Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
03/2010
03/04/2010US20100052156 Chip scale package structure and fabrication method thereof
03/04/2010US20100052155 Methods of promoting adhesion between transfer molded ic packages and injection molded plastics for creating over-molded memory cards
03/04/2010US20100052154 Surface smoothened ultrahigh conductivity composite lid for improved marking permanency of semiconductor packaged devices
03/04/2010US20100052153 Semiconductor package and method of manufacturing the same, and semiconductor device and method of manufacturing the same
03/04/2010US20100052152 Semiconductor package transformer
03/04/2010US20100052151 Ball Grid Array Package Having One or More Stiffeners
03/04/2010US20100052150 Integrated circuit package system with package substrate having corner contacts and method of manufacture thereof
03/04/2010US20100052149 Semiconductor device and method of manufacturing the same
03/04/2010US20100052148 Package structure and package substrate
03/04/2010US20100052147 Semiconductor device including stress relaxation gaps for enhancing chip package interaction stability
03/04/2010US20100052146 Semiconductor package and fabrication method thereof
03/04/2010US20100052145 Semiconductor package and method therefor
03/04/2010US20100052144 Semiconductor package substrate and method, in particular for mems devices
03/04/2010US20100052143 Electronic packaging structure and a manufacturing method thereof
03/04/2010US20100052142 Semiconductor device and method for fabricating semiconductor device
03/04/2010US20100052141 Qfn package
03/04/2010US20100052140 Package structure
03/04/2010US20100052139 Semiconductor device and method for manufacturing the same, and semiconductor sealing resin
03/04/2010US20100052138 Resin molded semiconductor device and manufacturing method thereof
03/04/2010US20100052137 Enhanced wire bond stability on reactive metal surfaces of a semiconductor device by encapsulation of the bond structure
03/04/2010US20100052134 3-d integrated semiconductor device comprising intermediate heat spreading capabilities
03/04/2010US20100052133 Stack type semiconductor device with reinforcing resin
03/04/2010US20100052132 Semiconductor package
03/04/2010US20100052131 Integrated circuit package system with redistribution layer
03/04/2010US20100052130 Semiconductor package and methods for manufacturing the same
03/04/2010US20100052128 Device for detecting an attack against an integrated circuit
03/04/2010US20100052127 Flip chip mlp with conductive ink
03/04/2010US20100052126 Apparatus and method for use in mounting electronic elements
03/04/2010US20100052125 Resin sealing type semiconductor device and method of manufacturing the same, and lead frame
03/04/2010US20100052124 Resin sealing type semiconductor device and method of manufacturing the same, and resin sealing type electronic device
03/04/2010US20100052123 Low stress cavity package
03/04/2010US20100052122 Wire bodning package structure
03/04/2010US20100052121 Semiconductor system-in-a-package containing micro-layered lead frame
03/04/2010US20100052120 Semiconductor device having a suspended isolating interconnect
03/04/2010US20100052119 Molded Ultra Thin Semiconductor Die Packages, Systems Using the Same, and Methods of Making the Same
03/04/2010US20100052118 Micro-layered lead frame semiconductor packages
03/04/2010US20100052117 Stackable multi-chip package system with support structure
03/04/2010US20100052111 Stacked-chip device
03/04/2010US20100052110 Semiconductor device comprising a carbon-based material for through hole vias
03/04/2010US20100052109 Substrate for semiconductor package and semiconductor package having the same
03/04/2010US20100052108 Vertical through-silicon via for a semiconductor structure
03/04/2010US20100052107 Vias and method of making
03/04/2010US20100052106 Package device having crack arrest feature and method of forming
03/04/2010US20100052105 Free-standing thickness of single crystal material and method having carrier lifetimes
03/04/2010US20100052096 Stacked-chip device
03/04/2010US20100052086 Electronic device packages and methods of fabricating electronic device packages
03/04/2010US20100052075 Integrating a first contact structure in a gate last process
03/04/2010US20100052005 Semiconductor chip assembly with post/base heat spreader and conductive trace
03/04/2010US20100052003 Surface Mountable Chip
03/04/2010US20100051963 Power transistor
03/04/2010US20100051345 Package, method of manufacturing a package and frame
03/04/2010US20100051235 Liquid-cooled-type cooling device
03/04/2010DE202009013194U1 Kühlelement und Kühlkörper aus diesen Kühlelementen Cooling element and heat sink from these cooling elements
03/04/2010DE10319539B4 Schutzstruktur zum Schutz elektrostatischer Entladung und ingetrierte Schaltung Protection structure to protect electrostatic discharge and total trated circuit
03/04/2010DE102009035920A1 Halbleiterbauelement Semiconductor device
03/04/2010DE102009033594A1 Halbleiterbauelement Semiconductor device
