Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
04/2010
04/06/2010US7692301 Stitched micro-via to enhance adhesion and mechanical strength
04/06/2010US7692300 Printed circuit board and circuit structure for power supply
04/06/2010US7692299 Semiconductor apparatus having improved thermal fatigue life
04/06/2010US7692298 III-V nitride semiconductor device comprising a concave shottky contact and an ohmic contact
04/06/2010US7692297 Semiconductor device, semiconductor device module and method of manufacturing the semiconductor device
04/06/2010US7692296 Semiconductor device and multilayer substrate therefor
04/06/2010US7692295 Single package wireless communication device
04/06/2010US7692294 Semiconductor device and method for fabricating the same
04/06/2010US7692293 Semiconductor switching module
04/06/2010US7692292 Packaged electronic element and method of producing electronic element package
04/06/2010US7692291 Circuit board having a heating means and a hermetically sealed multi-chip package
04/06/2010US7692290 Heat slug and semiconductor package
04/06/2010US7692289 Semiconductor devices with improved heat dissipation and method for fabricating same
04/06/2010US7692288 MEMS packaging method for enhanced EMI immunity using flexible substrates
04/06/2010US7692287 Semiconductor device and wiring board
04/06/2010US7692286 Two-sided fan-out wafer escape package
04/06/2010US7692285 Semiconductor device
04/06/2010US7692284 Package using array capacitor core
04/06/2010US7692283 Device including a housing for a semiconductor chip including leads extending into the housing
04/06/2010US7692282 Semiconductor device including semiconductor element surrounded by an insulating member wiring structures on upper and lower surfaces of the semiconductor element and insulating member, and manufacturing method thereof
04/06/2010US7692281 Land grid array module with contact locating features
04/06/2010US7692280 Portable object connectable package
04/06/2010US7692279 Semiconductor multipackage module including die and inverted land grid array package stacked over ball grid array package
04/06/2010US7692278 Stacked-die packages with silicon vias and surface activated bonding
04/06/2010US7692277 Multilayered lead frame for a semiconductor light-emitting device
04/06/2010US7692276 Thermally enhanced ball grid array package formed in strip with one-piece die-attached exposed heat spreader
04/06/2010US7692275 Structure and method for device-specific fill for improved anneal uniformity
04/06/2010US7692274 Reinforced semiconductor structures
04/06/2010US7692273 Electronic component comprising electrodes and ring residue
04/06/2010US7692268 Integrated circuit with bipolar transistor
04/06/2010US7692266 Integrated circuit with capacitor and method for the production thereof
04/06/2010US7692265 Fuse and seal ring
04/06/2010US7692248 Semiconductor device and method of fabricating the same
04/06/2010US7692247 System and method for ESD protection
04/06/2010US7692239 MIS-type semiconductor device
04/06/2010US7692236 Multiple dual bit memory integrated circuit system
04/06/2010US7692216 Thin film transistor array panel for a liquid crystal display
04/06/2010US7692211 Super GTO-based power blocks
04/06/2010US7692210 Intermeshed guard bands for multiple voltage supply structures on an integrated circuit, and methods of making same
04/06/2010US7692207 Packaging designs for LEDs
04/06/2010US7691756 Semiconductor device including a coupled dielectric layer and metal layer, method of fabrication thereof, and material for coupling a dielectric layer and a metal layer in a semiconductor device
04/06/2010US7691726 Reduced footprint packaged microelectronic components and methods for manufacturing such microelectronic components
04/06/2010US7691697 Power composite integrated semiconductor device and manufacturing method thereof
04/06/2010US7691680 Method of fabricating microelectronic component assemblies employing lead frames having reduced-thickness inner lengths
04/06/2010US7691678 Solid-state imaging device and method for manufacturing the same
04/06/2010US7691677 Method of manufacturing a semiconductor device
04/06/2010US7691674 Integrated circuit packaging system with stacked device and method of manufacturing thereof
04/06/2010US7691673 Electronic parts packaging structure and method of manufacturing the same
04/06/2010US7691353 Heating the group II-VI material with p-type dopant for at least 10minutes at a temperature sufficient to form a low dielectric constant; high temperature fabrication of p-type zinc oxide doped with arsenic transforms the zinc oxide semiconductor to an insulator; stability; nondiffusing
