Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
04/2010
04/13/2010US7696788 Semiconductor integrated circuit
04/13/2010US7696631 Wire bonding personalization and discrete component attachment on wirebond pads
04/13/2010US7696630 Semiconductor device
04/13/2010US7696629 Chip-stacked package structure
04/13/2010US7696628 Relay substrate and substrate assembly
04/13/2010US7696626 Semiconductor device and method of arranging pad thereof
04/13/2010US7696625 Semiconductor device and method for manufacturing the same
04/13/2010US7696624 Nucleation method for atomic layer deposition of cobalt on bare silicon during the formation of a semiconductor device
04/13/2010US7696623 Electronic carrier board and package structure thereof
04/13/2010US7696622 MEMS device formed inside hermetic chamber having getter film
04/13/2010US7696620 Photodiode array, method for manufacturing same, and radiation detector
04/13/2010US7696619 Stack combination of plural chip package units
04/13/2010US7696618 POP (package-on-package) semiconductor device
04/13/2010US7696617 Package for semiconductor devices
04/13/2010US7696616 Stacked type semiconductor device and method of fabricating stacked type semiconductor device
04/13/2010US7696615 Semiconductor device having pillar-shaped terminal
04/13/2010US7696614 Driver module structure
04/13/2010US7696613 Multilayered wiring substrate including wiring layers and insulating layers and method of manufacturing the same
04/13/2010US7696612 Multiphase synchronous buck converter
04/13/2010US7696611 Conductive material compositions, apparatus, systems, and methods
04/13/2010US7696610 Apparatus for shielding integrated circuit devices
04/13/2010US7696609 Semiconductor device comprising a memory portion and a peripheral circuit portion
04/13/2010US7696608 Semiconductor integrated circuit device and process for manufacturing the same
04/13/2010US7696607 Semiconductor device
04/13/2010US7696606 Metal structure
04/13/2010US7696602 Integrated circuit devices having fuse structures including buffer layers
04/13/2010US7696601 Semiconductor device with SEG film active region
04/13/2010US7696574 Semiconductor substrate with multiple crystallographic orientations
04/13/2010US7696526 Surface mount optoelectronic component
04/13/2010US7696286 resin composition for semiconductor encapsulation realizing excellent soldering resistance and flame resistance and having excellent flowability and curing properties, and a semiconductor device. The invention has solved the object by a resin composition for semiconductor encapsulation
04/13/2010US7696092 Method of using ternary copper alloy to obtain a low resistance and large grain size interconnect
04/13/2010US7696081 Method of manufacturing semiconductor device that uses both a normal photomask and a phase shift mask for defining interconnect patterns
04/13/2010US7696020 Process for fabricating a thin film semiconductor device, thin film semiconductor device, and liquid crystal display
04/13/2010US7696015 Method of forming a stack of heat generating integrated circuit chips with intervening cooling integrated circuit chips
04/13/2010US7696009 Method for fabricating a semiconductor device having a heat radiation layer
04/13/2010US7696007 Semiconductor package board using a metal base
04/13/2010US7696005 Method for manufacturing an electronic module in an installation base
04/13/2010US7696003 Microelectronic component assemblies with recessed wire bonds and methods of making same
04/13/2010US7695990 Fabricating surface mountable semiconductor components with leadframe strips
04/13/2010US7695605 Tin plating method
04/13/2010US7695559 suspension comprising, with respect to the mass of cement 22% to 35% by weight of water,1% to 10% by weight of acetic acid, up to 8% by weight of plasticizer, and 0 to 2% by weight of dispersing agent, and having an apparent viscosity for the casting rate gradient of 0.5 to 2 Pa s
04/13/2010US7694871 Self-encapsulated silver alloys for interconnects
04/13/2010US7694727 Heat dissipation device with multiple heat pipes
04/13/2010CA2589570C High power led electro-optic assembly
04/13/2010CA2275875C Component holder with circulating air cooling of electrical components
04/08/2010WO2010040016A2 Nickel-gold plateable thick film silver paste, and plating process for low temperature co fired ceramic devices and ltcc devices made therefrom
04/08/2010WO2010039981A2 Double broken seal ring
04/08/2010WO2010039358A2 Ceramic heat pipe with porous ceramic wick
