Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
03/2010
03/17/2010CN201426229Y Heat radiation and electromagnetic interference preventing module
03/17/2010CN201426228Y Radiating structure with heat-conducting and heat-radiating printing ink
03/17/2010CN201426227Y Fixed structure of heat radiator
03/17/2010CN201426215Y Heat dissipating structure of circuit board
03/17/2010CN201425942Y Thin-film transistor structure
03/17/2010CN201425940Y Combination bracket
03/17/2010CN201425939Y Flip chip IC package structure
03/17/2010CN201425938Y Improved big power rectifier bridge device
03/17/2010CN201425290Y Heat radiation module and light source device applying same
03/17/2010CN201425289Y LED lamp heat-radiation module
03/17/2010CN201425288Y Heat dissipating device and lighting equipment
03/17/2010CN201425287Y Heat radiating body for LED lamp
03/17/2010CN201425286Y Heat dissipation structure of LED lamp
03/17/2010CN201425285Y Energy-saving LED street lamp with novel heat-radiating structure
03/17/2010CN201425284Y Embedded radiator with a new structure and light emitting diode and light emitting diode light
03/17/2010CN201425234Y LED street lamp
03/17/2010CN201425207Y Luminescent diode lighting device
03/17/2010CN201425206Y Luminescent diode module for greenhouse plant growth
03/17/2010CN201425201Y LED lamp and closed type radiating device thereof
03/17/2010CN201425181Y High-power LED light source lamp
03/17/2010CN201425176Y LED daylight lamp device
03/17/2010CN101675519A Multi-layer circuit substrate and method having improved transmission line integrity and increased routing density
03/17/2010CN101675518A Power lead-on-chip ball grid array package
03/17/2010CN101675517A Active control of time-varying spatial temperature distribution
03/17/2010CN101675516A Chips having rear contacts connected by through vias to front contacts
03/17/2010CN101675515A Circuit and method for interconnecting stacked integrated circuit dies
03/17/2010CN101675090A Adamantane derivative, method for producing the same, resin composition containing the adamantane derivative and use thereof
03/17/2010CN101674718A Radiation device
03/17/2010CN101674717A Radiation device
03/17/2010CN101674716A Heat-pipe type radiator and manufacturing method thereof
03/17/2010CN101674715A Device and method for radiating
03/17/2010CN101674705A Flexible wiring substrate and preparing method, flexible wiring substrate of distribution chip and electronic apparatus
03/17/2010CN101673999A Reduction of semiconductor stresses
03/17/2010CN101673802A Integrated metal matrix aluminium nitride film substrate, high-power LED module of heat pipe and manufacturing method thereof
03/17/2010CN101673790A Light-emitting diode and manufacturing method thereof
03/17/2010CN101673789A Light emitting diode package substrate structure, manufacturing method thereof and packaging structure thereof
03/17/2010CN101673771A Capacitative element
03/17/2010CN101673761A Semiconductor device and semiconductor subassembly
03/17/2010CN101673758A 显示器件及其制造方法 A display device and manufacturing method thereof
03/17/2010CN101673754A 半导体器件 Semiconductor devices
03/17/2010CN101673750A Image sensor and method of manufacturing the same
03/17/2010CN101673748A Image sensor and method of manufacturing the same
03/17/2010CN101673744A Transistor structure, dynamic random access memory structure and manufacturing method thereof
03/17/2010CN101673742A 半导体集成电路装置 The semiconductor integrated circuit device
03/17/2010CN101673738A Semiconductor device
03/17/2010CN101673735A A design structure of mixed polysilicon distance unit under design rule of default polysilicon distance unit and system
03/17/2010CN101673734A Capacitor structure
03/17/2010CN101673733A Integrated circuit chip and seal ring structure of same
03/17/2010CN101673731A Double-module device
03/17/2010CN101673730A Stack assemblies containing semiconductor devices
03/17/2010CN101673729A 半导体器件 Semiconductor devices
03/17/2010CN101673728A Model and method for measuring resistance of contact holes or through holes in bipolar transistor components
