Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
03/2010
03/11/2010US20100059877 Method for packaging electronic devices and integrated circuits
03/11/2010US20100059876 Electronic component package and method of manufacturing the same
03/11/2010US20100059875 Semiconductor device
03/11/2010US20100059874 Semiconductor chip capable of increased number of pads in limited region and semiconductor package using the same
03/11/2010US20100059873 Ball grid array package stacking system
03/11/2010US20100059872 Adhesive Tape, Connected Structure and Semiconductor Package
03/11/2010US20100059871 Leadframe
03/11/2010US20100059870 Chip package structure
03/11/2010US20100059869 Systems and Methods for Enabling ESD Protection on 3-D Stacked Devices
03/11/2010US20100059868 Electronic device and method for manufacturing structure for electronic device
03/11/2010US20100059867 Integrated circuit chip with seal ring structure
03/11/2010US20100059866 Semiconductor Device and Method of Forming Vertically Offset Bond on Trace Interconnects on Recessed and Raised Bond Fingers
03/11/2010US20100059865 Package with Power and Ground Through Via
03/11/2010US20100059864 Method of manufacturing a semiconductor device including etching to etch stop regions
03/11/2010US20100059863 Stretchable Form of Single Crystal Silicon for High Performance Electronics on Rubber Substrates
03/11/2010US20100059857 Method of fabricating a semiconductor device
03/11/2010US20100059854 Semiconductor Device and Method of Forming an IPD over a High-Resistivity Encapsulant Separated from other IPDS and Baseband Circuit
03/11/2010US20100059835 Apparatus and Method of Wafer Bonding Using Compatible Alloy
03/11/2010US20100059825 Integrated circuit and a method of making an integrated circuit to provide a gate contact over a diffusion region
03/11/2010US20100059824 System and method for i/o esd protection with polysilicon regions fabricated by processes for making core transistors
03/11/2010US20100059823 Resistive device for high-k metal gate technology and method of making
03/11/2010US20100059269 Electrical Equipment Receptacle Cover
03/11/2010US20100059267 Printed circuit board and method of manufacturing the same
03/11/2010US20100059209 Heat dissipating device
03/11/2010DE102009034231A1 Passive Temperaturkompensation von Silizium-Mems-Bauelementen Passive temperature compensation of silicon Mems devices
03/11/2010DE102008046480A1 Verfahren zur Herstellung einer lötbaren LFC-Solarzellenrückseite und aus derartigen LFC-Solarzellen verschaltetes Solarmodul A process for producing a solderable LFC solar cell back and Interconnected LFC from such solar cells solar module
03/11/2010DE102008046188A1 Chip-printed circuit board-arrangement, has passivation layer arranged next to electrical connecting contact, and wire bonding connection with wire connected with contact surface of board by electrically conductive material
03/11/2010DE102008045925A1 Optoelektronisches Bauteil und Verfahren zur Herstellung eines optoelektronischen Bauteils The optoelectronic device and method for producing an optoelectronic component
03/11/2010DE102008041873A1 LTCC-Substratstruktur und Verfahren zur Herstellung derselben LTCC substrate structure and method of manufacturing the same
03/10/2010EP2161748A2 LTCC substrate structure and method for the production thereof
03/10/2010EP2161747A1 Electronic component package and method of manufacturing the same
03/10/2010EP2161746A1 Semiconductor switching devices
03/10/2010EP2161745A1 Stack assemblies containing semiconductor devices
03/10/2010EP2161744A1 Electronic device manufacturing method
03/10/2010EP2161743A1 Semiconductor device
03/10/2010EP2161739A1 Adhesive film and semiconductor device obtained with the same
03/10/2010EP2161726A1 Wiring material and wiring board using the same
03/10/2010EP2161527A1 Process and assembly for flush connecting evaporator sections of juxtaposed heat pipes to a fixing base
03/10/2010EP2161292A1 Epoxy resin composition
03/10/2010EP2161240A2 Carbon nanotube device, method of manufacturing the same, and carbon nanotube transfer body
03/10/2010EP2160770A1 Ultraviolet radiation light emitting diode device
03/10/2010EP2160761A2 Rf transistor packages with internal stability network and methods of forming rf transistor packages with internal stability networks
03/10/2010EP2160760A2 Metal-based photonic device package module and manufacturing method thereof
03/10/2010EP1576614B1 Tamper-resistant packaging and approach
03/10/2010CN201422228Y Radiator section bar
03/10/2010CN201422227Y Radiator section bar
03/10/2010CN201422226Y 散热器组合 Radiator portfolio
