| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 04/08/2010 | DE202009013825U1 Fehlerschutz für optoelektronische Bauelemente Error protection for optoelectronic devices |
| 04/08/2010 | DE19928075B4 Speichermodul mit Wärmeableiter Memory module with heatsink |
| 04/08/2010 | DE10257707B4 Verfahren zum Herstellen eines gestapelten Chip-Paketes A method of manufacturing a stacked chip package |
| 04/08/2010 | DE10238320B4 Keramische Leiterplatte und Verfahren zu ihrer Herstellung Ceramic printed circuit board and process for its preparation |
| 04/08/2010 | DE102009043457A1 Integrierte Schaltungsanordnung und Verfahren zum Verkapseln einer Halbleitervorrichtung An integrated circuit device and method for encapsulating a semiconductor device |
| 04/08/2010 | DE102009040627A1 Verfahren zum Herstellen eines elektronischen Systems A method of manufacturing an electronic system |
| 04/08/2010 | DE102009040556A1 Beschichtungszusammensetzung und Beschichtungsverfahren Coating composition and coating process |
| 04/08/2010 | DE102009040176A1 Halbleiter-Bauelement Semiconductor component |
| 04/08/2010 | DE102009038713A1 Elektronikbauelement und Verfahren zu dessen Herstellung An electronics device and process for its preparation |
| 04/08/2010 | DE102008050065A1 Heat exchanger for cooling electrical component and modules or systems, particularly carrier plate or printed circuit board, is integrated in electrical printed circuit board |
| 04/08/2010 | DE102008049726A1 Halbleiterbauelement mit einem chipinternen aktiven Wärmeübertragungssystem A semiconductor device comprising an on-chip active heat transfer system |
| 04/08/2010 | DE102008049673A1 Schaltungsanordnung mit einem Leistungshalbleitermodul und einer außerhalb dessen angeordneten Steuerschaltung Circuit arrangement with a power semiconductor module, and a control circuit arranged outside of which |
| 04/08/2010 | DE102008049460A1 Switching arrangement has component housing, which has rigid housing wall, and housing inner space, where electrical component is arranged in housing inner space |
| 04/08/2010 | DE102008049084A1 Heat dissipating module has two sides lying opposite each other, where semiconductor element is provided, and heat dissipating body is provided with one contact surface which is adjacent to another contact surface |
| 04/08/2010 | DE102008048005B3 Leistungshalbleitermodulanordnung und Verfahren zur Herstellung einer Leistungshalbleitermodulanordnung Power semiconductor module arrangement and method for manufacturing a power semiconductor module assembly |
| 04/08/2010 | DE102008042592A1 Thermo-electric generator for producing energy, has thermocouple which generates electrical voltage depending on temperature difference, where thermocouples are connected with each other in electrically conductive manner |
| 04/08/2010 | DE102008042553A1 Verfahren und Vorrichtung zur Erfassung der Temperatur einer integrierten Schaltung mittels einer auf einem gemeinsamen Substrat untergebrachten kalibrierbaren Temperaturerfassungseinrichtung Method and device for detecting the temperature of an integrated circuit by means of a housed on a common substrate calibrated temperature sensing device |
| 04/08/2010 | DE102008042340A1 Air cooling-heat dissipating structure for use as housing for encasing heat generating element, has cut channels forming notches on fins and slots on curved sections, where notches and slots are designed in coplanar manner |
| 04/08/2010 | DE102007052050B4 Halbleiterbauelement und Verfahren zum Erhöhen der Ätzselektivität während der Strukturierung einer Kontaktstruktur des Halbleiterbauelements A semiconductor device and method for increasing the etch selectivity during the patterning of a contact structure of the semiconductor component |
