Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
03/2010
03/03/2010CN201417763Y Semi-conductor water cooling system of computer central processing unit
03/03/2010CN201417762Y Heat dissipation device for high-power semiconductor device
03/03/2010CN201417761Y Active heat dissipation module structure improvement
03/03/2010CN201417760Y Chip packaging structure
03/03/2010CN101663753A Fabricating a contact rhodium structure by electroplating and electroplating composition
03/03/2010CN101663752A A power semiconductor arrangement and a semiconductor valve provided therewith
03/03/2010CN101663751A Semiconductor device
03/03/2010CN101663750A Electronic device, electronic apparatus mounting electronic device, article mounting electronic device, and method for manufacturing electronic device
03/03/2010CN101663749A Stacked-die package for battery power management
03/03/2010CN101663748A Functional element package and fabrication method therefor
03/03/2010CN101661924A Test pad design for reducing the effect of contact resistances
03/03/2010CN101661923A Electrode base plate of organic light-emitting device
03/03/2010CN101661922A Copper interconnection line with silicon through hole having high depth-to-width ratio and preparation method thereof
03/03/2010CN101661921A Metal routing layer structure in microwave monolithic integrated circuit and preparation method thereof
03/03/2010CN101661920A Chip packaging carrying plate and making method thereof
03/03/2010CN101661919A High-power transistor
03/03/2010CN101661918A Quad flat non-leaded chip package
03/03/2010CN101661917A Chip packaging structure of resin core column
03/03/2010CN101661916A Structure for re-wiring layer on soft film flip chip encapsulation
03/03/2010CN101661915A Liquid-cooled-type cooling device
03/03/2010CN101661914A Liquid-cooled-type cooling device
03/03/2010CN101661913A Chip scale package structure and fabrication method thereof
03/03/2010CN101661912A Inverter power module for with distributed support for direct substrate cooling
03/03/2010CN101661911A Chip package structure
03/03/2010CN101661910A Gallium nitride semiconductor substrate and blue luminescent device
03/03/2010CN101661909A Thermosetting die-bonding film
03/03/2010CN100593271C Optoelectronic device packaging with hermetically sealed cavity and integrated optical element
03/03/2010CN100593241C Solid state imaging apparatus and method for fabricating the same
03/03/2010CN100593239C Chip and its making method
03/03/2010CN100593238C Method for manufacturing electronic component and thermal conduction component as well as method for installing thermal conduction component for electronic component
03/02/2010US7673262 System and method for product yield prediction
03/02/2010US7673258 Design data creating method, design data creating program product, and manufacturing method of semiconductor device
03/02/2010US7672132 Electronic packaging apparatus and method
03/02/2010US7672129 Intelligent microchannel cooling
03/02/2010US7672098 Power plug with leakage current detection and protection circuit
03/02/2010US7671714 Planar inductive component and a planar transformer
03/02/2010US7671477 Technique for moderating stresses cause by a difference in thermal expansion coeffiecients between a substrate and an electronic component
03/02/2010US7671476 Semiconductor device and method of manufacturing the same
03/02/2010US7671474 Integrated circuit package device with improved bond pad connections, a lead-frame and an electronic device
03/02/2010US7671473 Semiconductor device and method of fabricating the same
03/02/2010US7671469 SiGe device with SiGe-embedded dummy pattern for alleviating micro-loading effect
03/02/2010US7671467 Power semiconductor module
03/02/2010US7671466 Semiconductor package having heat dissipating device with cooling fluid
03/02/2010US7671465 Power semiconductor module
03/02/2010US7671464 Lighting device having a lighting unit with an optical semiconductor bare chip mounted on printed wiring board
03/02/2010US7671463 Integrated circuit package system with ground ring
03/02/2010US7671462 Power semiconductor device
03/02/2010US7671461 Method and system for hermetically sealing packages for optics
03/02/2010US7671460 Buried via technology for three dimensional integrated circuits
03/02/2010US7671459 Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices
03/02/2010US7671458 Connecting member used for semiconductor device including plurality of arranged semiconductor modules and semiconductor device provided with the same
03/02/2010US7671457 Semiconductor package including top-surface terminals for mounting another semiconductor package
03/02/2010US7671456 Power management integrated circuit
