Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
03/2010
03/30/2010US7687897 Mountable integrated circuit package-in-package system with adhesive spacing structures
03/30/2010US7687896 Semiconductor device having a stacked chip structure
03/30/2010US7687895 Workpiece with semiconductor chips and molding, semiconductor device and method for producing a workpiece with semiconductors chips
03/30/2010US7687894 IC chip package having automated tolerance compensation
03/30/2010US7687893 Semiconductor package having leadframe with exposed anchor pads
03/30/2010US7687892 Quad flat package
03/30/2010US7687890 Controlling substrate surface properties via colloidal coatings
03/30/2010US7687883 Electronically programmable antifuse and circuits made therewith
03/30/2010US7687880 Fuse corner pad for an integrated circuit
03/30/2010US7687879 Intermediate semiconductor device structure
03/30/2010US7687877 Interconnect structure with a mushroom-shaped oxide capping layer and method for fabricating same
03/30/2010US7687869 Semiconductor device and method of manufacturing the same
03/30/2010US7687867 Inexpensive method of fabricating a higher performance capacitance density MIMcap integrable into a copper interconnect scheme
03/30/2010US7687863 Selective incorporation of charge for transistor channels
03/30/2010US7687862 Semiconductor devices with active regions of different heights
03/30/2010US7687859 Electronic circuit and method of manufacturing an electronic circuit
03/30/2010US7687855 Semiconductor device having impurity region
03/30/2010US7687839 Scratch protection for direct contact sensors
03/30/2010US7687810 Robust LED structure for substrate lift-off
03/30/2010US7687809 Method for producing a semiconductor integrated circuit including a thin film transistor and a capacitor
03/30/2010US7687803 Semiconductor device and method for manufacturing semiconductor device
03/30/2010US7687796 Method and apparatus for forming an integrated circuit electrode having a reduced contact area
03/30/2010US7687756 Image sensor power distribution
03/30/2010US7687590 Composition for forming silica based coating film, silica based coating film and method for preparation thereof, and electronic parts
03/30/2010US7687406 Methods of eliminating pattern collapse on photoresist patterns
03/30/2010US7687400 Side stacking apparatus and method
03/30/2010US7687386 Method of forming a semiconductor structure having metal migration semiconductor barrier layers
03/30/2010US7687320 Manufacturing method for packaged semiconductor device
03/30/2010US7687319 Semiconductor device and manufacturing method thereof
03/30/2010US7687318 Extended redistribution layers bumped wafer
03/30/2010US7687317 Semiconductor device having tape carrier with bendable region
03/30/2010US7687316 Method for adhering semiconductor devices
03/30/2010US7687315 Stacked integrated circuit package system and method of manufacture therefor
03/30/2010US7687286 Method and apparatus for determining the thickness of a dielectric layer
03/30/2010US7686069 Cooling apparatus having low profile extrusion and method of manufacture therefor
03/30/2010CA2537807C Embedded toroidal inductors
03/30/2010CA2513127C Method for producing microsystems
03/29/2010CA2639902A1 Improved dilute nitride devices
03/25/2010WO2010033902A2 Method and apparatus for attaching chip to a textile
03/25/2010WO2010033668A1 Analyte sensors, testing apparatus and manufacturing methods
03/25/2010WO2010033325A1 Conductive emissions protection
03/25/2010WO2010033322A2 Stacking quad pre-molded component packages, systems using the same, and methods of making the same
03/25/2010WO2010033107A1 Pb-free solder bumps with improved mechanical properties
03/25/2010WO2010032729A1 Method for manufacturing semiconductor device
03/25/2010WO2010032640A1 Display device
03/25/2010WO2010032639A1 Display device and manufacturing method of the same
03/25/2010WO2010032629A1 Semiconductor device
03/25/2010WO2010032616A1 Copper wiring surface protective liquid and method for manufacturing semiconductor circuit
03/25/2010WO2010032602A1 Semiconductor device
03/25/2010WO2010032569A1 Electronic device
03/25/2010WO2010032355A1 Method for manufacturing flexible semiconductor device and multilayer film used therein
03/25/2010WO2010032192A1 Electric component with under-bump metallization and integrated confinement structure
03/25/2010WO2010031845A1 Methods and systems for material bonding