04/06/2010US7690419 Porous media cold plate
04/06/2010US7690109 Method of manufacturing a multilayer wiring board
04/01/2010WO2010036953A2 Conductive compositions and methods of using them
04/01/2010WO2010036784A1 Thermally conductive gel packs
04/01/2010WO2010036709A2 Overmolded semiconductor package with an integrated antenna
04/01/2010WO2010036676A2 Input/output architecture for mounted processors, and methods of using same
04/01/2010WO2010036623A1 High-electrical-current wafer level packaging, high-electrical-current wlp electronic devices, and methods of manufacture thereof
04/01/2010WO2010036579A2 Low cost die-to-wafer alignment/bond for 3d ic stacking
04/01/2010WO2010036563A1 Electrically-conductive foam emi shield
04/01/2010WO2010036496A1 Printed circuit board for harsh environments
04/01/2010WO2010036442A1 Titanium-based thermal ground plane
04/01/2010WO2010036383A1 Applications and methods for alkali silicate glass
04/01/2010WO2010036304A2 Laser ablation to create pocket for die placement
04/01/2010WO2010036051A2 Structure and manufacture method for multi-row lead frame and semiconductor package
04/01/2010WO2010035867A1 Semiconductor element-mounting package substrate, and method for manufacturing package substrate
04/01/2010WO2010035866A1 Package substrate for mounting semiconductor element and method for manufacturing the package substrate
04/01/2010WO2010035865A1 Package substrate for mounting semiconductor element and method for manufacturing the package substrate
04/01/2010WO2010035864A1 Semiconductor element-mounting package substrate, method for manufacturing package substrate, and semiconductor package
04/01/2010WO2010035627A1 Semiconductor device
04/01/2010WO2010035625A1 Semi conductor device
04/01/2010WO2010035614A1 Thermally conductive pressure-sensitive adhesive composition, thermally conductive pressure-sensitive adhesive sheet, and electronic component
04/01/2010WO2010035547A1 Power tool
04/01/2010WO2010035543A1 Circuit substrate and display device
04/01/2010WO2010035509A1 Lead frame substrate manufacturing method and semiconductor device
04/01/2010WO2010035499A1 Leadframe substrate, method for manufacturing same, and semiconductor device
04/01/2010WO2010035481A1 Semiconductor device and semiconductor device manufacturing method
04/01/2010WO2010035457A1 Piezoelectric device and method for manufacturing same
04/01/2010WO2010035401A1 Electronic device and method for manufacturing same
04/01/2010WO2010035379A1 Semiconductor device and a method of fabricating the same
04/01/2010WO2010035377A1 Semiconductor device and method for manufacturing same
04/01/2010WO2010035375A1 Semiconductor device and method for manufacturing the same
04/01/2010WO2010034995A1 Method and apparatus for forming an interconnection through a substrate
04/01/2010WO2010034569A1 Method and device for cooling electronic components generating heat using a coolant
04/01/2010WO2010034312A1 A pump housing for an electromagnetic pump and a method of assembling a cooling circuit comprising the pump housing
04/01/2010WO2010034051A1 Method of reducing voids in encapsulant
04/01/2010WO2009158250A3 Apparatus and methods of forming package-on-package interconnects
04/01/2010US20100081291 Very Low Dielectric Constant Plasma-Enhanced CVD Films
04/01/2010US20100079959 Semiconductor device comprising an in-chip active heat transfer system
04/01/2010US20100079035 Electronic device and manufacturing method thereof
04/01/2010US20100078834 Semiconductor Device and Method of Forming a Protective Layer on a Backside of the Wafer
04/01/2010US20100078833 Circuit device and method of manufacturing the same
04/01/2010US20100078832 Sensor node module
04/01/2010US20100078831 Integrated circuit package system with singulation process
04/01/2010US20100078829 Stacked device conductive path connectivity
04/01/2010US20100078828 Integrated circuit package system with mounting structure
04/01/2010US20100078827 Multilayer wiring structure of semiconductor device, method of producing said multilayer wiring structure and semiconductor device to be used for reliability evaluation
04/01/2010US20100078826 Substrate package with through holes for high speed i/o flex cable
04/01/2010US20100078825 Method for fabricating interconnect structures for semiconductor devices
04/01/2010US20100078824 Method for forming three-dimensional structure, method for manufacturing semiconductor device, and semiconductor device
04/01/2010US20100078823 Contacts and vias of a semiconductor device formed by a hard mask and double exposure
04/01/2010US20100078822 Electronic Device and Method of Manufacturing Same
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