Patents
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
05/2010
05/05/2010CN201448802U Radiator built-in cavity columnar light-emitting diode lamp wick
05/05/2010CN201448799U LED heat radiating structure
05/05/2010CN201448798U Heat radiation device for LED lamp
05/05/2010CN201448797U Radiating structure of high-power LED lamp
05/05/2010CN201448796U High-power LED lamp with quick heat dissipation
05/05/2010CN201448795U Universal LED radiator
05/05/2010CN201448793U High heat radiation structure of LED fluorescent tube
05/05/2010CN201448792U Radiating device of high-power LED lamp
05/05/2010CN201448790U Hot-pipe tilted communication split type LED street lamp radiating device
05/05/2010CN201448708U Heat dissipation large LED street lamp with inclined heat tube
05/05/2010CN201448707U Ultra-large power LED street lamp with heat pipe for heat dissipation
05/05/2010CN201448703U Easy heat-radiation LED barrel lamp
05/05/2010CN201448677U LED street lamp with heat pipe for heat dissipation
05/05/2010CN201448656U LED panel lamp
05/05/2010CN201448649U LED light resource
05/05/2010CN201448634U LED fluorescent tube
05/05/2010CN201448619U Liquid heat radiation LED lamp
05/05/2010CN201448618U Dispersed liquid heat emission LED lamp
05/05/2010CN201445813U Low smoke machine
05/05/2010CN1985379B Covers for microelectronic imagers and methods for wafer-level packaging of microelectronic imagers
05/05/2010CN1984747B Weldment and its application in electric structure unit
05/05/2010CN1962713B Fluorine-containing phenol resin derivative and its composition and preparation method
05/05/2010CN1954275B 生产系统 Production System
05/05/2010CN1950939B Semiconductor device
05/05/2010CN1926680B Integrated circuit chip utilizing carbon nanotube composite interconnection vias
05/05/2010CN1922728B 半导体装置 Semiconductor device
05/05/2010CN1906758B Composite ceramic substrate
05/05/2010CN1901178B Relay board and semiconductor device having the relay board
05/05/2010CN1837147B Thermal interface material and its production method
05/05/2010CN1832212B LED component and method for fabricating the same
05/05/2010CN1770440B Semiconductor lead frame, method of plating the same, and semiconductor package having the same
05/05/2010CN1767186B Lead frame and semiconductor package therefor
05/05/2010CN1750255B Semiconductor composite device, method for manufacturing it, LED head and image forming apparatus
05/05/2010CN1744303B Package substrate for a semiconductor device, a fabrication method for same, and a semiconductor device
05/05/2010CN1737947B Tubular radiator core combined template
05/05/2010CN1732565B Methods for performing substrate imprinting using thermoset resin varnishes and products formed therefrom
05/05/2010CN1705123B Semiconductor device
05/05/2010CN1702839B Method of manufacturing semiconductor device and support structure for semiconductor substrate
05/05/2010CN1700434B Integrate circuit device, manufacturing method thereof and integrate circuit combination welding disc device
05/05/2010CN1653388B Patterning semiconductor layers using phase shifting and assist features
05/05/2010CN1647105B Module for a data carrier and data carrier provided with the module
05/05/2010CN1637566B Flat panel display device and method of fabricating the same
05/05/2010CN1630069B Package for mounting an optical element and a method of manufacturing the same
05/05/2010CN1595442B Memory card
05/05/2010CN1549336B 半导体装置 Semiconductor device
05/05/2010CN1545002B Cooling system for electronic apparatus
05/05/2010CN1532919B Circuit device and its producing method
05/05/2010CN1518099B Lead frame and its manufacturing method and semiconductor device using the lead frame
05/05/2010CN1467832B Recovery processing method of an electrode
05/05/2010CN101702408A Semiconductor device and manufacturing method thereof
05/05/2010CN101702407A Non-polarity 485 chip
05/05/2010CN101702400A Circuit substrate and technology thereof
05/05/2010CN101019229B Semiconductor device
