| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 04/15/2010 | US20100090316 Wafer with design printed therein |
| 04/15/2010 | US20100090315 Film forming method, film forming apparatus, storage medium and semiconductor device |
| 04/15/2010 | US20100090309 Capacitors, Dielectric Structures, And Methods Of Forming Dielectric Structures |
| 04/15/2010 | US20100090306 Two terminal multi-channel esd device and method therefor |
| 04/15/2010 | US20100090302 Resonator |
| 04/15/2010 | US20100090285 Integrated Circuit with a Contact Structure Including a Portion Arranged in a Cavity of a Semiconductor Structure |
| 04/15/2010 | US20100090283 Electro Static Discharge Protection Device |
| 04/15/2010 | US20100090253 Programmable power management using a nanotube structure |
| 04/15/2010 | US20100090252 Semiconductor integrated circuit device |
| 04/15/2010 | US20100090014 Semiconductor device and rfid tag chip |
| 04/15/2010 | US20100089891 Method of preparing an antenna |
| 04/15/2010 | US20100089638 Sealing structure, electronic device, sealing method, gasket, and manufacturing method thereof |
| 04/15/2010 | US20100089636 Nanoparticulate encapsulation barrier stack |
| 04/15/2010 | DE202010000020U1 Elektronikbaugruppe Electronics assembly |
| 04/15/2010 | DE202008016023U1 Tageslicht-LED-Cluster Daylight LED cluster |
| 04/15/2010 | DE10334386B4 Verfahren und Vorrichtung zum Temperaturdrosseln der Zugriffsfrequenz einer integrierten Schaltung Method and apparatus for temperature throttling the access frequency of an integrated circuit |
| 04/15/2010 | DE102009039227A1 Verfahren zur Herstellung eines Halbleiterbauelements A process for producing a semiconductor device |
| 04/15/2010 | DE102009038702A1 Halbleiteranordnung und Herstellungsverfahren A semiconductor device and manufacturing method |
| 04/15/2010 | DE102009034404A1 Transformatoren und Verfahren zum Herstellen derselben Transformers and methods of manufacturing the same |
| 04/15/2010 | DE102009031613A1 Fluidkonvektions-Wärmeableitungsvorrichtung Fluidkonvektions heat dissipation device |
| 04/15/2010 | DE102009027292A1 Inverterleistungsmodul mit verteilter Stütze zur direkten Substratkühlung Inverter power module with distributed support for the direct substrate cooling |
| 04/15/2010 | DE102009026480A1 Modul mit einer gesinterten Fügestelle Module with a sintered joint |
| 04/15/2010 | DE102008063353A1 Widerstandsspeicherbauelement und Verfahren zu seiner Herstellung Resistance memory device and method for its preparation |
| 04/15/2010 | DE102008054307A1 Halbleitervorrichtung mit Leistungsvorrichtung A semiconductor device having power device |
| 04/15/2010 | DE102008051044A1 Optoelektronisches Bauteil The optoelectronic device |
| 04/15/2010 | DE102008049552A1 Sensor-chip unit has chip body which has front side, rear side and side surfaces adjacent to front side and rear side, where auxiliary structure is arranged on surface area of front side in proximity to edge in form-fit manner |
| 04/15/2010 | DE102008047850A1 Halbleiterkörper mit einer Schutzstruktur und Verfahren zum Herstellen derselben Semiconductor body having a protective structure and method of manufacturing the same |
| 04/15/2010 | DE102008047649A1 Plate with an upper and lower side for balancing heat in a printed circuit board and guiding heat from the printed circuit board and from element present on the printed circuit board, which has two plastic layers |
| 04/15/2010 | DE102008044985A1 Verfahren zur Herstellung eines Halbleiterbauelements mit einem kohlenstoffenthaltenden leitenden Material für Durchgangskontakte A process for producing a semiconductor device with a carbon-containing conductive material for vias |
| 04/15/2010 | DE102005053396B4 Schaltungseinrichtung, insbesondere Frequenzumrichter Circuit means, in particular frequency |
| 04/15/2010 | DE102005028202B4 Verfahren zur Herstellung von Halbleiterscheiben aus Silizium A process for producing semiconductor wafers from silicon |
| 04/15/2010 | DE102005018108B4 Verfahren zur Herstellung eines Halbleiterbauelements mit einer Lötschicht A process for producing a semiconductor device with a solder layer |
| 04/15/2010 | DE102004001011B4 Anschlusskastenvorrichtung für ein Solarzellenmodul und ein Verbindungsverfahren für eine Anschlusskastenvorrichtung Terminal box device for a solar cell module and a method of bonding a junction box device |
| 04/15/2010 | DE10062108B4 Leistungsmodul mit verbessertem transienten Wärmewiderstand Power module with improved transient thermal resistance |
| 04/14/2010 | EP2175708A1 Electronic module with heat sink |
| 04/14/2010 | EP2175487A2 Semiconductor device and method for fabricating the same |
| 04/14/2010 | EP2175486A2 Semiconductor device and method for fabricating the same |
| 04/14/2010 | EP2175485A2 Connection between two soldered inserts and method of manufacturing the same |
| 04/14/2010 | EP2175484A1 Power semiconductor device adaptive cooling assembly |
