Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
04/2010
04/22/2010DE102008038043A1 Electronic component e.g. field-effect transistor, has strip electrodes with longitudinal axis running perpendicular to width extension of strip electrodes, so that thickness of electrodes increases or decreases along longitudinal axis
04/22/2010DE102008034075A1 Power semiconductor module comprises component of power electronics on substrate, where component is embedded into powder ballast in side without substrate
04/22/2010DE102008034033A1 Carrier element for carrying e.g. metal oxide semiconductor gas sensor, utilized for detecting e.g. thermal conductivity, has receiving surface present on individual body parts that are connected thermal bridges
04/22/2010DE102005019305B4 ESD-Schutzstruktur mit Diodenreihenschaltung und Halbleiterschaltung mit derselben ESD protection structure with diode series circuit and the semiconductor circuit with the same
04/22/2010DE102004009056B4 Verfahren zur Herstellung eines Halbleitermoduls aus mehreren stapelbaren Halbleiterbauteilen mit einem Umverdrahtungssubstrat A process for producing a semiconductor module of a plurality of stackable semiconductor devices with a rewiring substrate
04/21/2010EP2178119A1 Surface mountable integrated circuit packaging scheme
04/21/2010EP2178118A1 Light emitting diode with energy recovery system
04/21/2010EP2178117A1 Power semiconductor module with double side cooling
04/21/2010EP2178116A1 Ic mounting substrate and method for manufacturing the same
04/21/2010EP2177646A1 Stress-reduced Ni-P/Pd stacks for bondable wafer surfaces
04/21/2010EP2177545A1 Polymer for forming insulating film, composition for forming insulating film, insulating film, and electronic device having insulating film
04/21/2010EP2177490A1 Ceramic substrate, process for producing the same, and dielectric-porcelain composition
04/21/2010EP2176886A1 Cascode current sensor for discrete power semiconductor devices
04/21/2010EP2176885A1 Microelectronic die packages with metal leads, including metal leads for stacked die packages, and associated systems and methods
04/21/2010EP2176883A2 Semiconductor device and method for manufacturing the same
04/21/2010EP2176882A2 Microelectronic package element and method of fabricating thereof
04/21/2010CN201440780U 固定装置 Fixtures
04/21/2010CN201440778U radiating module
04/21/2010CN201440777U Air current guide plate for radiator
04/21/2010CN201440559U Electric connector assembly
04/21/2010CN201440416U 快恢复二极管 Fast Recovery Diode
04/21/2010CN201440415U Micro-miniature CMOS image sensor
04/21/2010CN201440414U Thyristor power assembly for paper machine
04/21/2010CN201440413U Encapsulation structure
04/21/2010CN201440412U Power source electronic constructing module and electronic encapsulating structure
04/21/2010CN201440411U IGBT heat dissipation system and IGBT power supply applied to the system
04/21/2010CN201440410U Infrared receiving head
04/21/2010CN201440406U Lead frame member and inking rework tool thereof
04/21/2010CN201439938U Heat radiation structure of LED lamp
04/21/2010CN201439936U Dust-proof LED street lamp radiating body
04/21/2010CN201439890U Liquid-cooling and nanometer panel LED energy-saving lamp
04/21/2010CN201439876U Heat dissipation LED spot lamp
04/21/2010CN1992173B Method and structure for implanting bonded substrates for electrical conductivity
04/21/2010CN1988789B Fan heat sink and method and system using same
04/21/2010CN1945947B Rectifier layout structure of locomotive large element heat tube radiation
04/21/2010CN1732199B Curable resin composition and products of curing thereof
04/21/2010CN1720108B Thermally conductive EMI shield
04/21/2010CN1691286B Electrode contact structure and method for production thereof
04/21/2010CN1645515B Nonvolatile semiconductor memory
04/21/2010CN1578614B Axial-flow fan unit and heat-emitting element cooling apparatus
04/21/2010CN1574335B Semiconductor power device having a diamond shaped metal interconnect scheme
04/21/2010CN1519930B Semiconductor device, electronic apparatus. their manufacture method and electronic instrument
04/21/2010CN101697355A Evenly-triggered semiconductor silicon-controlled rectifier controller for ESD
04/21/2010CN101697351A Structure for testing semiconductor
04/21/2010CN101697349A A surface geometry for mos-gated device
04/21/2010CN101697348A Small-carrier flat-four-side pin-less packaging part and preparation method thereof
04/21/2010CN101697347A Plate thyristor and plate transistor as well as application technology thereof
