Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
03/2010
03/16/2010US7679195 PAD structure and method of testing
03/16/2010US7679194 Method of fabricating semiconductor memory device and semiconductor memory device driver
03/16/2010US7679193 Use of AIN as cooper passivation layer and thermal conductor
03/16/2010US7679192 Semiconductor device including cover layer
03/16/2010US7679191 Polysilicon film with increased roughness
03/16/2010US7679190 Raised solder-mask-defined (SMD) solder ball pads for a laminate electronic circuit board
03/16/2010US7679189 Display device and manufacturing method of the same
03/16/2010US7679188 Semiconductor device having a bump formed over an electrode pad
03/16/2010US7679187 Bonding pad structure for back illuminated optoelectronic device and fabricating method thereof
03/16/2010US7679186 Piezolectric micro electro-mechanical system switch, array of the switches, and method of fabricating the same
03/16/2010US7679185 ductile layer absorbs stress between flange and semiconductor device mounted on flange and can substantially reduce stress applied to semiconductor device; provides combination of copper flange and polymeric dielectric with TCE close to copper which results in low stress structure of improved reliability
03/16/2010US7679184 Semiconductor device having high cooling efficiency and method for manufacturing the same
03/16/2010US7679183 Electronic cooling device and fabrication method thereof
03/16/2010US7679182 Power module and motor integrated control unit
03/16/2010US7679181 Semiconductor device
03/16/2010US7679180 Bond pad design to minimize dielectric cracking
03/16/2010US7679179 Castellation wafer level packaging of integrated circuit chips
03/16/2010US7679178 Semiconductor package on which a semiconductor device can be stacked and fabrication method thereof
03/16/2010US7679177 Integrated circuit packaging system with passive components
03/16/2010US7679176 Semiconductor device and electronic control unit using the same
03/16/2010US7679175 Semiconductor device including substrate and upper plate having reduced warpage
03/16/2010US7679174 Semiconductor device and memory card using the same
03/16/2010US7679173 Semiconductor device including a DC-DC converter
03/16/2010US7679172 Semiconductor package without chip carrier and fabrication method thereof
03/16/2010US7679171 Sensor isolation system
03/16/2010US7679170 Electronic apparatus with wiring plates fixed directly to columns to space wiring circuit from base
03/16/2010US7679169 Stacked integrated circuit leadframe package system
03/16/2010US7679168 Printed circuit board with differential pair arrangement
03/16/2010US7679167 Electronic assembly for image sensor device and fabrication method thereof
03/16/2010US7679162 Integrated current sensor package
03/16/2010US7679161 Semiconductor device comprising fuse sections
03/16/2010US7679153 Sealed surface acoustic wave element package
03/16/2010US7679145 Transistor performance enhancement using engineered strains
03/16/2010US7679143 Semiconductor device having MOS transistor and protection diode and method for designing the same
03/16/2010US7679136 Semiconductor device and manufacturing method of the same
03/16/2010US7679123 Integrated circuit devices including a capacitor
03/16/2010US7679109 Semiconductor device, layout design method thereof, and layout design device using the same
03/16/2010US7679083 Semiconductor integrated test structures for electron beam inspection of semiconductor wafers
03/16/2010US7679030 Energy-efficient, laser-based method and system for processing target material
03/16/2010US7678706 Method of manufacturing a semiconductor device
03/16/2010US7678695 Circuit substrate and method for fabricating the same
03/16/2010US7678691 Method of making a semiconductor device having improved contacts
03/16/2010US7678684 Semiconductor integrated circuit device
03/16/2010US7678681 Electronic component built-in substrate and method of manufacturing the same
03/16/2010US7678680 Semiconductor device with reduced contact resistance
03/16/2010US7678642 Method for manufacturing phase change memory device using a patterning process
03/16/2010US7678639 Inductor formed in an integrated circuit
03/16/2010US7678615 Semiconductor device with gel-type thermal interface material
03/16/2010US7678613 Integrated circuit edge protection method and apparatus
03/16/2010US7678611 Spacer die structure and method for attaching
03/16/2010US7678289 Metrology structure and methods
03/16/2010US7678211 Device and method for joining substrates
03/16/2010US7676911 Method to reduce module inductance