| 04/14/2010 | EP2175052A1 Process for producing electronic component, and electronic component produced by the process |
| 04/14/2010 | EP2174984A1 Silicone resin composition for optical semiconductor devices |
| 04/14/2010 | EP2174349A2 Metal-based package substrate, three-dimensional multi-layered package module using the same, and manufacturing method thereof |
| 04/14/2010 | EP2174348A1 Method for producing an electronic component and electronic component |
| 04/14/2010 | EP2174087A1 Heat pipe dissipating system and method |
| 04/14/2010 | EP2173829A1 Heat-resistant adhesive sheet |
| 04/14/2010 | EP1696046B1 Process for producing a metal-based carbon fiber composite material |
| 04/14/2010 | EP1647052B1 Underfill and mold compounds including siloxane-based aromatic diamines |
| 04/14/2010 | EP1503216B1 Sheet-form connector and production method and application therefor |
| 04/14/2010 | CN201438805U 散热器 Heat sink |
| 04/14/2010 | CN201438803U Waved electric power electronic sunflower radiator |
| 04/14/2010 | CN201438801U Structure of forming and radiating module of composite metal |
| 04/14/2010 | CN201438800U Radiator fastener support |
| 04/14/2010 | CN201438786U Circuit board connected with external heat dissipation device |
| 04/14/2010 | CN201438526U Component of electrical connector |
| 04/14/2010 | CN201438466U ultra-fast recovery diode |
| 04/14/2010 | CN201438465U Thin frame triode |
| 04/14/2010 | CN201438464U Thin film transistor with top gate structure |
| 04/14/2010 | CN201438463U Encapsulated PIN-FET optical receiving component with eight pins |
| 04/14/2010 | CN201438462U Lighting protection light-emitting diode |
| 04/14/2010 | CN201438461U Novel CMOS image sensor module |
| 04/14/2010 | CN201438460U Packaging structure of semiconductor |
| 04/14/2010 | CN201438459U Heat dissipating device assembly |
| 04/14/2010 | CN201438458U Metal packaged transient voltage suppressor diode |
| 04/14/2010 | CN201438457U Component step-recovery prevention circuit |
| 04/14/2010 | CN201438058U Pulsating heat pipe cooling module |
| 04/14/2010 | CN201437979U Radiating module for bulb-type LED lamp |
| 04/14/2010 | CN201437977U LED road lamp radiator |
| 04/14/2010 | CN201437976U LED columnar lamp radiator |
| 04/14/2010 | CN201437975U Lamp heat radiation device |
| 04/14/2010 | CN201437967U LED radiating fin structure |
| 04/14/2010 | CN1992286B Flash memory device and method of manufacturing the same |
| 04/14/2010 | CN101695216A Printed circuit board and manufacturing method thereof |
| 04/14/2010 | CN101694845A Split-gate flash memory sharing word line |
| 04/14/2010 | CN101694844A Split-gate flash memory sharing word line based on silicon nitride floating gates |
| 04/14/2010 | CN101694841A Integrated circuit of three-dimension memory |
| 04/14/2010 | CN101694840A Power device integrated circuit |
| 04/14/2010 | CN101694838A Packaging part with double flat surfaces and no pins and production method thereof |
| 04/14/2010 | CN101694837A Packaging part with double-row pins and four flat and pin-free surfaces and production method thereof |
| 04/14/2010 | CN101694836A Method of manufacturing semiconductor device |
| 04/14/2010 | CN101694542A Thin film transistor for electrowetting display device and manufacturing method thereof |
| 04/14/2010 | CN101694290A LED lamp liquid radiator |
| 04/14/2010 | CN101694269A LED module and LED display box |
| 04/14/2010 | CN101414592B Image sensor encapsulation |
| 04/14/2010 | CN101295696B Semi-conductor package structure and lead frame |
| 04/14/2010 | CN101267714B Electronic device and electronic component mounting method |
| 04/14/2010 | CN101261971B 半导体装置及其制造方法 Semiconductor device and manufacturing method |
| 04/14/2010 | CN101233616B Semiconductor element and electric device |
| 04/14/2010 | CN101212880B Heat radiator |
| 04/14/2010 | CN101211905B Press-loading valve stack for large power all-controlled semiconductor device |
| 04/14/2010 | CN101207098B Soldering pad structure in semiconductor apparatus and related method |
| 04/14/2010 | CN101188231B Semiconductor device and semiconductor wafer and method for manufacturing the same |
| 04/14/2010 | CN101142673B Semiconductor device and its making method |
| 04/14/2010 | CN101111117B 集成电路和保护电路 Integrated circuits and protection circuits |
| 04/14/2010 | CN101090075B Manufacturing method for vertical built-in capacity substrate and its structure |
| 04/14/2010 | CN101017817B UV blocking and crack protecting passivation layer |
| 04/14/2010 | CN101000892B Programmable resistive RAM and manufacturing method |
| 04/13/2010 | US7697303 Dual-sided substrate integrated circuit package including a leadframe having leads with increased thickness |
| 04/13/2010 | US7697299 Apparatus for securing heat sinks to a device under test |
| 04/13/2010 | US7696885 Methods and systems of attaching a radio transceiver to an antenna |
| 04/13/2010 | US7696849 Electronic component |