Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
04/2010
04/01/2010US20100078821 Metal cap layer with enhanced etch resistivity for copper-based metal regions in semiconductor devices
04/01/2010US20100078820 Semiconductor device and method of manufacturing the same
04/01/2010US20100078819 Inter connection structure including copper pad and pad barrier layer, semiconductor device and electronic apparatus including the same
04/01/2010US20100078818 Diffusion barrier and adhesion layer for an interconnect structure
04/01/2010US20100078817 Interconnect Structure
04/01/2010US20100078816 Display device and method of manufacturing the same
04/01/2010US20100078815 Ruthenium interconnect with high aspect ratio and method of fabrication thereof
04/01/2010US20100078814 System and method for using porous low dielectric films
04/01/2010US20100078813 Semiconductor module and method for manufacturing the semiconductor module
04/01/2010US20100078812 Window bga semiconductor package
04/01/2010US20100078811 Method of producing semiconductor devices
04/01/2010US20100078810 Semiconductor apparatus, substrate design method, and substrate design apparatus
04/01/2010US20100078808 Packaging having two devices and method of forming thereof
04/01/2010US20100078807 Power semiconductor module assembly with heat dissipating element
04/01/2010US20100078806 Microelectronic package with wear resistant coating
04/01/2010US20100078805 Method and core materials for semiconductor packaging
04/01/2010US20100078804 Apparatus with Side Mounted Microchip
04/01/2010US20100078803 Semiconductor flat package device and method for manufacturing the same
04/01/2010US20100078802 Chip package structure and fabricating method threrof
04/01/2010US20100078801 Chip package structure and fabricating method threrof
04/01/2010US20100078800 Low cost flexible substrate
04/01/2010US20100078799 Microelectronic package with carbon nanotubes interconnect and method of making same
04/01/2010US20100078798 Insulation covering structure for a semiconductor element with a single die dimension and a manufacturing method thereof
04/01/2010US20100078797 System and method for pre-patterned embedded chip build-up
04/01/2010US20100078796 Semiconductor Device
04/01/2010US20100078795 Electronic device
04/01/2010US20100078794 Stacked die semiconductor device having circuit tape
04/01/2010US20100078793 Semiconductor device assemblies, electronic devices including the same and assembly methods
04/01/2010US20100078792 Bond pad rerouting element, rerouted semiconductor devices including the rerouting element, and assemblies including the rerouted semiconductor devices
04/01/2010US20100078791 Semiconductor package having ink-jet type dam and method of manufacturing the same
04/01/2010US20100078790 Semiconductor device
04/01/2010US20100078789 Semiconductor package system with through silicon via interposer
04/01/2010US20100078788 Package-on-package assembly and method
04/01/2010US20100078786 Wiring substrate with reinforcement
04/01/2010US20100078785 Lead frame and method of manufacturing the same
04/01/2010US20100078784 Device including a power semiconductor chip
04/01/2010US20100078783 Device including two mounting surfaces
04/01/2010US20100078782 Coating composition and a method of coating
04/01/2010US20100078781 Input/output package architectures, and methods of using same
04/01/2010US20100078780 Semiconductor device
04/01/2010US20100078779 System on a Chip with On-Chip RF Shield
04/01/2010US20100078778 On-Chip RF Shields with Front Side Redistribution Lines
04/01/2010US20100078777 On-Chip Radio Frequency Shield with Interconnect Metallization
04/01/2010US20100078776 On-Chip RF Shields with Backside Redistribution Lines
04/01/2010US20100078772 Packaging technology
04/01/2010US20100078771 On-Chip RF Shields with Through Substrate Conductors
04/01/2010US20100078770 Lock and Key Through-Via Method for Wafer Level 3 D Integration and Structures Produced
04/01/2010US20100078769 Environmental die seal enhancement for wafer level chip scale packages
04/01/2010US20100078768 Wafer cutting methods and packages using dice derived therefrom
04/01/2010US20100078759 Miim diodes having stacked structure
04/01/2010US20100078739 Vertical Mount Package for MEMS Sensors
04/01/2010US20100078709 Semiconductor device
04/01/2010US20100078690 Semiconductor integrated circuit device and a method for manufacturing a semiconductor integrated circuit device
