Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
04/2010
04/29/2010DE102008052898A1 Defined surface temperature providing device for use during testing of electrical component of e.g. aircraft in burn-in test, has bodies thermally coupled with each other, where thermal coupling between bodies is varied using valve device
04/29/2010DE102008051491A1 Leadframe für elektronische Bauelemente Leadframe for electronic components
04/29/2010DE102006062728B4 Halbleitervorrichtung und Herstellungsverfahren dafür A semiconductor device and manufacturing method thereof
04/29/2010DE102005013533B4 Halbbrücken-/Vollbrücken-Schaltungsanordnung sowie dafür geeigneter p-Kanal-MOS-Feldeffekttransistor Half-bridge / full-bridge circuit and suitable for p-channel MOS field effect transistor
04/29/2010DE102004064150B4 Elektronisches Bauteil mit Gehäuse mit leitfähiger Beschichtung zum ESD-Schutz Electronic component with housing with conductive coating for ESD protection
04/29/2010DE10121901B4 Speichersystem Storage system
04/28/2010EP2180505A2 Wafer-level fabrication of a package with stud bumps coated with solder
04/28/2010EP2179976A1 Composite material having high thermal conductivity and low thermal expansion coefficient
04/28/2010EP2179446A2 Tiled light sensing array
04/28/2010EP2179445A1 Semiconductor package and camera module
04/28/2010EP2179444A1 Semiconductor package including through-hole electrode and light-transmitting substrate
04/28/2010EP2179443A1 Unit and production of a unit
04/28/2010EP2179442A2 Semiconductor die having a redistribution layer
04/28/2010EP1133796B2 A method for producing a two-dimensional support for semiconductor chips
04/28/2010CN201444736U Energy-saving environment-friendly heat radiating device
04/28/2010CN201444734U High-power electronic device radiator based on heat pipe principle
04/28/2010CN201444733U Silent radiator
04/28/2010CN201444478U Diamond LED module
04/28/2010CN201444477U CPU radiator
04/28/2010CN201443741U Self-circulation heat dissipating device in high-power street lamp
04/28/2010CN201443714U LED solar lamp
04/28/2010CN201443706U LED street lamp
04/28/2010CN201443695U Crown led illuminating lamp
04/28/2010CN201443694U Radiating LED illuminating lamp of loop type heat-pipe radiator
04/28/2010CN1886707B Circuit substrate manufacturing method and system, substrate used for the same, and circuit substrate using the same
04/28/2010CN1875481B Semiconductor device and process for fabricating the same
04/28/2010CN1870254B Cooling system of portable equipment
04/28/2010CN1830091B H-bridge with single lead frame
04/28/2010CN1808792B Electric connector and heat radiation module with the same
04/28/2010CN1781189B Electronic component and method of manufacturing same
04/28/2010CN1759492B Method for manufacturing solid element device
04/28/2010CN1714446B IC tiling pattern method, IC so formed and analysis method
04/28/2010CN1701952B Layer sequence for producing a composite material for electromechanical components
04/28/2010CN1697164B Carrier tape, a method of manufacturing an electronic device with the carrier tape, and a tape carrier package with the carrier tape
04/28/2010CN1692529B Production method for component to be soldered
04/28/2010CN1681099B Method for forming interconnection structure
04/28/2010CN1639866B EMI shield including a lossy medium
04/28/2010CN1638089B Interconnect structures on substrate and its manufacture method
04/28/2010CN1637174B Electrolytic stripping method
04/28/2010CN1619805B Bond pad for flip chip package and semiconductor assembly
04/28/2010CN1610969B Process for forming metalized contacts to periphery transistors
04/28/2010CN1577811B Semiconductor package seal ring structure and producing method thereof and semiconductor package structure
04/28/2010CN1574321B Bond pad structure for cu process and its manufacture method
04/28/2010CN1571130B Lead frame for reinforcing lower joint alignment in automatic lead bonding process
04/28/2010CN1523665B 半导体装置及其制造方法 Semiconductor device and manufacturing method thereof
04/28/2010CN101699630A Ldmos power device
04/28/2010CN101699625A High trigger current SCR and ESD protective device
04/28/2010CN101699623A 半导体装置 Semiconductor device