03/04/2010DE102009032263A1 Halbleiterbauelement und Verfahren zum Herstellen desselben Of the same semiconductor device and method of manufacturing
03/04/2010DE102008062591A1 Halbleiter-Bauelement Semiconductor component
03/04/2010DE102008045653A1 Optoelektronisches Bauteil The optoelectronic device
03/04/2010DE102008045614A1 Arrangement for electrical contacting of upper surface of e.g. power-MOSFET, by wire component, has wire component prestressed for contacting semiconductor component and resting at side of upper surface layer of semiconductor component
03/04/2010DE102008045033A1 Erhöhte Drahtverbindungsstabilität auf reaktiven Metalloberflächen eines Halbleiterbauelements durch Einkapselung der Verbindungsstruktur Increased wire connection stability on reactive metal surfaces of a semiconductor device by encapsulating the interconnect structure
03/04/2010DE102008044986A1 Ein 3-D-integriertes Schaltungsbauelement mit einer internen Wärmeverteilungsfunktion A 3-D integrated circuit device with an internal heat distribution function
03/04/2010DE102008041690A1 Substrate for receiving e.g. semiconductor laser, has layer construction including primary layer with number of layer elements that are separately arranged from each other on secondary layer
03/04/2010DE102008041550A1 Im Diepadbereich strukuiertes Leadframe, dieses Leadframe umfassende mikrostruktuierte Bauteilanordnung und Verfahren zu deren Herstellung In strukuiertes leadframe die pad area, this lead frame comprehensive mikrostruktuierte component assembly and process for their preparation
03/04/2010DE102008039710A1 Energy converter i.e. peltier element, for converting thermal energy into electric current, has base body comprising central borehole, cover comprising milled recess, and sealing system comprising two sealing rings
03/04/2010DE102008038342A1 Halbleiterbauelement mit Randbereich Semiconductor component with the edge area
03/04/2010DE102006025959B4 Leistungshalbleiteranordnung mit vorderseitig aufgelötetem Clip und Verfahren zur Herstellung einer solchen A power semiconductor device with the front side brazed clip and method of making such a
03/04/2010DE102006001885B4 Detektormodul eines Detektors und Verwendung eines Schmelzklebstoffes zur Herstellung eines Detektormoduls Detector module of a detector and using a hot melt adhesive for producing a detector module
03/04/2010DE10053201B4 Herstellung einer Siliziumoxidschicht bei einem Halbleiterherstellungsprozess unter Verwendung einer Aufschleuder-Glaszusammensetzung Preparation of a silicon oxide layer in a semiconductor manufacturing process using a spin-on-glass composition
03/03/2010EP2159841A2 A semiconductor device having a suspended isolating interconnect
03/03/2010EP2159840A2 Semiconductor device including an air-bridge wiring and manufacturing method thereof
03/03/2010EP2159839A2 Liquid-cooled-type cooling device
03/03/2010EP2159838A2 Liquid-cooled-type cooling device
03/03/2010EP2159837A1 Electronic component storing package and electronic device
03/03/2010EP2159834A1 Conductive bond wire coating
03/03/2010EP2159832A1 Process for producing semiconductor device, insulating film for semiconductor device, and apparatus for producing the insulating film
03/03/2010EP2159830A1 Process for producing semiconductor device
03/03/2010EP2159607A1 Microlens Array
03/03/2010EP2159242A1 Sealing agent for optical semiconductor element, and optical semiconductor element
03/03/2010EP2158606A1 Integrated circuit protection and detection grid
03/03/2010EP1897138B1 Semiconductor device and mounting structure thereof
03/03/2010EP1436815B1 Semiconductor memory cell and memory array using a breakdown phenomena in an ultra-thin dielectric
03/03/2010EP1118121B1 Semiconductor device arrangement having configuration via adjacent bond pad coding
03/03/2010EP1062849B1 Circuit board features with reduced parasitic capacitance and method therefor
03/03/2010CN201418231Y Communication cabinet radiator improvement
03/03/2010CN201418230Y Radiator fixing device
03/03/2010CN201418229Y A radiation device
03/03/2010CN201418227Y Novel radiator
03/03/2010CN201418226Y Casing type radiator in double contact with heating device
03/03/2010CN201417775Y Plastic shell packaged flat plate thyristor
03/03/2010CN201417773Y Encapsulating structure for T0220F outline triode product
03/03/2010CN201417772Y Power MOSFET module with gate pole resistance layout
03/03/2010CN201417771Y Power module with lower stray inductance
03/03/2010CN201417770Y Pressure equalizing transitional device used for high-power thyristor valve string
03/03/2010CN201417769Y Array type high-power integrated circuit lead wire frame
03/03/2010CN201417768Y Lead frame for semi-conductor integrated circuit
03/03/2010CN201417767Y Lead frame used for bearing triode chip during T0220F outline triode product encapsulation
03/03/2010CN201417766Y Lead frame for bearing triode chip used during encapsulation of triode products
03/03/2010CN201417765Y Base island free semi-conductor chip package structure
03/03/2010CN201417764Y Package structure of array type flat pin-free chip
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