03/17/2010CN101673727A Structure for interconnecting medium with low dielectric constant and copper and integration method
03/17/2010CN101673726A Contact of semiconductor device and manufacturing method thereof
03/17/2010CN101673725A Flexible circuit board
03/17/2010CN101673724A Interconnecting substrate and semiconductor device
03/17/2010CN101673723A A semiconductor device package using discrete conductive layer to re-select bonding line path
03/17/2010CN101673722A 导线架 Leadframe
03/17/2010CN101673721A High-power integrated circuit lead frame
03/17/2010CN101673720A Window type semiconductor packaging structure capable of avoiding stripping in mold flow inlet
03/17/2010CN101673719A A cbd contact resistance introducing a metal layer between sin and tin to improve p-tsv
03/17/2010CN101673718A Semiconductor device, method of manufacturing thereof, circuit board and electronic apparatus
03/17/2010CN101673717A Semiconductor device and method of manufacturing thereof
03/17/2010CN101673716A Silicone laminated substrate, method of producing same, silicone resin composition, and led device
03/17/2010CN101673711A Semiconductor integrated circuit device and a method of manufacturing the same
03/17/2010CN101673706A Materials for adhesion enhancement of copper film on diffusion barriers
03/17/2010CN101673689A Integrated circuit packaging method and circuit device capable of reducing power supply voltage drop of chip
03/17/2010CN101673688A Method of fabricating multi-layered substrate and the substrate thereof
03/17/2010CN101673679A Thinned semiconductor wafer and method of thinning a semiconductor wafer
03/17/2010CN101673664A Method for generating silicon wafer, silicon crystal column and semiconductor chip
03/17/2010CN101673507A Scanning system of organic light emission display
03/17/2010CN101672462A LED radiator
03/17/2010CN101672461A LED heat abstractor
03/17/2010CN101672460A LED substrate radiation structure and LED lamp tube having same
03/17/2010CN101672432A Light-emitting diode (LED) lamp
03/17/2010CN101671816A Method for depositing si-containing film, insulator film, and semiconductor device
03/17/2010CN100594624C Method for forming luminous device wiring and apparatus for fixing luminous device
03/17/2010CN100594618C Semiconductor device and method for manufacturing the same
03/17/2010CN100594610C Electrostatic discharge protecting circuit capable of saving chip area
03/17/2010CN100594608C High-density circuit module
03/17/2010CN100594607C Built-in type multifunctional conformity type structure and fabricating method thereof
03/17/2010CN100594606C Circuit device and its manufacturing method
03/17/2010CN100594605C Semiconductor device
03/17/2010CN100594604C 抗磨损和晶须的涂覆系统和方法 Abrasion resistant coating systems and methods and whiskers
03/17/2010CN100594603C Semiconductor device and fabrication process thereof
03/17/2010CN100594602C Semiconductor device and manufacturing process thereof
03/17/2010CN100594601C Housing for containing solid state imaging assemble and solid state imaging device
03/17/2010CN100594595C Method and chip for integrating micro electromechanical system device and integrated circuit
03/17/2010CN100594535C Display apparatus, display apparatus driving method therefor and electronic equipment
03/17/2010CN100594329C Evaporator, loop heat pipe module and heating apparatus
03/17/2010CN100594327C High power LED electro-optic assembly
03/16/2010US7681103 Reliable generation of a device-specific value
03/16/2010US7679919 Heat sink and electronic apparatus using the same
03/16/2010US7679917 Electronic assembly cooling
03/16/2010US7679914 Electronic controller
03/16/2010US7679202 Semiconductor device having symbol pattern utilized as identification sign
03/16/2010US7679201 Device package
03/16/2010US7679200 Semiconductor chip with crack stop
03/16/2010US7679199 Semiconductor apparatus
03/16/2010US7679197 Power semiconductor device and method for producing it
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