Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
03/2010
03/09/2010US7675162 Interconnect structure using through wafer vias and method of fabrication
03/09/2010US7675161 Semiconductor device with wirings having varying lengths
03/09/2010US7675160 Individual sub-assembly containing a ceramic interposer, silicon voltage regulator, and array capacitor
03/09/2010US7675159 Base substrate for chip scale packaging
03/09/2010US7675158 Semiconductor integrated circuit including a power supply, and semiconductor system including a semiconductor integrated circuit
03/09/2010US7675157 Thermal enhanced package
03/09/2010US7675156 Electrical component
03/09/2010US7675155 Carrier structure stacking system and method
03/09/2010US7675154 RF module with multi-stack structure
03/09/2010US7675153 Semiconductor device having semiconductor chips stacked and mounted thereon and manufacturing method thereof
03/09/2010US7675151 Silicon-based packaging for electronic devices
03/09/2010US7675149 Check valve package for Pb-free, single piece electronic modules
03/09/2010US7675148 Power module having stacked flip-chip and method of fabricating the power module
03/09/2010US7675147 Methods and apparatus for providing a power signal to an area array package
03/09/2010US7675146 Semiconductor device with leadframe including a diffusion barrier
03/09/2010US7675144 Method of making wireless semiconductor device, and leadframe used therefor
03/09/2010US7675143 Semiconductor element, semiconductor device and mounting board
03/09/2010US7675135 Integrated high voltage power device having an edge termination of enhanced effectiveness
03/09/2010US7675133 Persistent p-type group II-IV semiconductors
03/09/2010US7675116 Semiconductor device with ESD protection function and ESD protection circuit
03/09/2010US7675075 Semiconductor light emitting device, light emitting module, lighting apparatus, display element and manufacturing method of semiconductor light emitting device
03/09/2010US7675073 Integrated circuit package provided with cooperatively arranged illumination and sensing capabilities
03/09/2010US7674865 Photosemiconductor encapsulant of epoxy resin, anhydride and aromatic silicone resin
03/09/2010US7674721 Semiconductor device, semiconductor wafer, and methods of producing same device and wafer
03/09/2010US7674706 System for modifying small structures using localized charge transfer mechanism to remove or deposit material
03/09/2010US7674704 Method of manufacturing a semiconductor device having an interconnect structure that increases in impurity concentration as width increases
03/09/2010US7674682 Capacitor integration at top-metal level with a protective cladding for copper surface protection
03/09/2010US7674657 Method of manufacture of encapsulated package
03/09/2010US7674656 Die positioning for packaged integrated circuits
03/09/2010US7674652 Methods of forming an integrated circuit package
03/09/2010US7674640 Stacked die package system
03/09/2010US7674638 Sensor device and production method therefor
03/09/2010US7673387 Manufacture of a layer including a component
03/09/2010US7673386 Flip-chip component production method
03/04/2010WO2010025012A2 Molded ultra thin semiconductor die packages, systems using the same, and methods of making the same
03/04/2010WO2010024932A2 Enhanced wire bond stability on reactive metal surfaces of a semiconductor device by encapsulation of the bond structure
03/04/2010WO2010024777A1 Substrate arrangement
03/04/2010WO2010024674A1 Solder interconnection
03/04/2010WO2010024343A1 Semiconductor device
03/04/2010WO2010024229A1 Thermoelectric element and thermoelectric module
03/04/2010WO2010024094A1 Thermally conductive pressure-sensitive adhesive composition, thermally conductive pressure-sensitive adhesive sheet, and electronic component
03/04/2010WO2010024015A1 Semiconductor element and display device provided with the same
03/04/2010WO2010023812A1 Semiconductor device
03/04/2010WO2010023323A1 Surface sensor
03/04/2010WO2010023308A1 Substrate for an electronic or electromechanical component and nano-elements
03/04/2010WO2010023254A1 Inductor structure
03/04/2010WO2010023220A1 Improvements in or relating to solid-state lasers
03/04/2010WO2010022973A1 A semiconductor device comprising a carbon based material for through hole vias
03/04/2010WO2010022970A1 A semiconductor device including stress relaxation gaps for enhancing chip package interaction stability
03/04/2010WO2010022636A1 Radiating device for lamp and led lamp
03/04/2010WO2010008689A3 Embedded die package and process flow using a pre-molded carrier
03/04/2010WO2009153129A3 Method for the manufacture of an electronic assembly
