Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
03/2010
03/31/2010CN201434252Y LED light source module with air-guide radiating structure and closed illumination lamp
03/31/2010CN201434250Y Large power LED lamp
03/31/2010CN201434247Y SMD-type LED lighting general light source
03/31/2010CN101690442A High frequency module having shielding and heat dissipating characteristics and method for manufacturing the same
03/31/2010CN101690440A Fan and storage device mounting assembly for electronic device
03/31/2010CN101690424A Electronic module and method for producing an electronic module
03/31/2010CN101689804A Electric vehicle, and method for cooling vehicular dc/dc-converter
03/31/2010CN101689543A Integrated circuit, electronic device and ESD protection therefor
03/31/2010CN101689542A Integrated circuits on a wafer and method for separating integrated circuits on a wafer
03/31/2010CN101689541A Integrated circuits on a wafer and methods for manufacturing integrated circuits
03/31/2010CN101689540A methods for manufacturing integrated circuits
03/31/2010CN101689539A Semiconductor device and method for manufacturing the same
03/31/2010CN101689538A Method for the production of a rigid power module
03/31/2010CN101689537A Cooling box for components or circuits
03/31/2010CN101689536A Land grid array (LGA) socket loading mechanism for mobile platforms
03/31/2010CN101689535A Semiconductor device and its manufacturing method, and display and its manufacturing method
03/31/2010CN101689534A Semiconductor package and its manufacturing method
03/31/2010CN101689533A Semiconductor package and method for manufacturing the same
03/31/2010CN101689527A Integrated circuits on a wafer and method of producing integrated circuits
03/31/2010CN101689521A Method and apparatus for monitoring vias in a semiconductor fab
03/31/2010CN101689516A Semiconductor element mounting structure, method for manufacturing the semiconductor element mounting structure, semiconductor element mounting method and pressurizing tool
03/31/2010CN101689503A intermetallic conductors
03/31/2010CN101689502A Cu wiring film
03/31/2010CN101689501A Lubricating oil composition for buffer
03/31/2010CN101689490A Filming method, and treating system
03/31/2010CN101689426A Thermally imageable dielectric layers, thermal transfer donors and receivers
03/31/2010CN101689412A Insulating film material, multilayer wiring board and process for producing the multilayer wiring board, and semiconductor apparatus and process for producing the semiconductor device
03/31/2010CN101688896A Testable integrated circuit and test method
03/31/2010CN101688051A Epoxy resin-forming liquid preparation containing inorganic particle
03/31/2010CN101687980A Heat curable resin compositon
03/31/2010CN101687896A cobalt nitride layers for copper interconnects and methods for forming them
03/31/2010CN101687718A Component having a ceramic base with a metalized surface
03/31/2010CN101687716A Method for producing a metallized component, corresponding component, and a substate for supporting the component during metalization
03/31/2010CN101687284A Solder material, process for producing the solder material, joint product, process for producing the joint product, power semiconductor module, and process for producing the power semiconductor module
03/31/2010CN101686628A Radiating device
03/31/2010CN101686627A Heat radiation device
03/31/2010CN101686626A Composite type radiator, manufacturing method and application thereof
03/31/2010CN101686625A Air exhaust device
03/31/2010CN101686612A Manufacture of a layer including a component
03/31/2010CN101686611A Multilayer circuit board, manufacture method thereof and communication equipment
03/31/2010CN101685843A Method for packaging light emitting diode
03/31/2010CN101685839A Semiconductor chip module
03/31/2010CN101685836A Wafer level upright type diode packaging structure and manufacture method thereof
03/31/2010CN101685829A Vehicle, display device and manufacturing method for a semiconductor device
03/31/2010CN101685822A Solid-state image pickup device and manufacturing method thereof
03/31/2010CN101685818A 半导体器件 Semiconductor devices
03/31/2010CN101685817A 半导体芯片及半导体晶片 The semiconductor chip and the semiconductor wafer
03/31/2010CN101685815A Isolated encapsulated LED
03/31/2010CN101685813A semiconductor apparatus