03/10/2010CN201422225Y 散热器组合 Radiator portfolio
03/10/2010CN201422224Y Bracing frame fixing structure of radiator
03/10/2010CN201422223Y Combination device of board card and radiator
03/10/2010CN201422221Y Heat dissipating device
03/10/2010CN201422218Y Fastener and heat radiating device and electronic device using the same
03/10/2010CN201421842Y Flexible connection structure for memory module packaging
03/10/2010CN201421841Y Lead frame and packaging part
03/10/2010CN201421840Y Low-stress chip bump package structure
03/10/2010CN201421839Y Heat pipe radiator for IGBT of on-vehicle control device
03/10/2010CN201421838Y Novel island exposed MSOP-EP/TSSOP-EP lead frame structure
03/10/2010CN101669203A Leadframe configuration to enable strip testing of sot-23 packages and the like
03/10/2010CN101669202A Leadframe configuration to enable strip testing of sot-23 packages and the like
03/10/2010CN101667567A Electromagnetism interference isolation device
03/10/2010CN101667566A Gold-coated-sliver base bonding silk thread and manufacture method thereof
03/10/2010CN101667565A Chip and manufacturing method thereof
03/10/2010CN101667564A Semiconductor device and manufacturing method thereof
03/10/2010CN101667563A Semiconductor device and method for manufacturing the same, and semiconductor sealing resin
03/10/2010CN101667562A Novel power module for directly bonding power terminal
03/10/2010CN101667561A Silicon-based vapor-liquid phase separating heat radiation chip and preparation method thereof
03/10/2010CN101667560A Electronic device and method for coping with electrostatic discharge
03/10/2010CN101667549A Device and method for encapsulating with encapsulating material and electronic component fixed on a carrier
03/10/2010CN100593851C Semiconductor device and fabrication method thereof
03/10/2010CN100593850C Semiconductor device, method of forming wiring pattern, and method of generating mask wiring data
03/10/2010CN100593849C Wafer encapsulation construction and wafer carrier for reducing substrate circuit layer
03/10/2010CN100593848C On-sheet ion jetting apparatus
03/10/2010CN100593847C Semiconductor package having structure for warpage prevention
03/09/2010US7675753 Mounting apparatus for heat sink
03/09/2010US7675730 Techniques for detecting wafer charging in a plasma processing system
03/09/2010US7675601 Anisotropic conductive flame and flat panel display using the same, and method for manufacturing the same
03/09/2010US7675371 Electronic circuitry
03/09/2010US7675301 Electronic components with plurality of contoured microelectronic spring contacts
03/09/2010US7675186 IC package with a protective encapsulant and a stiffening encapsulant
03/09/2010US7675185 contains mesophase pitch; cyclic phosphazenes; for semiconductors with narrow distances between pads or wires
03/09/2010US7675184 Semiconductor device
03/09/2010US7675183 Semiconductor device including an insulating film and insulating pillars and manufacturing method of the semiconductor device
03/09/2010US7675182 Die warpage control
03/09/2010US7675181 Planar multi semiconductor chip package and method of manufacturing the same
03/09/2010US7675180 Stacked electronic component package having film-on-wire spacer
03/09/2010US7675179 Device and method to eliminate shorting induced by via to metal misalignment
03/09/2010US7675178 Stacked structure for forming damascene structure
03/09/2010US7675177 Forming copper interconnects with Sn coatings
03/09/2010US7675176 Semiconductor package and module printed circuit board for mounting the same
03/09/2010US7675175 Semiconductor device having isolated pockets of insulation in conductive seal ring
03/09/2010US7675173 Manufacturing semiconductor circuit, corresponding semiconductor circuit, and associated design process
03/09/2010US7675172 Printed circuit board, mounting method of electronic component, and electronic apparatus
03/09/2010US7675171 Semiconductor package and fabricating method thereof
03/09/2010US7675169 Apparatus and method for packaging circuits
03/09/2010US7675168 Integrated circuit with staggered differential wire bond pairs
03/09/2010US7675167 Electronic device package heat sink assembly
03/09/2010US7675166 Integrated circuit package device comprising electrical contacts making solderless and bondless electrical-mechanical connection
03/09/2010US7675165 Mount for a programmable electronic processing device
03/09/2010US7675164 Method and structure for connecting, stacking, and cooling chips on a flexible carrier
03/09/2010US7675163 Carbon nanotubes for active direct and indirect cooling of electronics device
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