Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
03/2010
03/24/2010CN101679629A Benzoxazine-formulations with reduced outgassing behaviour
03/24/2010CN101679613A Sealing agent for optical semiconductor element, and optical semiconductor element
03/24/2010CN101679602A Novel flame-retardant epoxy resin, epoxy resin composition essentially containing the epoxy resin, and cured product thereof
03/24/2010CN101679601A Novel phosphorus-containing epoxy resin, epoxy resin composition essentially containing the epoxy resin, and cured product of the epoxy resin composition
03/24/2010CN101679107A Insulation paste for a metal core substrate and electronic device
03/24/2010CN101677503A Heat radiating device
03/24/2010CN101677502A Liquid-cooling heat radiator
03/24/2010CN101677116A Encapsulating method and encapsulating module for LED chip
03/24/2010CN101677102A Semiconductor device with local interconnects
03/24/2010CN101677101A Integrated circuit with decoupling capacity
03/24/2010CN101677098A 集成电路装置 The integrated circuit device
03/24/2010CN101677096A 半导体器件 Semiconductor devices
03/24/2010CN101677095A Luminescence device and semiconductor device
03/24/2010CN101677094A Thin film transistor (TFT) performance testing device, manufacturing method thereof and TFT performance testing method
03/24/2010CN101677093A 半导体器件及其设计方法 Semiconductor device and design method
03/24/2010CN101677092A Chip packaging structure
03/24/2010CN101677091A Device and method for promotion of cooling electronic device rack by using a vapor compression system
03/24/2010CN101677090A Integrated circuit package
03/24/2010CN101677089A Nonvolatile memory device and method of manufacturing the same
03/24/2010CN101677072A Method for encapsulation of an electronic assembly
03/24/2010CN101676658A Cooling apparatus for electronic device
03/24/2010CN101676630A LED bulb
03/24/2010CN101676629A Thermal module with light guide sinks
03/24/2010CN101676626A Lamp
03/24/2010CN101676569A Heat sink and centrifugal fan applied by same
03/24/2010CN100596264C Systems for integrated pump and cold plate
03/24/2010CN100596258C Method for manufacturing a circuit board structure, and a circuit board structure
03/24/2010CN100595944C Hermetic seal for light emitting display device, method, and apparatus
03/24/2010CN100595929C Photoelectric conversion device and image pickup device
03/24/2010CN100595927C Active element array substrate and liquid crystal display panel
03/24/2010CN100595921C High-temperature resisting one-chip integrated micro-sensor structure and system integrating method
03/24/2010CN100595917C 半导体器件 Semiconductor devices
03/24/2010CN100595916C LED chip packaging structure using ceramics as plaque and making method thereof
03/24/2010CN100595915C Guardwall structures for ESD protection
03/24/2010CN100595914C Integrated circuit comprising at least one integrated transmission line
03/24/2010CN100595913C Package for semiconductor devices
03/24/2010CN100595912C Multi-row lead frame
03/24/2010CN100595911C IC device package and its assembling method
03/24/2010CN100595910C Carburetor, various types of devices using carburetor, and method of vaporization
03/24/2010CN100595909C 半导体器件 Semiconductor devices
03/24/2010CN100595905C Electronic device and method of manufacturing the same
03/24/2010CN100595660C Thin film transistor liquid crystal display array basal plate structure and manufacturing method thereof
03/24/2010CN100595644C Transmissible reflective type diode substrate and a method for fabricating the same
03/24/2010CN100594988C Glue solution injector driven by electromagnetic attraction
03/23/2010US7685438 Tamper-resistant packaging and approach using magnetically-set data
03/23/2010US7684764 Duplexer using surface acoustic wave filters and electronic device equipped with the same
03/23/2010US7684190 Heat sink with non-uniform fins and transverse protrusion
03/23/2010US7684187 Heat dissipation device
03/23/2010US7684165 Circuit element and method for protecting a load circuit
03/23/2010US7684040 Overlay mark and application thereof
03/23/2010US7683654 Signal isolators using micro-transformers