04/08/2010WO2010038885A1 Silicon nitride film and process for production thereof, computer-readable storage medium, and plasma cvd device
04/08/2010WO2010038673A1 Coating agent, substrate for mounting optical semiconductor element using same, and optical semiconductor device
04/08/2010WO2010038599A1 Semiconductor device
04/08/2010WO2010038452A1 Leadframe substrate and method for manufacturing same, and semiconductor device
04/08/2010WO2010038450A1 Leadframe substrate and method for manufacturing same
04/08/2010WO2010038345A1 Wiring board, semiconductor device and method for manufacturing the same
04/08/2010WO2010038295A1 Ultrasonic bonding apparatus, method for ultrasonic bonding, and sealing arrangement
04/08/2010WO2010038186A2 Lead-free solder bump
04/08/2010WO2010037474A2 A semiconductor device comprising an in-chip active heat transfer system
04/08/2010WO2010005501A3 Monolithic structurally complex heat sink designs
04/08/2010WO2009154663A3 Vapor chamber-thermoelectric module assemblies
04/08/2010US20100085713 Lateral graphene heat spreaders for electronic and optoelectronic devices and circuits
04/08/2010US20100085532 Display device and manufacturing method of the same
04/08/2010US20100084773 Semiconductor device and method of bonding wires between semiconductor chip and wiring substrate
04/08/2010US20100084772 Package and fabricating method thereof
04/08/2010US20100084771 Flexible semiconductor package and method for fabricating the same
04/08/2010US20100084770 Semiconductor device which includes contact plug and embedded interconnection connected to contact plug
04/08/2010US20100084769 Semiconductor device and dummy pattern arrangement method
04/08/2010US20100084768 Electronic component, a semiconductor wafer and a method for producing an electronic component
04/08/2010US20100084767 Discontinuous/non-uniform metal cap structure and process for interconnect integration
04/08/2010US20100084766 Surface repair structure and process for interconnect applications
04/08/2010US20100084765 Semiconductor package having bump ball
04/08/2010US20100084764 Carbon nanotube-reinforced solder caps, methods of assembling same, and chip packages and systems containing same
04/08/2010US20100084763 Metallic Bump Structure Without Under Bump Metallurgy And Manufacturing Method Thereof
04/08/2010US20100084762 Memory card
04/08/2010US20100084761 Semiconductor device and fabrication method of the same
04/08/2010US20100084760 Semiconductor device and method for manufacturing same
04/08/2010US20100084759 Die Rearrangement Package Structure Using Layout Process to Form a Compliant Configuration
04/08/2010US20100084758 Semiconductor package
04/08/2010US20100084757 Conductive compositions and methods of using them
04/08/2010US20100084756 Dual or multiple row package
04/08/2010US20100084755 Semiconductor Chip Package System Vertical Interconnect
04/08/2010US20100084753 Multi-chip package
04/08/2010US20100084752 Systems and methods for implementing a wafer level hermetic interface chip
04/08/2010US20100084751 Double Broken Seal Ring
04/08/2010US20100084750 Module having a stacked passive element and method of forming the same
04/08/2010US20100084749 Package and fabricating method thereof
04/08/2010US20100084748 Thin foil for use in packaging integrated circuits
04/08/2010US20100084747 Zigzag Pattern for TSV Copper Adhesion
04/08/2010US20100084737 Tunable Semiconductor Component Provided with a Current Barrier
04/08/2010US20100084715 Photo alignment mark for a gate last process
04/08/2010US20100084707 Polysilicon control etch-back indicator
04/08/2010US20100084706 Power Semiconductor Devices and Methods of Manufacture
04/08/2010US20100084698 Semiconductor device having plural dram memory cells and a logic circuit and method for manufacturing the same
04/08/2010US20100084682 Ohmic electrode and method thereof, semiconductor light emitting element having this
04/08/2010US20100084665 Solid state light sheet and encapsulated bare die semiconductor circuits
04/08/2010US20100084662 Semiconductor structure processing using multiple laser beam spots overlapping lengthwise on a structure
04/08/2010US20100084657 Thin film transistor array substrate
04/08/2010US20100084656 Particle emission analysis for semiconductor fabrication steps
04/08/2010US20100084187 Coupler
04/08/2010US20100084183 Twin-chip-mounting type diode
04/08/2010DE202009016620U1 Kompositstruktur für eine polygonale lichtemittierende Diode The composite structure of a polygonal light-emitting diode
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