Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
03/2010
03/25/2010US20100072598 Semiconductor package and stacked semiconductor package having the same
03/25/2010US20100072597 Integrated circuit package system for stackable devices
03/25/2010US20100072595 Method and system for sealing a substrate
03/25/2010US20100072594 Low cost die placement
03/25/2010US20100072593 Semiconductor package and method for manufacturing the same
03/25/2010US20100072592 Light source using a light-emitting diode
03/25/2010US20100072591 Integrated circuit package system with anti-peel pad
03/25/2010US20100072590 Stacking Quad Pre-Molded Component Packages, Systems Using the Same, and Methods of Making the Same
03/25/2010US20100072589 Semiconductor package system with die support pad
03/25/2010US20100072588 Substrate structure with die embedded inside and dual build-up layers over both side surfaces and method of the same
03/25/2010US20100072587 Ic socket having heat dissipation function
03/25/2010US20100072586 Quad flat pack in quad flat pack integrated circuit package system
03/25/2010US20100072585 Top exposed clip with window array
03/25/2010US20100072584 Copper alloy sheet for electric and electronic parts
03/25/2010US20100072583 Semiconductor Device and Manufacturing Method of the Same
03/25/2010US20100072582 Semiconductor Device and Method of Electrically Connecting a Shielding Layer to Ground Through a Conductive Via Disposed in Peripheral Region Around Semiconductor Die
03/25/2010US20100072579 Through Substrate Conductors
03/25/2010US20100072578 Semiconductor chip and semiconductor wafer
03/25/2010US20100072571 Effective efuse structure
03/25/2010US20100072570 Semiconductor Device and Method of Forming Embedded Passive Circuit Elements Interconnected to Through Hole Vias
03/25/2010US20100072566 Magnetic Element Utilizing Protective Sidewall Passivation
03/25/2010US20100072564 Semiconductor device and manufacturing method thereof
03/25/2010US20100072558 Method for manufacturing high-stability resistors, such as high ohmic poly resistors, integrated on a semiconductor substrate
03/25/2010US20100072547 Techniques for curvature control in power transistor devices
03/25/2010US20100072509 Lead frame assembly, lead frame and insulating housing combination, and led module having the same
03/25/2010US20100072507 Lead frame, and light emitting diode module having the same
03/25/2010US20100072495 Contact structure and semiconductor device
03/25/2010US20100072473 Tack adhesion testing device
03/25/2010US20100071940 Connecting terminal, semiconductor package using connecting terminal and method for manufacturing semiconductor package
03/25/2010US20100071884 Memory Module Assembly and Heat Sink thereof
03/25/2010DE102009034577A1 Halbleiteranordnung und Herstellungsverfahren A semiconductor device and manufacturing method
03/25/2010DE102009031378A1 Leistungstransistor Power transistor
03/25/2010DE102008047465A1 Semiconductor module, has connection elements passing out from module housing at one of main surfaces at specific distance from one of side surfaces so that elements are partially not surrounded by plastic compound of housing
03/25/2010DE102008042337A1 Kontakt-Kühlsystem Contact cooling system
03/25/2010CA2735666A1 Analyte sensors, testing apparatus and manufacturing methods
03/25/2010CA2669618A1 Minimizing plating stub reflections in a chip package using capacitance
03/24/2010EP2166570A1 Method for encapsulating a semiconductor electronic component
03/24/2010EP2166569A1 Cooling device for a power component
03/24/2010EP2166568A2 An integrated circuit
03/24/2010EP2166037A1 Epoxy resin-forming liquid preparation containing inorganic particle
03/24/2010EP2166036A1 Resin composition, embedding material, insulating layer, and semiconductor device
03/24/2010EP2166031A1 Thermosetting composition
03/24/2010EP2166029A1 Optical semiconductor-sealing composition
03/24/2010EP2165369A1 Anti-fuse memory cell
03/24/2010EP2165363A1 Electric circuit with vertical contacts
03/24/2010EP2165362A1 Low resistance through-wafer via
03/24/2010EP2165361A1 A heat transfer device
03/24/2010EP2165360A1 Method for packaging semiconductors at a wafer level
03/24/2010EP2165346A1 Charge system for destroying chips on a circuit board and method for destroying chips on a circuit board
03/24/2010EP2164822A1 Conductor paste for ceramic substrate and electric circuit