03/31/2010CN101685812A Wiring structure, semiconductor device having the wiring structure, and method for manufacturing the semiconductor device
03/31/2010CN101685811A Substrate based unmolded package
03/31/2010CN101685810A Top exposed clip with window array
03/31/2010CN101685809A Semiconductor packaging component and conducting wire rack thereof
03/31/2010CN101685808A Heat-radiation packaging structure and packaging method
03/31/2010CN101685807A Heat radiating type semiconductor packaging element and manufacture method thereof
03/31/2010CN101685806A Semiconductor chip module
03/31/2010CN101685805A Metal ceramic composite substrate and preparation method thereof
03/31/2010CN101685804A Semiconductor wafer with self-adhesive protective layers
03/31/2010CN101685796A Vehicle, display device and manufacturing method for a semiconductor device
03/31/2010CN101685783A Light emitting diode chip package structure and making method thereof
03/31/2010CN101685782A Coreless substrate package with symmetric external dielectric layers
03/31/2010CN101685764A System level module structure and production method thereof
03/31/2010CN101685330A Radiating device and notebook computer having same
03/31/2010CN101684935A Light-emitting diode lighting device and manufacturing method thereof
03/31/2010CN101684924A LED lighting module and preparation method
03/31/2010CN101684900A LED package module
03/31/2010CN101684899A LED package module
03/31/2010CN101684896A Lamp with automatic dedusting function
03/31/2010CN101683693A Method for preparing metal nanoparticles using matal seed and metal nanoparticles comprising metal seed
03/30/2010US7689377 Technique for aging induced performance drift compensation in an integrated circuit
03/30/2010US7688592 Cooling system for devices having power semiconductors and method for cooling the device
03/30/2010US7688588 Heat dissipation module and fan thereof
03/30/2010US7688559 Electrostatic discharge protective circuit and semiconductor integrated circuit using the same
03/30/2010US7688382 Solid-state imaging device and method for manufacturing the same
03/30/2010US7687947 Electric motor comprising an electronic unit with a punched grid
03/30/2010US7687925 Alignment marks for polarized light lithography and method for use thereof
03/30/2010US7687924 Multi-port memory device having serial input/output interface
03/30/2010US7687923 Semiconductor device package having a back side protective scheme
03/30/2010US7687922 Element mounting structure and element mounting method
03/30/2010US7687921 High density memory device manufacturing using isolated step pads
03/30/2010US7687920 Integrated circuit package-on-package system with central bond wires
03/30/2010US7687918 Semiconductor device and method for manufacturing same
03/30/2010US7687917 Single damascene structure semiconductor device having silicon-diffused metal wiring layer
03/30/2010US7687916 Semiconductor substrates including vias of nonuniform cross-section and associated structures
03/30/2010US7687915 Semiconductor device having crack stop structure
03/30/2010US7687914 Semiconductor device and a method of manufacturing the same and designing the same
03/30/2010US7687913 Recovery of hydrophobicity of low-k and ultra low-k organosilicate films used as inter metal dielectrics
03/30/2010US7687912 Semiconductor component comprising interconnected cell strips
03/30/2010US7687909 Metal / metal nitride barrier layer for semiconductor device applications
03/30/2010US7687908 Thin film electrode for high-quality GaN optical devices
03/30/2010US7687907 Semiconductor device and manufacturing method of the same
03/30/2010US7687906 Connecting structure, method for forming bump, and method for producing device-mounting substrate
03/30/2010US7687905 Integrated circuit packages, systems, and methods
03/30/2010US7687904 Plurality of devices attached by solder bumps
03/30/2010US7687903 Power module and method of fabricating the same
03/30/2010US7687902 Semiconductor device and a manufacturing method of the same
03/30/2010US7687901 Heat dissipating fins opposite semiconductor elements
03/30/2010US7687900 Semiconductor integrated circuit device and fabrication method for the same
03/30/2010US7687899 Dual laminate package structure with embedded elements
03/30/2010US7687898 Stacked semiconductor package
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