| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 04/27/2010 | US7705432 Three dimensional six surface conformal die coating |
| 04/27/2010 | US7705420 Method for producing a conductor path on a substrate, and a component having a conductor path fabricated in accordance with such a method |
| 04/27/2010 | US7705411 MEMS-topped integrated circuit with a stress relief layer |
| 04/27/2010 | US7705404 Electrostatic discharge protection device and layout thereof |
| 04/27/2010 | US7705403 Programmable ESD protection structure |
| 04/27/2010 | US7705383 Integrated circuitry for semiconductor memory |
| 04/27/2010 | US7705382 Scalable lead zirconium titanate (PZT) thin film material and deposition method, and ferroelectric memory device structures comprising such thin film material |
| 04/27/2010 | US7705365 Lighting device and light emitting module for the same |
| 04/27/2010 | US7705353 Bonding pad, active device array substrate and liquid crystal display panel |
| 04/27/2010 | US7705352 Test structure for estimating electromigration effects with increased robustness with respect to barrier defects in vias |
| 04/27/2010 | US7705351 Flip chip semiconductor packaging device and testing method using first and second reflectors for determining gap between chip and circuit board or first and second chips |
| 04/27/2010 | US7705350 Fractional biasing of semiconductors |
| 04/27/2010 | US7705349 Test inserts and interconnects with electrostatic discharge structures |
| 04/27/2010 | US7705342 Porous semiconductor-based evaporator having porous and non-porous regions, the porous regions having through-holes |
| 04/27/2010 | US7704892 Semiconductor device having local interconnection layer and etch stopper pattern for preventing leakage of current |
| 04/27/2010 | US7704864 Method of manufacturing a superjunction device with conventional terminations |
| 04/27/2010 | US7704805 Fuse structures, methods of making and using the same, and integrated circuits including the same |
| 04/27/2010 | US7704801 Resin for sealing semiconductor device, resin-sealed semiconductor device and the method of manufacturing the semiconductor device |
| 04/27/2010 | US7704799 Method of manufacturing wiring substrate |
| 04/27/2010 | US7704794 Method of forming a semiconductor device |
| 04/27/2010 | US7704792 Semiconductor device and method of manufacturing the same |
| 04/27/2010 | US7704791 Packaging of integrated circuits with carbon nano-tube arrays to enhance heat dissipation through a thermal interface |
| 04/27/2010 | US7704762 Lamp and method of producing a lamp |
| 04/27/2010 | US7704757 Method for adjusting an electrical parameter on an integrated electronic component |
| 04/27/2010 | US7704607 cured product of a polysiloxane with monomers having two vinyl groups, an organohydrogenpolysiloxane, Zn, Fe, Sn metal powder which is sulfidable with a sulfur-containing gas into a metal sulfide powder which prevents orthe sulfur-containing gas from reachingelectric and electronic parts |
| 04/27/2010 | US7704416 Conductor paste for ceramic substrate and electric circuit |
| 04/27/2010 | US7703199 Method to accommodate increase in volume expansion during solder reflow |
| 04/22/2010 | WO2010045413A1 Electrostatic discharge (esd) shielding for stacked ics |
| 04/22/2010 | WO2010045187A1 Semiconductor substrates with unitary vias and via terminals, and associated systems and methods |
| 04/22/2010 | WO2010044783A1 Semiconductor package having marking layer |
| 04/22/2010 | WO2010044741A1 Method for making via interconnection |
| 04/22/2010 | WO2010044408A1 Bonding method, bonded structure, method for producing optical module, and optical module |
| 04/22/2010 | WO2010044374A1 Heat dissipation structure |
| 04/22/2010 | WO2010044315A1 Through electrode substrate, method for manufacturing the through electrode substrate, and semiconductor device using the through electrode substrate |
| 04/22/2010 | WO2010044125A1 Heatsink and electric power amplifier with the same |
| 04/22/2010 | WO2010044047A1 Cooling arrangement |
| 04/22/2010 | WO2010044011A1 A system for heat conduction between two connectable members |
| 04/22/2010 | WO2010043580A1 Leadframe for electronic components |
| 04/22/2010 | WO2010043502A1 Stress-reduced ni-p/pd stacks for bondable wafer surfaces |
| 04/22/2010 | WO2010043205A1 Electrical terminal lead for a semiconductor component, semiconductor component, and method for producing an electrical terminal lead |
| 04/22/2010 | US20100100078 Analyte Monitoring Device and Methods of Use |
| 04/22/2010 | US20100099969 Analyte Monitoring Device and Methods of Use |
| 04/22/2010 | US20100099968 Analyte Monitoring Device and Methods of Use |
| 04/22/2010 | US20100099967 Analyte Monitoring Device and Methods of Use |
| 04/22/2010 | US20100099219 Mitigation of plating stub resonance by controlling surface roughness |
| 04/22/2010 | US20100096761 Semiconductor substrate for build-up packages |
| 04/22/2010 | US20100096760 Bond Pad Design with Reduced Dishing Effect |
| 04/22/2010 | US20100096759 Semiconductor substrates with unitary vias and via terminals, and associated systems and methods |
| 04/22/2010 | US20100096758 Electric power semiconductor device |
| 04/22/2010 | US20100096757 Method and System for Distributing Clock Signals on Non Manhattan Semiconductor Integrated Circuits |
| 04/22/2010 | US20100096756 Semiconductor device and method of manufacturing the same |
| 04/22/2010 | US20100096754 Semiconductor package, semiconductor module, and method for fabricating the semiconductor package |