03/11/2010WO2010027890A2 Mainboard assembly including a package overlying a die directly attached to the mainboard
03/11/2010WO2010027658A2 Methods and apparatus for integrated circuit having integrated energy storage device
03/11/2010WO2010027231A2 Lead frame and manufacturing method thereof
03/11/2010WO2010027105A1 Curable organopolysiloxane composition, optical semiconductor element sealant, and optical semiconductor device
03/11/2010WO2010026992A1 Silicone resin composition, metal oxide particle, and process for producing same
03/11/2010WO2010026990A1 High-frequency circuit package, and sensor module
03/11/2010WO2010026981A1 Liquid for protecting copper wiring surface and method for manufacturing semiconductor circuit element
03/11/2010WO2010026956A1 Semiconductor device and manufacturing method thereof
03/11/2010WO2010026831A1 Magnetic memory element and storage device using same
03/11/2010WO2010026798A1 Oxide thin film transistor and method for manufacturing the same
03/11/2010WO2010026714A1 Siloxane compound, curable resin composition, cured object obtained therefrom, and photosemiconductor element
03/11/2010WO2010026486A2 Heat pipe and electronic device
03/11/2010WO2010025971A1 Lead frame structured in the die pad region, micro-structured component arrangement comprising said lead frame, and method for the production thereof
03/11/2010WO2010025599A1 Heat radiating device of led spotlight
03/11/2010WO2010025596A1 Heat sink
03/11/2010WO2010008673A3 Methods and systems for packaging integrated circuits with thin metal contacts
03/11/2010WO2009154761A9 Stacking of wafer-level chip scale packages having edge contacts
03/11/2010WO2009149463A3 Systems, devices, and methods for semiconductor device temperature management
03/11/2010WO2009107143A3 Line edge roughness measuring technique and test structure
03/11/2010WO2008137001A3 Semiconductor package having dimpled plate interconnections
03/11/2010US20100062568 Electronic module with a conductive-pattern layer and a method of manufacturing same
03/11/2010US20100062552 Silicone resin composition for encapsulating luminescent element and process for producing optical-semiconductor electronic part with the same through potting
03/11/2010US20100062548 Photo key and method of fabricating semiconductor device using the photo key
03/11/2010US20100061056 Mainboard assembly including a package overlying a die directly attached to the mainboard
03/11/2010US20100060302 Semiconductor device and method for measuring analog channel resistance thereof
03/11/2010US20100059899 Ic card and manufacturing method thereof
03/11/2010US20100059898 Signal delivery in stacked device
03/11/2010US20100059897 Interconnect structures for stacked dies, including penetrating structures for through-silicon vias, and associated systems and methods
03/11/2010US20100059896 Coplaner waveguide and fabrication method thereof
03/11/2010US20100059895 Semiconductor device having an interlayer insulating film wiring laminated structure section and method of fabricating the same
03/11/2010US20100059894 Method of manufacturing openings in a substrate, a via in substrate, and a semiconductor device comprising such a via
03/11/2010US20100059893 Synergy Effect of Alloying Materials in Interconnect Structures
03/11/2010US20100059892 Production method of semiconductor device, production method of display device, semiconductor device, production method of semiconductor element, and semiconductor element
03/11/2010US20100059891 Alternative to desmear for build-up roughening and copper adhesion promotion
03/11/2010US20100059890 METAL LINE OF SEMICONDUCTOR DEVICE HAVING A DIFFUSION BARRIER INCLUDING CRxBy AND METHOD FOR FORMING THE SAME
03/11/2010US20100059889 Adhesion of diffusion barrier on copper-containing interconnect element
03/11/2010US20100059888 Mask ROM and method of fabricating the same
03/11/2010US20100059887 Semiconductor device having insulating film with surface modification layer and method for manufacturing the same
03/11/2010US20100059886 Carrier structure of SoC with custom interface
03/11/2010US20100059885 Integrated circuit package system with redistribution layer
03/11/2010US20100059884 Leadless semiconductor chip carrier system
03/11/2010US20100059883 Method of forming ball bond
03/11/2010US20100059882 Semiconductor device
03/11/2010US20100059881 Semiconductor package and method of manufacturing the same
03/11/2010US20100059880 Semiconductor module and an electronic system including the same
03/11/2010US20100059879 Power Amplifier Assembly
03/11/2010US20100059878 Stack Assemblies Containing Semiconductor Devices
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