Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
03/2010
03/23/2010US7682918 ESD protection for semiconductor products
03/23/2010US7682877 Substrate based unmolded package
03/23/2010US7682873 Semiconductor multi-package module having package stacked over die-down flip chip ball grid array package and having wire bond interconnect between stacked packages
03/23/2010US7682871 Method for forming a joint
03/23/2010US7682847 Method for sorting integrated circuit devices
03/23/2010US7682846 Single and double-gate pseudo-FET devices for semiconductor materials evaluation
03/23/2010US7682757 first device pattern including a line and a space alternately arrayed on a fixed pitch having regular intervals in a first direction; second device pattern having a pattern width an odd-number times larger than the regular intervals of the fixed pitch, an auxiliary pattern disposed on the fixed pitch
03/23/2010US7682701 Composition for forming silica based coating film, silica based coating film and method for preparation thereof, and electronic parts
03/23/2010US7682690 Heat conductive interfaces
03/23/2010US7681309 Method for interconnecting an integrated circuit multiple die assembly
03/23/2010US7681308 Fabrication method of semiconductor integrated circuit device
03/23/2010CA2344319C Cold plate utilizing fin with evaporating refrigerant
03/18/2010WO2010030968A2 Method and apparatus for enhancing the triggering of an electrostatic discharge protection device
03/18/2010WO2010030962A2 Structures and methods for wafer packages, and probes
03/18/2010WO2010030804A1 Signal delivery in stacked device
03/18/2010WO2010030799A1 Stacked device identification assignment
03/18/2010WO2010030532A1 Systems and methods for enabling esd protection on 3-d stacked devices
03/18/2010WO2010030400A1 Regenerative building block and diode bridge rectifier and methods
03/18/2010WO2010030398A1 Package with power and ground through via
03/18/2010WO2010030307A1 A heat radiator composed of a combination of a graphite-metal complex and an aluminum extruded material
03/18/2010WO2010029819A1 Semiconductor device and method for manufacturing same
03/18/2010WO2010029726A1 Semiconductor device and resin composition used in semiconductor device
03/18/2010WO2010029659A1 Semiconductor device and method for manufacturing the same
03/18/2010WO2010029460A1 Contacting a device with a conductor
03/18/2010WO2010029233A1 Method for making contactless portable objects
03/18/2010WO2010028896A1 Method for independent counterattack in response to one or more physical attacks, and related device
03/18/2010WO2010028885A1 Electronic component and method for the production thereof
03/18/2010WO2010028880A1 Semiconductor arrangement and method for producing a semiconductor arrangement
03/18/2010WO2009150087A3 System support for electronic components and method for production thereof
03/18/2010WO2009143532A3 Lead frame thermoplastic solar cell receiver
03/18/2010WO2009024913A4 Identification of devices using physically unclonable functions
03/18/2010WO2009020572A8 Stack packages using reconstituted wafers
03/18/2010US20100069729 Analyte Monitoring Device And Methods Of Use
03/18/2010US20100068852 Method of Manufacturing A Semiconductor Device
03/18/2010US20100068851 Castellation wafer level packaging of integrated circuit chips
03/18/2010US20100068850 Semiconductor device and a method of manufacturing the same
03/18/2010US20100068844 Microcap Wafer Bonding Method and Apparatus
03/18/2010US20100067207 Semiconductor package and method using isolated vss plane to accommadate high speed circuitry ground isolation
03/18/2010US20100066399 Miniature fluid-cooled heat sink with integral heater
03/18/2010US20100065971 Laser assisted chemical vapor deposition for backside die marking and structures formed thereby
03/18/2010US20100065970 Microfeature workpieces having conductive interconnect structures formed by chemically reactive processes, and associated systems and methods
03/18/2010US20100065969 Integrated circuit device
03/18/2010US20100065968 Electronic apparatus interconnect routing
03/18/2010US20100065967 Copper interconnection, method for forming copper interconnection structure, and semiconductor device
03/18/2010US20100065966 Solder Joint Flip Chip Interconnection
03/18/2010US20100065965 Methods of forming solder connections and structure thereof
03/18/2010US20100065964 Copper-topped interconnect structure that has thin and thick copper traces and method of forming the copper-topped interconnect structure
03/18/2010US20100065963 Method of wirebonding that utilizes a gas flow within a capillary from which a wire is played out
03/18/2010US20100065962 Power semiconductor module
03/18/2010US20100065961 Electronic Device and Method of Manufacturing Same
03/18/2010US20100065960 Resin sheet, circuit device and method of manufacturing the same
03/18/2010US20100065959 Semiconductor package and method of manufacturing the same, and semiconductor device
