Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
09/2014
09/18/2014DE102013202542A1 Substrat zur Herstellung einer LED und Verfahren zu dessen Herstellung Substrate for LED and process for its preparation
09/18/2014DE102013109759A1 Verfahren zum Strukturieren von Vias in einem Chip und Chipstruktur mit Vias Method of patterning of vias in a chip and chip structure with vias
09/18/2014DE102013107705A1 Bildsensorvorrichtung und Verfahren Image sensing apparatus and method
09/18/2014DE102013107635A1 Verbindungsstruktur und Verfahren zur Ausbildung dieser Connection structure and method for forming these
09/18/2014DE102013106965A1 Packaging Mechanismus für Dies mit unterschiedlichen Grössen der Konnektoren Packaging for this mechanism with different sizes of connectors
09/18/2014DE102013106153A1 Zwischenverbindungsstruktur für eine gestapelte Vorrichtung und Verfahren Interconnect structure for a stacked device and method
09/18/2014DE102013105722A1 Verbindungsmetallisierung durch chemische direkte Strukturplattierung und Metallstruktur, die durch dieselbe hergestellt ist Interconnect metallization by chemical direct Strukturplattierung and metal structure which is produced by the same
09/18/2014DE102013105721A1 Halbleitervorrichtung mit einer Nach-Passivierung-Verbindungs-Struktur und Verfahren zu dessen Herstellung A semiconductor device with a post-passivation-link structure and process for its preparation
09/18/2014DE102013104739A1 Metall-Keramik-Substrat sowie Verfahren zum Herstellen eines Metall-Keramik-Substrates A metal-ceramic substrate and method for manufacturing a metal-ceramic substrate
09/18/2014DE102013104464A1 Halbleiterstruktur Semiconductor structure
09/18/2014DE102013103116B3 Leistungshalbleitermodul und Verfahren zur Herstellung eines Leistungshalbleitermoduls The power semiconductor module and method of producing a power semiconductor module
09/18/2014DE102013102714A1 Hochfrequenzdurchführung Radio frequency feedthrough
09/18/2014DE102013102637A1 Metall-Keramik-Substrat sowie Verfahren zum Herstellen eines Metall-Keramik-Substrates A metal-ceramic substrate and method for manufacturing a metal-ceramic substrate
09/18/2014DE102013102541A1 Elektronisches Bauteil, Verfahren zu dessen Herstellung und Leiterplatte mit elektronischem Bauteil An electronic part, method of producing the electronic component and circuit board with
09/18/2014DE102013005114A1 Vorrichtung zum Kühlen eines elektronischen Bauteils auf einer Leiterplatte An apparatus for cooling an electronic component on a circuit board
09/18/2014DE102012018013B4 Spiralförmige, integrierbare Spulen mit zentrischen Anschlüssen in planarer grabenisolierter Siliziumhalbleitertechnologie Spiral, integrated coils with center connections in planar grave insulated silicon semiconductor technology
09/18/2014DE102008054307B4 Halbleitervorrichtung mit Leistungsvorrichtung A semiconductor device having power device
09/18/2014DE102004021054B4 Halbleiterbauelement und Verfahren zu seiner Herstellung Semiconductor device and process for its preparation
09/17/2014EP2779237A2 A chip arrangement and a method for manufacturing a chip arrangement
09/17/2014EP2779236A2 Magnetic core inductor (MCI) structures for integrated voltage regulators
09/17/2014EP2779235A2 Power Quad Flat No-Lead (PQFN) package having control and driver circuits
09/17/2014EP2779234A2 Leadframe panel with grooves in the connection bars and method of using the same
09/17/2014EP2779233A2 Control and driver circuits on a Power Quad Flat No-Lead (PQFN) leadframe
09/17/2014EP2779232A2 Semiconductor device with a chip bonded to a lead frame with a sintered Ag layer, wherein a resin fillet covers the sintered Ag layer and a part of a side surface of the chip and wherein chip electrodes are bonded to leads, as well as method of manufacturing the same
09/17/2014EP2779231A2 Power overlay structure and method of making same
09/17/2014EP2779230A2 Power overlay structure and method of making same
09/17/2014EP2779229A2 Advanced cooling for power module switches
09/17/2014EP2779228A2 Semiconductor package having an over-temperature protection circuit utilizing multiple temperature threshold values
09/17/2014EP2779227A2 Semiconductor package having multi-phase power inverter with internal temperature sensor
09/17/2014EP2779226A1 Apparatus for electronic assembly with improved interconnect and associated methods
09/17/2014EP2778696A2 Direct injection phase change temperature control system
09/17/2014EP2778590A2 Two-phase cooling system
09/17/2014EP2778576A2 System for cooling electronic components
09/17/2014EP2777826A2 Liquid dispensing syringe
09/17/2014EP2777073A1 Power module cooling
09/17/2014EP2777072A1 Electronic module for a control unit
09/17/2014EP2777071A1 Low-k dielectric protection spacer for patterning through substrate vias through a low-k wiring layer
09/16/2014US8839176 Semiconductor integrated circuit and pattern layouting method for the same