04/21/2010CN101697344A Method for reducing current on bonded leads of power supply pads of chip
04/21/2010CN101697343A Film encapsulation method
04/21/2010CN101697339A Mechanism for monitoring CMP sinking degree of damascene and resistivity test method thereof
04/21/2010CN101697054A A pixel design for a liquid crystal display capable of increasing opening rate
04/21/2010CN101697052A Active component array motherboard and manufacturing method thereof
04/21/2010CN101696791A Method for manufacturing LED street lamp and street lamp thereof
04/21/2010CN101696789A Heat radiating structure of light emitting diode (LED) illuminating lamp
04/21/2010CN101696788A Annular structure with conductive radiating fins for LED lamp
04/21/2010CN101696779A High-power LED lamp effectively lowering packaging thermal resistance
04/21/2010CN101696775A LED lamp with favorable heat radiating performance
04/21/2010CN101696317A Epoxy resin composite taking spherical silicon powder as filler, preparation method and application thereof
04/21/2010CN101504689B Radiator optimizing parameter confirming method
04/21/2010CN101447534B Light emitting diode and preparation method thereof
04/21/2010CN101404265B 集成电路半导体器件 The semiconductor integrated circuit device
04/21/2010CN101399253B Method for cutting fuse-wires by laser, test structure and method thereof and test wafer
04/21/2010CN101373754B An integrated circuit chip having magnetic devices
04/21/2010CN101364016B Thin-film transistor LCD pixel structure and its making method
04/21/2010CN101315923B Chip stack package structure
04/21/2010CN101290874B Forming method of grooves with shallow groove isolation and semiconductor structure
04/21/2010CN101281909B NMOS pipe built-in bidirectional thyristor electrostatic protection device
04/21/2010CN101272050B Integrated circuit with electrostatic protection structure
04/21/2010CN101256993B 半导体器件 Semiconductor devices
04/21/2010CN101243552B Radio frequency identification device and method for manufacturing radio frequency identification device
04/21/2010CN101236943B Heat-radiation no-chip board film base plate with built-in chip and its making method
04/21/2010CN101197348B Multi-use polysilicon edge test structure
04/21/2010CN101174616B 电路装置 Circuit device
04/21/2010CN101150945B 散热器 Heat sink
04/21/2010CN101125482B Structure with through hole, production method thereof, and liquid discharge head
04/21/2010CN101097914B Thin film device having thin film element and manufacturing method thereof
04/21/2010CN101086963B Method of growing gallium nitride crystal
04/20/2010USRE41242 Package substrate
04/20/2010US7701743 Electronic circuit package
04/20/2010US7701721 Easily disassembling cooling apparatus
04/20/2010US7701708 Heat dissipation assembly
04/20/2010US7701424 Display panel having a substratum and a plurality of scan lines formed on the substratum, a display device, and electronic device thereof
04/20/2010US7701074 Semiconductor device with a buffer region with tightly-packed filler particles
04/20/2010US7701073 Locking feature and method for manufacturing transfer molded IC packages
04/20/2010US7701072 Semiconductor device and manufacturing method therefor
04/20/2010US7701071 Method for fabricating flip-attached and underfilled semiconductor devices
04/20/2010US7701070 Integrated circuit and method of implementing a contact pad in an integrated circuit
04/20/2010US7701069 Solder interface locking using unidirectional growth of an intermetallic compound
04/20/2010US7701068 Multi-chip package
04/20/2010US7701067 Method for manufacturing semiconductor package capable of potting thermosetting resin while being heated
04/20/2010US7701066 Semiconductor wafer, panel and electronic component with stacked semiconductor chips, and also method for producing same
04/20/2010US7701064 Apparatus for improved power distribution in a three dimensional vertical integrated circuit
04/20/2010US7701063 Semiconductor device
04/20/2010US7701062 Semiconductor device and method for producing the same
04/20/2010US7701061 Semiconductor device with solder balls having high reliability
04/20/2010US7701060 Wiring structure and method for manufacturing the same
04/20/2010US7701059 Low resistance metal silicide local interconnects and a method of making
04/20/2010US7701058 Undoped polysilicon metal silicide wiring
04/20/2010US7701057 Semiconductor device having structures for reducing substrate noise coupled from through die vias
04/20/2010US7701056 Redistribution connecting structure of solder balls
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