| 04/08/2010 | DE102007046874B4 Kühlmodul zum Abführen von Wärme und Verwendung eines Lüfters für Selbiges Cooling module for dissipating heat and a fan for use The same |
| 04/08/2010 | DE102007043185B4 Einschaltschaltung Turn-on |
| 04/08/2010 | DE102006056620B4 Halbleiterstruktur und Verfahren zu ihrer Herstellung Semiconductor structure and process for their preparation |
| 04/08/2010 | DE102006030257B4 Teststruktur zum Bestimmen der Eigenschaften von Halbleiterlegierungen in SOI-Transistoren mittels Röntgenbeugung Test structure for determining the properties of semiconductor alloys in SOI-transistors by means of X-ray diffraction |
| 04/08/2010 | DE102004057804B4 Gehäusekörper für einen Halbleiterchip aus gegossener Keramik mit reflektierender Wirkung und Verfahren zu dessen Herstellung Package body for a semiconductor chip made of cast ceramic having a reflecting effect and process for its preparation |
| 04/08/2010 | DE102004004862B4 Integrierte Halbleiterdiodenanordnung und integriertes Halbleiterbauteil Integrated semiconductor diode array and integrated semiconductor device |
| 04/08/2010 | CA2738072A1 Ceramic heat pipe with porous ceramic wick |
| 04/07/2010 | EP2173148A1 Ceramic multilayer substrate |
| 04/07/2010 | EP2172971A2 Cooling assembly |
| 04/07/2010 | EP2172970A1 Semiconductor package and its manufacturing method |
| 04/07/2010 | EP2172963A1 Method for measuring rotation angle of bonded wafer |
| 04/07/2010 | EP2172951A1 Surface mounting component |
| 04/07/2010 | EP2172731A2 A flow distributor assembly and a cooling unit with a flow distributor assembly |
| 04/07/2010 | EP2172702A1 A light-emitting diode lighting device |
| 04/07/2010 | EP2172524A1 Resin composition and its use |
| 04/07/2010 | EP2171755A1 Methods for attachment and devices produced using the methods |
| 04/07/2010 | EP2171753A1 Inhibition of copper dissolution for lead-free soldering |
| 04/07/2010 | EP1670863B1 Curable organopolysiloxane composition and semiconductor device |
| 04/07/2010 | EP1479161B1 Mems-based, computer systems, clock generation and oscillator circuits and lc-tank apparatus for use therein |
| 04/07/2010 | CN201436838U Support for radiator fastener |
| 04/07/2010 | CN201436836U Backplate for radiator fastener |
| 04/07/2010 | CN201436779U Water-cooled automobile welding electric welding machine rectification module |
| 04/07/2010 | CN201436697U 球栅阵列谐振器 Ball grid array resonator |
| 04/07/2010 | CN201436689U A radiator of a semiconductor electronic refrigeration drinking fountain |
| 04/07/2010 | CN201436681U Novel chip |
| 04/07/2010 | CN201436465U Respirator for High brightness LED lamp |
| 04/07/2010 | CN201436449U Led光源 Led light |
| 04/07/2010 | CN201436442U LED light fixture capable of uniformly radiating |
| 04/07/2010 | CN1937217B Packaging structure and its packaging method |
| 04/07/2010 | CN1925722B Wiring board construction including embedded ceramic capacitors |
| 04/07/2010 | CN1835242B Liquid crystal display device using thin-film transistor and method for manufacturing the same |
| 04/07/2010 | CN1617034B 液晶显示器 LCD Monitor |
| 04/07/2010 | CN1573453B Display device and manufacturing method of the same |
| 04/07/2010 | CN101692472A LED packaging structure |
| 04/07/2010 | CN101692458A Organic electroluminescent device |
| 04/07/2010 | CN101692448A Multi-chip LED centralized-encapsulated radiating structure and encapsulation technology thereof |
| 04/07/2010 | CN101692444A 半导体器件 Semiconductor devices |
| 04/07/2010 | CN101692443A Chip on film type semiconductor package and display device |
| 04/07/2010 | CN101692442A Multilayer ceramic substrate, electronic component, and method of manufacturing multilayer ceramic substrate |
| 04/07/2010 | CN101692441A Packaging structure of printed circuit board |