04/01/2010US20100078688 Nitride semiconductor device, nitride semiconductor package, and method for manufacturing nitride semiconductor device
04/01/2010US20100078669 Light emitting device and lead frame for the same
04/01/2010US20100078655 Substrate structure with die embedded inside and dual build-up layers over both side surfaces and method of the same
04/01/2010US20100078642 Layered structure and electron device that uses such a layered structure, fabrication process thereof, electron device array and display apparatus
04/01/2010US20100078635 Semiconductor device
04/01/2010US20100078199 Energy conditioning circuit arrangement for integrated circuit
04/01/2010US20100078153 Vapor Augmented Heatsink with Multi-Wick Structure
04/01/2010US20100077607 Assembly Techniques for Electronic Devices Having Compact Housing
04/01/2010DE19712825B4 Verfahren zur Herstellung eines Keramik-Leitersubstrates sowie Keramik-Leitersubstrat A method for producing a ceramic circuit substrate, as well as ceramic circuit substrate
04/01/2010DE112008001037T5 Filmbildungsverfahren, Wärmeleitelement, Leistungsmodul, Fahrzeuginverter und Fahrzeug Film-forming method, heat-conducting, power module, vehicle inverter and vehicle
04/01/2010DE102009040632A1 Verfahren zum Herstellen eines Halbleiter-Bauelements A method of manufacturing a semiconductor device
04/01/2010DE102008049231A1 Schaltung und Verfahren zu deren Herstellung Circuit and method for their preparation
04/01/2010DE102008042302A1 Verfahren und Vorrichtung zum Kühlen von Wärme erzeugenden elektronischen Bauelementen mit einem Kältemittel Method and apparatus for cooling heat generating electronic components with a refrigerant
04/01/2010CA2738433A1 Printed circuit board for harsh environments
04/01/2010CA2738098A1 Electrically-conductive foam emi shield
03/2010
03/31/2010EP2170026A1 Metal ceramic substrate for electric components or modules, method for producing such a substrate and module with such a substrate
03/31/2010EP2169723A1 Light receiving device and method of manufacturing light receiving device
03/31/2010EP2169720A1 Photodiode array, method of manufacturing the same, and radiation detector
03/31/2010EP2169717A1 Insulation substrate, power module substrate, manufacturing method thereof, and power module using the same
03/31/2010EP2168413A1 Fan and storage device mounting assembly for electronic device
03/31/2010EP2168160A1 Semiconductor module
03/31/2010EP2168159A1 Electronic component and device of high insulation resistance and method for producing the same
03/31/2010EP2168158A1 Method for marking wafers
03/31/2010EP2168157A2 Integrated circuits on a wafer and method for separating integrated circuits on a wafer
03/31/2010EP2168156A2 Integrated circuits on a wafer and methods for manufacturing integrated circuits
03/31/2010EP2168155A2 Integrated circuits on a wafer and methods for manufacturing integrated circuits
03/31/2010EP2168154A1 Subassembly that includes a power semiconductor die and a heat sink having an exposed surface portion thereof
03/31/2010EP2168144A1 Subassembly that includes a power semiconductor die and a heat sink and method of forming same
03/31/2010EP2167869A1 Lighting device with pulsating fluid cooling
03/31/2010EP2167478A1 Benzoxazine containing compositions of matter and curable compositions made therewith
03/31/2010CN201435899Y Support structure of radiating module
03/31/2010CN201435525Y Infrared emission photosensitive receiving photoelectric device of metal support
03/31/2010CN201435409Y Radiating high-power LED heat sink structure
03/31/2010CN201435391Y High antistatic schottky diode
03/31/2010CN201435390Y Novel chip encapsulating structure
03/31/2010CN201435389Y Lead frame for encapsulating semiconductor
03/31/2010CN201435388Y Lead frame used for encapsulating MOSFET
03/31/2010CN201435387Y Support and LED seal structure for sealing LEDs
03/31/2010CN201435386Y Cooling device for welded chip
03/31/2010CN201434368Y Lamp with fin-type cooling module
03/31/2010CN201434367Y Heat dissipation fin conformation improvement for light-emitting diode lamps
03/31/2010CN201434365Y Led lamp radiating structure
03/31/2010CN201434362Y LED street lamp heat radiating device
03/31/2010CN201434300Y LED headlamp of vehicle
03/31/2010CN201434282Y LED road lamp
03/31/2010CN201434257Y LED module
03/31/2010CN201434254Y Reflection-type light-emitting module with high heat dissipating and luminous efficiency
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