Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
05/2010
05/04/2010US7709754 Current sensor
05/04/2010US7709746 Pb-free solder-connected structure and electronic device
05/04/2010US7709401 Method of making thermally programmable anti-reverse engineering interconnects wherein interconnects only conduct when heated above room temperature
05/04/2010US7709390 Methods of isolating array features during pitch doubling processes and semiconductor device structures having isolated array features
05/04/2010US7709388 Semiconductor device with a line and method of fabrication thereof
05/04/2010US7709379 Electrical device comprising conductors made of carbonized plastic, and method and apparatus for the production thereof
05/04/2010US7709376 Method for fabricating semiconductor device and semiconductor device
05/04/2010US7709306 Active layer island
05/04/2010US7709304 Thin film transistor array panel, manufacturing method thereof, and mask therefor
05/04/2010US7709296 Coupling metal clad fiber optics for enhanced heat dissipation
05/04/2010US7709279 Methods for testing semiconductor devices methods for protecting the same from electrostatic discharge events during testing, and methods for fabricating inserts for use in testing semiconductor devices
05/04/2010US7709098 Multi-layered thermally conductive sheet
05/04/2010US7709079 Annealing is carried out to effectuate phase separation between the two or more immiscible polymeric block components in the block copolymer layer, thereby forming periodic patterns that are defined by repeating structural units; semiconductor structures
05/04/2010US7708050 Composite material, having high thermal conductivity and low thermal expansion coefficient, and heat-dissipating substrate, and their production methods
05/04/2010US7707713 Component-embedded circuit board fabrication method
05/04/2010CA2381081C Dual wafer attachment process
05/03/2010CA2682594A1 Insulating and dissipating heat structure of an electronic part
04/2010
04/29/2010WO2010048102A2 Integrated sensor including sensing and processing die mounted on opposite sides of package substrate
04/29/2010WO2010047991A1 Method and system for amplifying a signal using a transformer matched transistor
04/29/2010WO2010047503A2 Thin sensor device protected by resin
04/29/2010WO2010047402A1 Semiconductor apparatus and manufacturing method thereof
04/29/2010WO2010047278A1 Heat conducting sheet, manufacturing method thereof, and heat radiator that utilizes same
04/29/2010WO2010047264A1 Positive photosensitive resin composition for spray coating and method for producing through electrode using same
04/29/2010WO2010047228A1 Wiring board and method for manufacturing same
04/29/2010WO2010047227A1 Semiconductor device and method for manufacturing same
04/29/2010WO2010047118A1 Semiconductor device and method for manufacturing same
04/29/2010WO2010047105A1 Sputtering target for forming thin film transistor wiring film
04/29/2010WO2010047030A1 Nitride semiconductor device
04/29/2010WO2010047010A1 Semiconductor device and method for manufacturing the same
04/29/2010WO2010047007A1 Manufacturing method of electronic parts module
04/29/2010WO2010047006A1 Semiconductor device and method for manufacturing the same
04/29/2010WO2010046845A1 Wireless interconnect for an integrated circuit
04/29/2010WO2010046825A1 Method for manufacturing a microelectronic package comprising at least one microelectronic device
04/29/2010WO2010046674A1 Improved wafer level chip scale packaging
04/29/2010WO2010046673A1 Improved metal-on-metal capacitor with diagonal feedline
04/29/2010WO2010046563A1 Assembly of a grooved microelectronic chip with a toroidal wire element and method of assembling it
04/29/2010WO2009152284A3 Improved method and apparatus for wafer bonding
04/29/2010US20100106001 Analyte Monitoring Device and Methods of Use
04/29/2010US20100103619 Interchangeable Heat Exchanger for a Circuit Board
04/29/2010US20100103389 Multi-MEMS Single Package MEMS Device
04/29/2010US20100102461 Semiconductor device and method of manufacturing the same
04/29/2010US20100102460 Semiconductor device and manufacturing method thereof
04/29/2010US20100102459 Semiconductor device
04/29/2010US20100102458 Semiconductor package system with cavity substrate and manufacturing method therefor
04/29/2010US20100102457 Hybrid Semiconductor Chip Package
04/29/2010US20100102456 Semiconductor Device and Method of Forming Double-Sided Through Vias in Saw Streets
04/29/2010US20100102455 Semiconductor device and method of manufacturing the same
04/29/2010US20100102454 Semiconductor device and method of manufacturing the semiconductor device
04/29/2010US20100102453 Three-Dimensional Integrated Circuit Stacking-Joint Interface Structure
04/29/2010US20100102452 Method for fabricating semiconductor device and semiconductor device
04/29/2010US20100102451 Semiconductor device and method for manufacturing the same