03/04/2010WO2009148768A3 Foil based semiconductor package
03/04/2010WO2009146695A3 Heat transfer device comprising a semiconductor component and connecting device for the operation thereof
03/04/2010WO2009140244A3 Packaged electronic devices with face-up die having through substrate via connection to leads and die pad
03/04/2010WO2009129334A3 Three-dimensional semiconductor device structures and methods
03/04/2010US20100057264 Method and apparatus for controlling the compounding of a pharmaceutical admixture
03/04/2010US20100056891 Analyte Monitoring Device And Methods Of Use
03/04/2010US20100056890 Analyte Monitoring Device And Methods Of Use
03/04/2010US20100056889 Analyte Monitoring Device And Methods Of Use
03/04/2010US20100055840 Electronic packaging structure and a manufacturing method thereof
03/04/2010US20100053923 Semiconductor device and circuit board assembly
03/04/2010US20100053616 Alignment mark and method of getting position reference for wafer
03/04/2010US20100052869 Combination full-duplex and half-duplex electronic identification tag
03/04/2010US20100052192 Electronic element wafer module and method for manufacturing electronic element wafer module, electronic element module and method for manufacturing electronic element module, and electronic information device
03/04/2010US20100052191 Metrology Mark with Elements Arranged in a Matrix, Method of Manufacturing Same and Alignment Method
03/04/2010US20100052190 Semiconductor device
03/04/2010US20100052189 Electronic component mounting structure and method for manufacturing the same
03/04/2010US20100052188 Semiconductor Chip with Solder Joint Protection Ring
03/04/2010US20100052187 Stacked semiconductor package and method for fabricating the same
03/04/2010US20100052186 Stacked type chip package structure
03/04/2010US20100052185 Semiconductor device and method for fabricating the same
03/04/2010US20100052184 Interconnects with improved tddb
03/04/2010US20100052183 Microfeature workpiece substrates having through-substrate vias, and associated methods of formation
03/04/2010US20100052182 Semiconductor device and method of producing the same
03/04/2010US20100052181 Using a cap layer in metallization systems of semiconductor devices as a cmp and etch stop layer
03/04/2010US20100052180 Semiconductor Device for Low-Power Applications and a Method of Manufacturing Thereof
03/04/2010US20100052179 Mems structure and method for fabricating the same
03/04/2010US20100052178 Semiconductor Device and Method for Making Same
03/04/2010US20100052177 Method for manufacturing a crossbar circuit device
03/04/2010US20100052176 Semiconductor device and manufacturing method thereof
03/04/2010US20100052175 Reducing leakage and dielectric breakdown in dielectric materials of metallization systems of semiconductor devices by forming recesses
03/04/2010US20100052174 Copper pad for copper wire bonding
03/04/2010US20100052173 Semiconductor device and semiconductor device manufacturing method
03/04/2010US20100052172 Method of fabricating copper damascene and dual damascene interconnect wiring
03/04/2010US20100052171 Cu wire in semiconductor device and production method thereof
03/04/2010US20100052170 Metal line of semiconductor device having a diffusion barrier and method for forming the same
03/04/2010US20100052169 Metal line of semiconductor device having a diffusion barrier and method for forming the same
03/04/2010US20100052168 Metal line having a multi-layered diffusion layer in a semiconductor device and method for forming the same
03/04/2010US20100052167 METAL LINE HAVING A MOxSiy/Mo DIFFUSION BARRIER OF SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME
03/04/2010US20100052166 Sandwiched metal structure silicidation for enhanced contact
03/04/2010US20100052165 Semiconductor device including columnar electrodes having planar size greater than that of connection pad portion of wiring line, and manufacturing method thereof
03/04/2010US20100052164 Wafer level package and method of manufacturing the same
03/04/2010US20100052163 Semiconductor device, method of manufacturing same and method of repairing same
03/04/2010US20100052162 Semiconductor device and method for fabricating semiconductor device
03/04/2010US20100052161 Semiconductor wafer with adhesive protection layer
03/04/2010US20100052160 Bump structure and method for fabricating the same
03/04/2010US20100052159 Methods of forming C4 metal stud bump for fine pitch packaging applications and structures formed thereby
03/04/2010US20100052158 Electronic device and method for coping with electrostatic discharge
03/04/2010US20100052157 Channel for a semiconductor die and methods of formation
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