelectronic substrate or element having conductive pads and metal posts joined thereto using bond layer
02/25/2010US20100044859 Semiconductor device and method of fabricating semiconductor device
02/25/2010US20100044858 Product Chips and Die With a Feature Pattern That Contains Information Relating to the Product Chip, Methods for Fabricating Such Product Chips and Die, and Methods for Reading a Feature Pattern From a Packaged Die
02/25/2010US20100044857 Wlcsp target and method for forming the same
02/25/2010US20100044856 Electronic package with a thermal interposer and method of manufacturing the same
02/25/2010US20100044855 Integrated thermal structures and fabrication methods thereof facilitating implementing a cell phone or other electronic system
02/25/2010US20100044854 Semiconductor device and a method of manufacturing the same and a mounting structure of a semiconductor device
02/25/2010US20100044853 System-in-package with through substrate via holes
02/25/2010US20100044852 Vertical stack type multi-chip package having improved grounding performance and lower semiconductor chip reliability
02/25/2010US20100044851 Flip chip packages
02/25/2010US20100044850 Advanced quad flat non-leaded package structure and manufacturing method thereof
02/25/2010US20100044849 Stacked integrated circuit package-in-package system and method of manufacture thereof
02/25/2010US20100044848 Solder joint reliability in microelectronic packaging
02/25/2010US20100044847 Semiconductor chip including a chip via plug penetrating a substrate, a semiconductor stack, a semiconductor device package and an electronic apparatus including the semiconductor chip
02/25/2010US20100044845 Circuit substrate, an electronic device arrangement and a manufacturing process for the circuit substrate
02/25/2010US20100044844 Lead frame, resin package, semiconductor device and resin package manufacturing method
02/25/2010US20100044843 Advanced quad flat non-leaded package structure and manufacturing method thereof
02/25/2010US20100044842 Semiconductor device
02/25/2010US20100044841 Semiconductor device
02/25/2010US20100044840 Shielded multi-layer package structures
02/25/2010US20100044838 Semiconductor component with marginal region
02/25/2010US20100044813 Optically controlled read only memory
02/25/2010US20100044793 Semiconductor device having a plurality of misfets formed on a main surface of a semiconductor substrate
02/25/2010US20100044759 Double-sided integrated circuit chips
02/25/2010US20100044757 Semiconductor device having a contact plug and manufacturing method thereof
02/25/2010US20100044748 Electrostatic discharge protection device
02/25/2010US20100044736 Semiconductor apparatus and method of manufacturing same
02/25/2010US20100044725 Device for defeating reverse engineering of integrated circuits by optical means
02/25/2010US20100044724 Device for defeating reverse engineering of integrated circuits by optical means
02/25/2010US20100044723 Package for photoelectric wiring and lead frame
02/25/2010US20100044100 Board structure and electronic device
02/25/2010US20100044085 Wiring, display device and method of manufacturing the same
02/25/2010DE202009016521U1 Befestigungsgestell und Kühlmodul mit diesem Befestigungsgestell Mounting rack and cooling module with this mounting stand
02/25/2010DE10311824B4 Periphere Schaltkreisstruktur eines Halbleiterspeicherbauelements Peripheral circuit structure of a semiconductor memory device
02/25/2010DE102009032848A1 Integrierte Schaltung und Verfahren zum Herstellen einer integrierten Schaltung Integrated circuit and method for fabricating an integrated circuit
02/25/2010DE102009014424A1 Stoff aus Metall und Milchsäurekondensat sowie elektronisches Bauteil Fabric made of metal and lactic acid condensate and electronic component
02/25/2010DE102008058011A1 Electronic component for use as pile in injection valves of motor vehicles, has external contacting, which is provided for manufacturing electrical connection at multiple contact positions at side electrode
02/25/2010DE102008038175A1 Semiconductor arrangement for use in electronic system, has mold for covering semiconductor chip, and set of flexible elements arranged in recesses, where flexible elements connect set of contact elements with mold
02/25/2010DE102007049961A9 ESD-Schutz für integrierte Schaltungen ESD Protection for Integrated Circuits
02/25/2010DE102007045281B4 Leistungsmodul Power module
02/25/2010CA2733765A1 Halo-hydrocarbon polymer coating
02/24/2010EP2157624A1 Resin composition for led encapsulation
02/24/2010EP2157607A1 Laminated heat dissipating base body, and heat dissipating unit and electronic device using the laminated heat dissipating base body
02/24/2010EP2157606A1 Metallized substrate and process for producing the same
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