03/18/2010US20100065958 Pad redistribution chip for compactness, method of manufacturing the same, and stacked package using the same
03/18/2010US20100065957 Package substrate, semiconductor package having the package substrate
03/18/2010US20100065956 Packaging structure, packaging method and photosensitive device
03/18/2010US20100065955 Integrated Circuit Devices with Stacked Package Interposers
03/18/2010US20100065954 Bond pad structures and semiconductor devices using the same
03/18/2010US20100065952 Semiconductor Device
03/18/2010US20100065951 Method of Manufacturing A Semiconductor Device
03/18/2010US20100065950 Leaded semiconductor power module with direct bonding and double sided cooling
03/18/2010US20100065949 Stacked Semiconductor Chips with Through Substrate Vias
03/18/2010US20100065948 Semiconductor Device and Method of Forming a Fan-In Package-on-Package Structure Using Through-Silicon Vias
03/18/2010US20100065947 Method for evaluating impurity distribution under gate electrode without damaging silicon substrate
03/18/2010US20100065900 Semiconductor device including resistance element
03/18/2010US20100065891 Compact Memory Arrays
03/18/2010US20100065883 Process for making contact with and housing integrated circuits
03/18/2010US20100065879 Optoelectronic Device with Housing Body
03/18/2010US20100065846 System in package and socket
03/18/2010DE112008000994T5 Aktive Steuerung einer zeitlich veränderlichen räumlichen Temperaturverteilung Active control of a time-varying spatial temperature distribution
03/18/2010DE102008046734A1 Verfahren und Schaltungsanordnung zur Erhöhung der Spannungsfestigkeit von Metalloxidtransistoren bei niedrigen Temperaturen Method and circuit arrangement for increasing the dielectric strength of Metalloxidtransistoren at low temperatures
03/18/2010DE102008045615A1 Power semiconductor module, has electronic components arranged on surface of substrate, and contact elements arranged in channel and pressed on surface of substrate by elastic spring to electrically contact surface of substrate
03/18/2010DE102008042107A1 Elektronisches Bauteil sowie Verfahren zu seiner Herstellung Electronic component as well as methods for its preparation
03/18/2010DE102008042106A1 Verkapselung, MEMS sowie Verfahren zum Verkapseln Encapsulation, MEMS and method for encapsulating
03/18/2010DE102008042035A1 Halbleiteranordnung sowie Verfahren zum Herstellen einer Halbleiteranordnung A semiconductor device and method of manufacturing a semiconductor device
03/18/2010DE102008029829A1 Vertically-upwards contacted semiconductor, has semiconductor provided on substrate and electric contact, where part of contact is located in seal-type molding material around semiconductor
03/18/2010DE102005008817B4 Optischer Halbleiter und zugehörige Kontaktierungseinrichtung Optical semiconductor and related contacting
03/18/2010CA2736983A1 Semiconductor device, and resin composition used for semiconductor device
03/18/2010CA2735689A1 Systems and methods for enabling esd protection on 3-d stacked devices
03/18/2010CA2678273A1 Method for encapsulating an electronic arrangement
03/17/2010EP2164174A2 Method and circuit to increase breakdown voltage of MOS transistors at low temperatures
03/17/2010EP2164100A2 Leaded semiconductor power module with direct bonding and double sided cooling
03/17/2010EP2164099A2 Reduction of semiconductor stresses
03/17/2010EP2164098A1 Semiconductor package and method for manufacturing the same
03/17/2010EP2164053A1 Standalone counterattack method in response to one or several physical aggressions, and associated device
03/17/2010EP2163568A1 Thermosetting composition
03/17/2010EP2163145A1 Electronic module and method for producing an electronic module
03/17/2010EP2162915A1 Method of producing a via in a reconstituted substrate
03/17/2010EP2162914A2 Rf power transistor packages with internal harmonic frequency reduction and methods of forming rf power transistor packages with internal harmonic frequency reduction
03/17/2010EP2162913A1 Method for fabricating a security-protected electronic system, corresponding integrated circuit security protection device and corresponding electronic system
03/17/2010EP2162912A1 Semi-conductor component having a ring-shaped closed contact
03/17/2010EP2162911A1 System and method for passive cooling using a non-metallic wick
03/17/2010EP2162910A1 A thermal interface material
03/17/2010EP2162909A1 Circuit assembly including a metal core substrate and process for preparing the same
03/17/2010EP2162907A1 Device including integrated components imbedded in cavities of a reception semi-conductor plate and corresponding method
03/17/2010EP2162906A1 A method for producing a copper contact
03/17/2010EP2162905A1 Method and apparatus for monitoring vias in a semiconductor fab
03/17/2010EP1700337B1 Process for packaging components and packaged components
03/17/2010EP1393375B1 Contact system
03/17/2010CN201426231Y 电器控制器 Electric Controller
03/17/2010CN201426230Y Radiator supporting frame
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