| 04/22/2010 | US20100096753 Through-silicon via structures providing reduced solder spreading and methods of fabricating the same |
| 04/22/2010 | US20100096752 Semiconductor device |
| 04/22/2010 | US20100096751 Semiconductor device |
| 04/22/2010 | US20100096750 Packaging substrate |
| 04/22/2010 | US20100096749 Semiconductor package and manufacturing method thereof |
| 04/22/2010 | US20100096748 Combined semiconductor apparatus with semiconductor thin film |
| 04/22/2010 | US20100096747 Semiconductor device and method of manufacturing the same |
| 04/22/2010 | US20100096746 Package module structure of compound semiconductor devices and fabricating method thereof |
| 04/22/2010 | US20100096745 Bonded wafer structure and method of fabrication |
| 04/22/2010 | US20100096744 Printed wiring board and method for manufacturing the same |
| 04/22/2010 | US20100096743 Input/output package architectures, and methods of using same |
| 04/22/2010 | US20100096742 Cut-out heat slug for integrated circuit device packaging |
| 04/22/2010 | US20100096741 Chip-Stacked Package Structure and Method for Manufacturing the Same |
| 04/22/2010 | US20100096739 Stacked semiconductor module |
| 04/22/2010 | US20100096738 Ic die having tsv and wafer level underfill and stacked ic devices comprising a workpiece solder connected to the tsv |
| 04/22/2010 | US20100096737 Stackable semiconductor assemblies and methods of manufacturing such assemblies |
| 04/22/2010 | US20100096736 Semiconductor Device and Manufacturing Method Thereof |
| 04/22/2010 | US20100096735 Clamping assembly |
| 04/22/2010 | US20100096734 Thermally improved semiconductor qfn/son package |
| 04/22/2010 | US20100096732 Semiconductor integrated circuit device |
| 04/22/2010 | US20100096731 Semiconductor Device and Method of Forming Stepped-Down RDL and Recessed THV in Peripheral Region of the Device |
| 04/22/2010 | US20100096730 Passivation technique |
| 04/22/2010 | US20100096729 Geometry and design for conformal electronics |
| 04/22/2010 | US20100096728 Nitride semiconductor sustrate and method of fabricating the same. |
| 04/22/2010 | US20100096725 Semiconductor Package with Embedded Spiral Inductor |
| 04/22/2010 | US20100096724 Semiconductor device |
| 04/22/2010 | US20100096723 Semiconductor device |
| 04/22/2010 | US20100096719 Methods of forming fine patterns in integrated circuit devices |
| 04/22/2010 | US20100096717 Electronic device and process for manufacturing electronic device |
| 04/22/2010 | US20100096708 Chip Module for Installing in Sensor Chip Cards for Fluidic Applications and Method for Producing a Chip Module of This Type |
| 04/22/2010 | US20100096704 Suspended nanochannel transistor structure and method for fabricating the same |
| 04/22/2010 | US20100096666 Laminar structure on a semiconductor substrate |
| 04/22/2010 | US20100096662 Semiconductor chip assembly with post/base heat spreader and signal post |
| 04/22/2010 | US20100096176 Contact structure of a wires and method manufacturing the same, and thin film transistor substrate including the contact structure and method manufacturing the same |
| 04/22/2010 | US20100096117 Radiator plate, perforated plate and methods of making the same |
| 04/22/2010 | US20100095519 Apparatus for manufacturing wireless communication device |
| 04/22/2010 | DE202009013745U1 Eine Wärmeableitvorrichtung für eine elektronische Komponente A heat sink for an electronic component |
| 04/22/2010 | DE112008001282T5 Kühlvorrichtung Cooler |
| 04/22/2010 | DE102009044961A1 Chipintegrierte HF-Abschirmungen mit rückseitigen Umverdrahtungsleitungen Chip Integrated RF shields with rear redistribution |
| 04/22/2010 | DE102009044956A1 Chipintegrierte HF-Abschirmungen mit Durch-Substrat-Leitern Chip Integrated RF shields with through substrate conductors |
| 04/22/2010 | DE102009044955A1 Chipintegrierte Hochfrequenzabschirmung mit Zwischenverbindungsmetallisierung Chip Integrated RF shielding with interconnect metallization |
| 04/22/2010 | DE102009044952A1 Chipintegrierte HF-Abschirmungen mit vorderseitigen Umverdrahtungsleitungen Chip Integrated RF shields with front redistribution |
| 04/22/2010 | DE102009034578A1 Halbleiteranordnung und Verfahren zum Herstellen einer Halbleiteranordnung A semiconductor device and method of manufacturing a semiconductor device |
| 04/22/2010 | DE102009027351A1 Leistungshalbleitermodul The power semiconductor module |
| 04/22/2010 | DE102008051928A1 Elektrischer Anschlussleiter für ein Halbleiterbauelement, Halbleiterbauelement und Verfahren zur Herstellung eines elektrischen Anschlussleiters Electrical connection conductor for a semiconductor device, semiconductor device and method for manufacturing an electrical connecting conductor |
| 04/22/2010 | DE102008051256A1 Halbleiter-Strahlungsquelle Semiconductor radiation source |
| 04/22/2010 | DE102008044988A1 Verwenden einer Deckschicht in Metallisierungssystemen von Halbleiterbauelementen als CMP- und Ätzstoppschicht Use of a cover layer metallization in semiconductor devices as a CMP etch stop layer and |
| 04/22/2010 | DE102008044964A1 Verringerung der Leckströme und des dielektrischen Durchschlags in dielektrischen Materialien von Metallisierungssysteme von Halbleiterbauelementen durch die Herstellung von Aussparungen Reducing the leakage current and the dielectric breakdown in the dielectric materials of metallization of semiconductor devices by the production of recesses |