03/23/2010US7683651 Test structure for electromigration analysis and related method
03/23/2010US7683607 Connection testing apparatus and method and chip using the same
03/23/2010US7683496 Misalignment detection devices
03/23/2010US7683495 Integrated circuit package substrate having configurable bond pads
03/23/2010US7683494 Press-fit integrated circuit package involving compressed spring contact beams
03/23/2010US7683493 Intermetallic diffusion block device and method of manufacture
03/23/2010US7683491 Semiconductor device
03/23/2010US7683490 Semiconductor integrated circuit and semiconductor device having multilayer interconnection
03/23/2010US7683489 Semiconductor device and fabricating method thereof
03/23/2010US7683488 having an insulating layer structure with a low dielectric constant and excellent barrier properties against copper
03/23/2010US7683487 Structure applied to a photolithographic process
03/23/2010US7683485 Semiconductor device
03/23/2010US7683484 Bump structure, method of forming bump structure, and semiconductor apparatus using the same
03/23/2010US7683483 Electronic device with connection bumps
03/23/2010US7683482 Electronic component unit
03/23/2010US7683481 Bottom electrode for memory device and method of forming the same
03/23/2010US7683480 Methods and apparatus for a reduced inductance wirebond array
03/23/2010US7683479 Semiconductor package involving a rotary lock that connects a package substrate and a separate component
03/23/2010US7683478 Hermetic seal and reliable bonding structures for 3D applications
03/23/2010US7683477 Semiconductor device including semiconductor chips having contact elements
03/23/2010US7683476 Semiconductor package film having reinforcing member and related display module
03/23/2010US7683475 LED chip array module
03/23/2010US7683474 LED assembly with LED position template and method of making an LED assembly using LED position template
03/23/2010US7683473 Semiconductor device, fabrication method therefor, and film fabrication method
03/23/2010US7683472 Power semiconductor modules and method for producing them
03/23/2010US7683471 Display driver integrated circuit device, film, and module
03/23/2010US7683469 Package-on-package system with heat spreader
03/23/2010US7683468 Enabling uniformity of stacking process through bumpers
03/23/2010US7683467 Integrated circuit package system employing structural support
03/23/2010US7683466 Chip packaging overflow proof device
03/23/2010US7683465 Integrated circuit including clip
03/23/2010US7683464 Semiconductor package having dimpled plate interconnections
03/23/2010US7683463 Etched leadframe structure including recesses
03/23/2010US7683462 Chip package structure
03/23/2010US7683461 Integrated circuit leadless package system
03/23/2010US7683460 Module with a shielding and/or heat dissipating element
03/23/2010US7683458 Through-wafer interconnects for photoimager and memory wafers
03/23/2010US7683456 Semiconductor devices, capacitor antifuses, dynamic random access memories, and cell plate bias connection methods
03/23/2010US7683435 Misalignment-tolerant multiplexing/demultiplexing architectures
03/23/2010US7683426 High-voltage lateral DMOS device with diode clamp
03/23/2010US7683419 Semiconductor device having plural DRAM memory cells and a logic circuit and method for manufacturing the same
03/23/2010US7683396 High power light emitting device assembly utilizing ESD protective means sandwiched between dual sub-mounts
03/23/2010US7683386 Semiconductor light emitting device with protrusions to improve external efficiency and crystal growth
03/23/2010US7683383 Light emitting device having circuit protection unit
03/23/2010US7683270 Telecommunications cabinet
03/23/2010US7683269 Thin film device and method for manufacturing the same
03/23/2010US7683268 Semiconductor module with high process accuracy, manufacturing method thereof, and semiconductor device therewith
03/23/2010US7682966 Multistep method of depositing metal seed layers
03/23/2010US7682964 Method of forming a contact hole in a semiconductor device
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