04/28/2010CN101699622A Packaging structure and packaging method of semiconductor device
04/28/2010CN101699621A Semiconductor packaging structure and packaging method
04/28/2010CN101699620A 半导体装置 Semiconductor device
04/28/2010CN101699144A Water cooling high-power LED street lamp cap
04/28/2010CN101699135A Common LED lamp bulb
04/28/2010CN101073152B Electronic package having down-set leads and method
04/27/2010US7706887 Method for integrating pre-fabricated chip structures into functional electronic systems
04/27/2010US7705925 Method of manufacturing an array substrate for use in a LCD device
04/27/2010US7705697 Waveguide coupler
04/27/2010US7705691 Capacitor interconnection
04/27/2010US7705477 Optical targets
04/27/2010US7705476 Integrated circuit package
04/27/2010US7705475 Integrated circuit package system
04/27/2010US7705474 Connection structure for connecting flexible printed circuit to main substrate using a potting resin in a through-hole
04/27/2010US7705473 Methods and apparatus for determining pad height for a wire-bonding operation in an integrated circuit
04/27/2010US7705472 Semiconductor device with semiconductor device components embedded in a plastic housing composition
04/27/2010US7705471 Conductive bump structure of circuit board and method for forming the same
04/27/2010US7705470 Semiconductor switching module and method
04/27/2010US7705469 Lead frame, semiconductor device using same and manufacturing method thereof
04/27/2010US7705468 Stacked semiconductor package that prevents damage to semiconductor chip when wire-bonding and method for manufacturing the same
04/27/2010US7705467 Stacked package electronic device
04/27/2010US7705466 Three dimensional multi layer memory and control logic integrated circuit structure
04/27/2010US7705465 Surface-mount type optical semiconductor device and method for manufacturing the same
04/27/2010US7705464 Connection structure for semiconductor devices
04/27/2010US7705463 Biasing device for low parasitic capacitance in integrated circuit applications
04/27/2010US7705462 Semiconductor device and a method of manufacturing the same
04/27/2010US7705461 Structure of tag integrated circuit flexible board
04/27/2010US7705458 Bulk metallic glass solders, foamed bulk metallic glass solders, foamed-solder bond pads in chip packages, methods of assembling same, and systems containing same
04/27/2010US7705457 Wafer level semiconductor package and method for manufacturing the same
04/27/2010US7705456 Semiconductor package substrate
04/27/2010US7705455 Semiconductor device
04/27/2010US7705453 Semiconductor device
04/27/2010US7705452 Carrier assembly for an integrated circuit
04/27/2010US7705451 Semiconductor device and method of manufacturing the same
04/27/2010US7705450 Decoupling capacitor closely coupled with integrated circuit
04/27/2010US7705449 Cooling apparatus for memory module
04/27/2010US7705448 Semiconductor device for pipe for passing refrigerant liquid
04/27/2010US7705447 Input/output package architectures, and methods of using same
04/27/2010US7705446 Package structure having semiconductor chip embedded therein and method for fabricating the same
04/27/2010US7705445 Semiconductor package with low and high-speed signal paths
04/27/2010US7705444 Semiconductor device with lead frame having lead terminals with wide portions of trapezoidal cross section
04/27/2010US7705443 Semiconductor device with lead frame including conductor plates arranged three-dimensionally
04/27/2010US7705442 Contact device for use in a power semiconductor module or in a disc-type thyristor
04/27/2010US7705441 Semiconductor module
04/27/2010US7705440 Substrate having through-wafer vias and method of forming
04/27/2010US7705439 Destructor integrated circuit chip, interposer electronic device and methods
04/27/2010US7705438 Electronic component and leadframe for producing the component
04/27/2010US7705437 Semiconductor device
04/27/2010US7705436 Semiconductor device with semiconductor chip and method for producing it
04/27/2010US7705435 Lead frame structure of light emitting diode
04/27/2010US7705434 Power semiconductor component having chip stack
04/27/2010US7705433 Semiconductor package preventing generation of static electricity therein
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