04/29/2010US20100102450 Zinc oxide based composites and methods for their fabrication
04/29/2010US20100102449 Semiconductor device and method for fabricating the same
04/29/2010US20100102448 Semiconductor device and method of fabricating the same
04/29/2010US20100102447 Substrate of window ball grid array package and method for making the same
04/29/2010US20100102446 Semiconductor electronic component and semiconductor device using the same
04/29/2010US20100102445 Wiring substrate, solid-state imaging apparatus using the same, and manufacturing method thereof
04/29/2010US20100102444 Wafer level package using stud bump coated with solder
04/29/2010US20100102443 High-frequency semiconductor device
04/29/2010US20100102442 Heat spreader having single layer of diamond particles and associated methods
04/29/2010US20100102441 Semiconductor device
04/29/2010US20100102440 High density three dimensional semiconductor die package
04/29/2010US20100102439 Semiconductor device with protective screen
04/29/2010US20100102438 Semiconductor device and method of manufacturing the same
04/29/2010US20100102437 Semiconductor package and manufacturing method thereof
04/29/2010US20100102436 Shrink package on board
04/29/2010US20100102435 Method and apparatus for reducing semiconductor package tensile stress
04/29/2010US20100102434 Semiconductor memory device having improved voltage transmission path and driving method thereof
04/29/2010US20100102433 Apparatus for use in semiconductor wafer processing for laterally displacing individual semiconductor devices away from one another
04/29/2010US20100102432 Semiconductor package
04/29/2010US20100102431 Power module and inverter for vehicles
04/29/2010US20100102430 Semiconductor multi-chip package
04/29/2010US20100102429 Flip-chip package structure with block bumps and the wedge bonding method thereof
04/29/2010US20100102427 Semiconductor packaging device
04/29/2010US20100102426 Dual face package and method of manufacturing the same
04/29/2010US20100102425 Ultra wideband system-on-package and method of manufacturing the same
04/29/2010US20100102424 Semiconductor device and fabrication method therefor
04/29/2010US20100102423 Semiconductor device manufacturing method, semiconductor device, and wiring board
04/29/2010US20100102422 Semiconductor device
04/29/2010US20100102421 Integrated circuit chip with seal ring structure
04/29/2010US20100102416 Integrated Circuit Packages Incorporating an Inductor and Methods
04/29/2010US20100102392 Electrostatic discharge protection circuit and integrated circuit device including electrostatic discharge protection circuit
04/29/2010US20100102348 Lead frame unit, package structure and light emitting diode device having the same
04/29/2010US20100102331 Ohmic electrode for sic semiconductor, method of manufacturing ohmic electrode for sic semiconductor, semiconductor device, and method of manufacturing semiconductor device
04/29/2010US20100102318 Semiconductor device, semiconductor module, and electronic apparatus including process monitoring pattern overlapping with I/O pad
04/29/2010US20100102317 Semiconductor wafer, semiconductor device, semiconductor module and electronic apparatus including guard ring patterns and process monitoring pattern
04/29/2010US20100102316 Test structure for charged particle beam inspection and method for fabricating the same
04/29/2010US20100101878 Semiconductor device and electrically powered vehicle
04/29/2010US20100101838 Multilayer printed wiring board
04/29/2010DE202009017595U1 Vapor-Chamber-Kühler Vapor Chamber cooler
04/29/2010DE202009017594U1 Vapor-Chamber-Kühler mit umlaufendem Wärmeleitrohr Vapor Chamber cooler with circulating heat pipe
04/29/2010DE19653499B4 Lotzuführgerät und Lotzuführverfahren Lotzuführgerät and Lotzuführverfahren
04/29/2010DE112008001410T5 Halbleiterelementkühlstruktur Semiconductor element cooling structure
04/29/2010DE112008000248T5 Im Waferbonding-Zwischenraum gebildete Chipkühlkanäle Chip cooling channels in the wafer bonding space formed
04/29/2010DE102009043256A1 Bildsensor und Verfahren zu seiner Herstellung Image sensor and method for its preparation
04/29/2010DE102009043255A1 Bildsensor und Verfahren zu seiner Herstellung Image sensor and method for its preparation
04/29/2010DE102009042921A1 Halbleiterbauelement Semiconductor device
04/29/2010DE102009042319A1 Sensorknoten-Modul Sensor node module
04/29/2010DE102009035953A1 Einrichtung zum schutz vor elektrostatischen Entladungen Means for protection against electrostatic discharges
04/29/2010DE102008053489A1 Trägerkörper für ein Halbleiterbauelement, Halbleiterbauelement und Verfahren zur Herstellung eines Trägerkörpers A carrier body for a semiconductor device, semiconductor device and method for producing a support body
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