03/02/2010US7671455 Semiconductor device package with integrated heat spreader
03/02/2010US7671454 Tape carrier, semiconductor apparatus, and semiconductor module apparatus
03/02/2010US7671453 Semiconductor device and method for producing the same
03/02/2010US7671452 Microarray package with plated contact pedestals
03/02/2010US7671451 Semiconductor package having double layer leadframe
03/02/2010US7671450 Integrated circuit package for high-speed signals
03/02/2010US7671447 Bipolar transistor and method of manufacturing the same
03/02/2010US7671445 Versatile system for charge dissipation in the formation of semiconductor device structures
03/02/2010US7671444 Empty vias for electromigration during electronic-fuse re-programming
03/02/2010US7671434 Electronic component, laser device, optical writing device and image forming apparatus
03/02/2010US7671431 Cloverleaf microgyroscope with through-wafer interconnects and method of manufacturing a cloverleaf microgyroscope with through-wafer interconnects
03/02/2010US7671422 Pseudo 6T SRAM cell
03/02/2010US7671416 Method and device for electrostatic discharge protection
03/02/2010US7671415 Electro-static discharge protection circuit and semiconductor device having the same
03/02/2010US7671414 Semiconductor on insulator apparatus
03/02/2010US7671398 Nano memory, light, energy, antenna and strand-based systems and methods
03/02/2010US7671384 Semiconductor integrated circuit device having improved punch-through resistance and production method thereof, semiconductor integrated circuit device including a low-voltage transistor and a high-voltage transistor
03/02/2010US7671374 LED chip package structure with a plurality of thick guiding pins and a method for manufacturing the same
03/02/2010US7671371 Semiconductor layer structure and method of making the same
03/02/2010US7671368 Capacitor and light emitting display using the same
03/02/2010US7671362 Test structure for determining optimal seed and liner layer thicknesses for dual damascene processing
03/02/2010US7671361 Semiconductor device including fuse focus detector, fabricating method thereof and laser repair method using the fuse focus detector
03/02/2010US7671295 Processing a memory link with a set of at least two laser pulses
03/02/2010US7671120 Chain extension for thermal materials
03/02/2010US7671002 A mixture of solvents with no corrosion of copper properties and a corrosion inhibitor; during the photolithographic process, removing photoresist remaining after forming copper line
03/02/2010US7670948 Semiconductor device having diffusion barriers and a method of preventing diffusion of copper in a metal interconnection of a semiconductor device
03/02/2010US7670945 In situ deposition of a low κ dielectric layer, barrier layer, etch stop, and anti-reflective coating for damascene application
03/02/2010US7670944 Conformal lining layers for damascene metallization
03/02/2010US7670935 Manufacturing method of semiconductor device
03/02/2010US7670922 Method of measuring alignment of measurement pattern
03/02/2010US7670893 Membrane IC fabrication
03/02/2010US7670879 Manufacturing method of semiconductor module including solid-liquid diffusion joining steps
03/02/2010US7670761 Method of forming a fine pattern of a semiconductor device using a resist reflow measurement key
03/02/2010US7670473 integrated circuits; semiconductors
03/02/2010US7670437 Mask and substrate alignment for solder bump process
02/2010
02/25/2010WO2010022009A2 Process for through silicon via filling
02/25/2010WO2010021957A1 Integrated circuit with parallel sets of transistor amplifiers having different turn on power levels
02/25/2010WO2010021776A1 Thin foil semiconductor package
02/25/2010WO2010021685A1 Microelectronic substrate having metal posts joined thereto using bond layer
02/25/2010WO2010021624A1 Mitigation of whiskers in sn-films
02/25/2010WO2010021268A1 Electronic component and method for manufacturing the same
02/25/2010WO2010021267A1 Electronic component and method for manufacturing the same
02/25/2010WO2010021262A1 Circuit module and method for manufacturing same
02/25/2010WO2010020912A1 Apparatus and method for molecule detection using nanopores
02/25/2010WO2010020836A1 Impedance controlled electrical interconnection employing meta-materials
02/25/2010WO2010020462A1 Product chips and die with a feature pattern that contains information relating to the product chip, methods for fabricating such product chips and die, and methods for reading a feature pattern from a packaged die
02/25/2010WO2010020438A1 Cooling device
1 ... 673 674 675 676 677 678 679 680 681 682 683 684 685 686 687 688 689 690 691 692 693 ... 2262