03/24/2010EP1566417B1 Composition for porous film formation, porous film, process for producing the same, interlayer insulation film and semiconductor device
03/24/2010CN201430740Y Fixing device for heat radiator
03/24/2010CN201430140Y Semi-conductor thunder surge suppressor
03/24/2010CN201430139Y In-series thyristor valve section
03/24/2010CN201430138Y Totally enclosed compression-molded rectifying bridge
03/24/2010CN201430137Y Integrated circuit encapsulated with ultra-thin square flat structure with micro-base pins
03/24/2010CN201430136Y Lead frame of square flat integrated circuit
03/24/2010CN201430135Y Two-phase flow cooling head
03/24/2010CN201430134Y Plastically packaged square rectifying device
03/24/2010CN201430133Y Soft board mounting tool for making BGA chips
03/24/2010CN201430132Y Reinforced compression-molding tri-phase rectifying bridge
03/24/2010CN201429295Y Environment-friendly and energy-saving freezing plate
03/24/2010CN201429291Y Environment-friendly and energy-saving cold container
03/24/2010CN101683017A Cooling device
03/24/2010CN101683011A Method for producing multilayer ceramic substrate and composite sheet
03/24/2010CN101683006A Circuit board having built-in electronic parts and its manufacturing method
03/24/2010CN101682990A Electronic assemblies without solder and methods for their manufacture
03/24/2010CN101681963A 紫外线辐射发光二极管装置 UV radiation-emitting diode device
03/24/2010CN101681907A Heat dissipating structure base board, module using heat dissipating structure base board, and method for manufacturing heat dissipating structure base board
03/24/2010CN101681903A Electronic package and manufacturing method thereof
03/24/2010CN101681901A rf-coupled digital isolator
03/24/2010CN101681900A A contact pad and method of forming a contact pad for an integrated circuit
03/24/2010CN101681899A Electronic assemblies without solder and methods for their manufacture
03/24/2010CN101681898A Structure for cooling semiconductor element
03/24/2010CN101681897A Dual side cooling integrated power device package and module and methods of manufacture
03/24/2010CN101681896A Heat spreader for semiconductor device and method for manufacturing the heat spreader
03/24/2010CN101681895A Ic socket having heat dissipation function
03/24/2010CN101681894A Methods and apparatus for multi-stage molding of integrated circuit package
03/24/2010CN101681893A Semiconductor integrated circuit device, structure for mounting semiconductor integrated circuit device and method for manufacturing semiconductor integrated circuit device
03/24/2010CN101681892A Polar hybrid grid array package
03/24/2010CN101681891A Solder precoated substrate, mounting substrate, and solder precoating method
03/24/2010CN101681890A Inhibiting ic device damage from dicing and beol processing
03/24/2010CN101681889A Integrated circuit with flexible planer leads
03/24/2010CN101681888A Electronic part apparatus and process for manufacturing the same
03/24/2010CN101681886A semiconductor assemblies, stacked semiconductor devices, and methods of manufacturing semiconductor assemblies and stacked semiconductor devices
03/24/2010CN101681882A Thin film capacitor, and display and memory cell employing the film capacitor, and mehtods for fabricating the thin film capacitor, the display and the memory cell
03/24/2010CN101681880A Semiconductor device
03/24/2010CN101681875A Methods of forming conductive vias through substrates, and structures and assemblies resulting therefrom
03/24/2010CN101681874A Semiconductor device manufacturing method, semiconductor manufacturing apparatus and storage medium
03/24/2010CN101681853A Mobile binding in an electronic connection
03/24/2010CN101681852A Flip chip with interposer, and methods of making same
03/24/2010CN101681851A connecting microsized devices using ablative films
03/24/2010CN101681846A Underfill anchor structure for an integrated circuit
03/24/2010CN101681835A Thin film and method for manufacturing semiconductor device using the thin film
03/24/2010CN101681834A Process for producing semiconductor device
03/24/2010CN101681691A conductive ink and conductor
03/24/2010CN101681118A Exposure method and electronic device manufacturing method
03/24/2010CN101679758A Resin composition, resin spacer film, and semiconductor device
03/24/2010CN101679721A Resin composition, embedding material, insulating layer, and semiconductor device
03/24/2010CN101679632A Aromatic polyimide and process for production thereof
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