09/16/2014US8839161 Semiconductor device
09/16/2014US8838885 Solid state drive packages and related methods and systems
09/16/2014US8837212 Electronic devices including two or more substrates electrically connected together and methods of forming such electronic devices
09/16/2014US8837168 Electronic package structure
09/16/2014US8837164 Substrate for mounting device and package for housing device employing the same
09/16/2014US8837160 High-dielectric sheet, a printed circuit board having the high-dielectric sheet and production methods thereof
09/16/2014US8837154 System with stabilized heatsink
09/16/2014US8837153 Power electronic device having high heat dissipation and stability
09/16/2014US8837150 Electronic device for switching currents and method for producing the same
09/16/2014US8837149 Electronic component and method of manufacturing electronic component
09/16/2014US8837144 Locking assembly for electronic tablet and other devices
09/16/2014US8837139 Flat heat pipe radiator and application thereof
09/16/2014US8836443 Integrated circuits with configurable inductors
09/16/2014US8836418 High frequency semiconductor switch
09/16/2014US8836395 Apparatuses including scalable drivers and methods
09/16/2014US8836150 Semiconductor device
09/16/2014US8836149 Hybrid substrates, semiconductor packages including the same and methods for fabricating semiconductor packages
09/16/2014US8836148 Interposer for stacked semiconductor devices
09/16/2014US8836147 Bonding structure of multilayer copper bonding wire
09/16/2014US8836146 Chip package and method for fabricating the same
09/16/2014US8836145 Power semiconductor device with reduced contact resistance
09/16/2014US8836144 Wafer level package structure
09/16/2014US8836143 Chip package with coplanarity controlling feature
09/16/2014US8836142 Semiconductor devices
09/16/2014US8836141 Conductor layout technique to reduce stress-induced void formations
09/16/2014US8836140 Three-dimensional vertically interconnected structure
09/16/2014US8836139 CD control
09/16/2014US8836138 Wiring substrate and semiconductor package
09/16/2014US8836137 Method for creating a 3D stacked multichip module
09/16/2014US8836136 Package-on-package assembly with wire bond vias
09/16/2014US8836135 Semiconductor device with interconnection connecting to a via
09/16/2014US8836134 Semiconductor stacked package and method of fabricating the same
09/16/2014US8836133 Chip-level humidity protection
09/16/2014US8836132 Vertical mount package and wafer level packaging therefor
09/16/2014US8836131 Semiconductor module with edge termination and process for its fabrication
09/16/2014US8836130 Light emitting semiconductor element bonded to a base by a silver coating
09/16/2014US8836129 Plug structure
09/16/2014US8836128 Forming fence conductors in an integrated circuit
09/16/2014US8836127 Interconnect with flexible dielectric layer
09/16/2014US8836126 Semiconductor device having insulating layers containing oxygen and a barrier layer containing manganese
09/16/2014US8836125 Flexible electronic devices and related methods
09/16/2014US8836124 Fuse and integrated conductor
09/16/2014US8836123 Methods for discretized formation of masking and capping layers on a substrate
09/16/2014US8836122 Semiconductor device having copper wiring with increased migration resistance
09/16/2014US8836121 Circuit board with twinned CU circuit layer and method for manufacturing the same
09/16/2014US8836120 Semiconductor device with a layer including niobium, and/or tantalum overlying a contact pad or a metal layer
09/16/2014US8836119 Semiconductor device
09/16/2014US8836118 Electronic device packages including bump buffer spring pads and methods of manufacturing the same
09/16/2014US8836117 Electronic device having a contact recess and related methods
09/16/2014US8836116 Wafer level packaging of micro-electro-mechanical systems (MEMS) and complementary metal-oxide-semiconductor (CMOS) substrates
09/16/2014US8836115 Stacked inverted flip chip package and fabrication method
09/16/2014US8836114 Semiconductor device and method of forming Fo-WLCSP having conductive layers and conductive vias separated by polymer layers
09/16/2014US8836113 Electronic module
09/16/2014US8836112 Semiconductor package for high power devices
09/16/2014US8836111 Semiconductor integrated device assembly and related manufacturing process
09/16/2014US8836110 Heat spreader for use within a packaged semiconductor device
09/16/2014US8836109 Semiconductor device and method of manufacturing a semiconductor device
09/16/2014US8836108 Circuit board structure and package structure
09/16/2014US8836107 High pin count, small SON/QFN packages having heat-dissipating pad
09/16/2014US8836106 Semiconductor device
09/16/2014US8836105 Semiconductor device package with cap element
09/16/2014US8836104 Apparatus for chip thermal stress relief
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