03/25/2010WO2010031715A1 Electrical circuit component carrier
03/25/2010WO2010016975A3 Method of passivating and encapsulating cdte and czt segmented detectors
03/25/2010WO2010008752A3 Gold-tin-indium solder for processing compatibility with lead-free tin-based solder
03/25/2010WO2010002739A3 Flip chip assembly process for ultra thin substrate and package on package assembly
03/25/2010WO2009151676A3 Method and circuit for efuse protection
03/25/2010US20100075463 Method and apparatus for fabricating self-assembling microstructures
03/25/2010US20100075448 Method of making a semiconductor chip assembly with a post/base/cap heat spreader
03/25/2010US20100074038 Memory Dies for Flexible Use and Method for Configuring Memory Dies
03/25/2010US20100073993 Multi-resistive integrated circuit memory
03/25/2010US20100073894 Coreless substrate, method of manufacturing same, and package for microelectronic device incorporating same
03/25/2010US20100073882 Thermally conductive sheet, process for producing the same, and radiator utilizing thermally conductive sheet
03/25/2010US20100073688 Periodic patterns and technique to control misalignment between two layers
03/25/2010US20100072635 Protecting Sidewalls of Semiconductor Chips using Insulation Films
03/25/2010US20100072634 Planar encapsulation and mold cavity package in package system
03/25/2010US20100072633 Semiconductor apparatus with thin semiconductor film
03/25/2010US20100072632 Bond pad structure having dummy plugs and/or patterns formed therearound
03/25/2010US20100072631 Connection by fitting together two soldered inserts
03/25/2010US20100072630 Integrated circuit package system with adhesive segment spacer
03/25/2010US20100072629 Wiring Structure, Semiconductor Device Having the Wiring Structure, and Method for Manufacturing the Semiconductor Device
03/25/2010US20100072628 Semiconductor device
03/25/2010US20100072627 Wafer including intercepting through-vias and method of making intercepting through-vias in a wafer
03/25/2010US20100072626 Wafer level packaged mems integrated circuit
03/25/2010US20100072625 Semiconductor device including power supply pad and trunk wiring which are arranged at the same layer level
03/25/2010US20100072624 Metal interconnection
03/25/2010US20100072623 Semiconductor device with improved contact plugs, and related fabrication methods
03/25/2010US20100072622 Method for forming Barrier Layer and the Related Damascene Structure
03/25/2010US20100072621 Electronic component
03/25/2010US20100072620 Semiconductor Chip with Backside Conductor Structure
03/25/2010US20100072619 Wire bonding structure and manufacturing method thereof
03/25/2010US20100072618 Semiconductor Device and Method of Forming a Wafer Level Package with Bump Interconnection
03/25/2010US20100072617 Multiple die structure and method of forming a connection between first and second dies in same
03/25/2010US20100072616 Method of manufacturing an electronic system
03/25/2010US20100072615 High-Electrical-Current Wafer Level Packaging, High-Electrical-Current WLP Electronic Devices, and Methods of Manufacture Thereof
03/25/2010US20100072614 3-dimensional integrated circuit designing method
03/25/2010US20100072613 Inkjet printed leadframe
03/25/2010US20100072612 Bare die package with displacement constraint
03/25/2010US20100072611 Semiconductor Device and Method for Manufacturing the Same
03/25/2010US20100072610 Process for Precision Placement of Integrated Circuit Overcoat Material
03/25/2010US20100072609 Socket for semiconductor integrated circuit
03/25/2010US20100072608 Semiconductor device
03/25/2010US20100072607 Tab package connecting host device element
03/25/2010US20100072606 Stacking Package Structure with Chip Embedded Inside and Die Having Through Silicon Via and Method of the same
03/25/2010US20100072605 Semiconductor Package With a Controlled Impedance Bus and Method of Forming Same
03/25/2010US20100072604 Semiconductor device
03/25/2010US20100072603 Semiconductor device assemblies and packages with edge contacts and sacrificial substrates and other intermediate structures used or formed in fabricating the assemblies or packages
03/25/2010US20100072600 Fine-pitch oblong solder connections for stacking multi-chip packages
03/25/2010US20100072599 Semiconductor Device and Method of Forming a Wafer Level Package with Top and Bottom Solder Bump Interconnection
1 ... 664 665 666 667 668 669 670 671 672 673 674 675 676 677 678 679 680 681 682 683 684 ... 2262