| 04/07/2010 | CN101692440A Mixed crystal orientation strain silicon substrate and method for preparing same |
| 04/07/2010 | CN101692425A Novel design method for ESD protection |
| 04/07/2010 | CN101692348A Monopole programmed resistance memory and storage operation method therefor |
| 04/07/2010 | CN101692329A Impedance value detection method for display and display carrying structure |
| 04/07/2010 | CN101691920A Heat dissipation module of high-power LED lamp |
| 04/07/2010 | CN101691910A LED packaging module and preparation method thereof |
| 04/07/2010 | CN101691909A LED packaging module and preparation method thereof |
| 04/07/2010 | CN101350366B Antistatic TFT substrate and processing technique thereof |
| 04/07/2010 | CN101276795B Semiconductor encapsulation construction |
| 04/07/2010 | CN101261947B Method of manufacturing circuit board and circuit board |
| 04/07/2010 | CN101192597B High low temperature protective circuit |
| 04/07/2010 | CN101174622B Electrostatic discharge protecting equipment of connection pad and its method and structure |
| 04/07/2010 | CN101165860B Semiconductor device and method of producing the same, and power conversion apparatus incorporating this semiconductor device |
| 04/07/2010 | CN101164163B Heat sink, laser apparatus provided with such heat sink, and laser stack apparatus |
| 04/07/2010 | CN101154657B Layout structure of electrostatic discharge protecting circuit and its manufacturing method |
| 04/07/2010 | CN101150135B 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof |
| 04/07/2010 | CN101101917B Active array base board for plane display and its repair method |
| 04/07/2010 | CN101019226B Preparation of front contact for surface mounting |
| 04/07/2010 | CN101003690B Heat radiation insulation resin composition and printing circuit board using same |
| 04/06/2010 | US7694260 Semiconductor integrated circuit, layout method, layout apparatus and layout program |
| 04/06/2010 | US7694247 Identification of ESD and latch-up weak points in an integrated circuit |
| 04/06/2010 | US7693201 Light-emitting semiconductor component comprising a protective diode |
| 04/06/2010 | US7692952 Nanoscale wire coding for stochastic assembly |
| 04/06/2010 | US7692588 Semiconductor module comprising components for microwave engineering in plastic casing and method for the production thereof |
| 04/06/2010 | US7692444 Signal isolators using micro-transformers |
| 04/06/2010 | US7692439 Structure for modeling stress-induced degradation of conductive interconnects |
| 04/06/2010 | US7692319 Efficient provision of alignment marks on semiconductor wafer |
| 04/06/2010 | US7692318 Liquid epoxy resin composition and semiconductor device |
| 04/06/2010 | US7692317 Apparatus for housing a micromechanical structure |
| 04/06/2010 | US7692316 Audio amplifier assembly |
| 04/06/2010 | US7692315 Semiconductor device and method for manufacturing the same |
| 04/06/2010 | US7692314 Wafer level chip scale package and method for manufacturing the same |
| 04/06/2010 | US7692313 Substrate and semiconductor package for lessening warpage |
| 04/06/2010 | US7692312 Semiconductor device having reinforcement member and method of manufacturing the same |
| 04/06/2010 | US7692311 POP (package-on-package) device encapsulating soldered joints between external leads |
| 04/06/2010 | US7692310 Forming a hybrid device |
| 04/06/2010 | US7692309 Configuring structured ASIC fabric using two non-adjacent via layers |
| 04/06/2010 | US7692307 Compliant structure for an electronic device, method of manufacturing same, and system containing same |
| 04/06/2010 | US7692305 Power feed device to power pins of electrical component |
| 04/06/2010 | US7692304 Semiconductor device having a tapered plug |
| 04/06/2010 | US7692303 Semiconductor device and manufacturing method thereof |