05/04/2010US7712147 Method and device for protection of an mram device against tampering
05/04/2010US7710728 Electronic device
05/04/2010US7710727 Heat sink assembly
05/04/2010US7710032 Encapsulation structure for display devices
05/04/2010US7709969 Solid-state imaging device and method of manufacturing solid-state imaging device
05/04/2010US7709968 Micro pin grid array with pin motion isolation
05/04/2010US7709967 Shapes-based migration of aluminum designs to copper damascene
05/04/2010US7709966 Large substrate structural vias
05/04/2010US7709965 Metal line of semiconductor device and method of manufacturing the same
05/04/2010US7709963 Audio power amplifier package
05/04/2010US7709960 Dual liner capping layer interconnect structure
05/04/2010US7709958 Growing a film by an intermixing growth process or by depositing a film comprising chalcogenides of copper and/or silver (but excluding oxides), such as copper sulfide over the sidewalls and/or bottom surfaces of the interconnect; adhesion; semiconductors; microelectronics; flip chips; packaging
05/04/2010US7709957 Semiconductor device
05/04/2010US7709956 Copper-topped interconnect structure that has thin and thick copper traces and method of forming the copper-topped interconnect structure
05/04/2010US7709955 Semiconductor device with a line and method of fabrication thereof
05/04/2010US7709954 Redistribution layer for wafer-level chip scale package and method therefor
05/04/2010US7709953 Semiconductor device
05/04/2010US7709952 Light emitting diode package
05/04/2010US7709951 Thermal pillow
05/04/2010US7709950 Silicon wafer having through-wafer vias
05/04/2010US7709949 Densely packed metal segments patterned in a semiconductor die
05/04/2010US7709948 Organic light-emitting display device
05/04/2010US7709947 Semiconductor device having semiconductor element with back electrode on insulating substrate
05/04/2010US7709946 Micro universal serial bus (USB) memory package
05/04/2010US7709945 Multichip sensor
05/04/2010US7709944 Integrated circuit package system with package integration
05/04/2010US7709943 Stacked ball grid array package module utilizing one or more interposer layers
05/04/2010US7709942 Semiconductor package, including connected upper and lower interconnections
05/04/2010US7709941 Resin-sealed semiconductor device and method of manufacturing the same
05/04/2010US7709940 Micro device encapsulation
05/04/2010US7709939 Metal-base circuit board and its manufacturing method
05/04/2010US7709938 Arrangement for electrically connecting semiconductor circuit arrangements to an external contact device and method for producing the same
05/04/2010US7709937 Method of manufacturing semiconductor device
05/04/2010US7709935 Reversible leadless package and methods of making and using same
05/04/2010US7709934 Package level noise isolation
05/04/2010US7709932 Semiconductor wafer having a separation portion on a peripheral area
05/04/2010US7709901 CMOS transistor and method of manufacture thereof
05/04/2010US7709900 Semiconductor device
05/04/2010US7709899 Semiconductor apparatus
05/04/2010US7709898 Semiconductor protection circuit, method for fabricating the same and method for operating semiconductor protection circuit
05/04/2010US7709897 Fusion bonding process and structure for fabricating silicon-on-insulator (SOI) semiconductor devices
05/04/2010US7709896 ESD protection device and method
05/04/2010US7709865 Substrate for an organic field effect transistor, use of said substrate, method of increasing the charge carrier mobility, and organic field effect transistor (OFET)
05/04/2010US7709861 Systems and methods for supporting a subset of multiple interface types in a semiconductor device
05/04/2010US7709852 Wavelength-converting casting composition and light-emitting semiconductor component
05/04/2010US7709836 Detector arrangement, method for the detection of electrical charge carriers and use of an ONO field effect transistor for detection of an electrical charge
05/04/2010US7709826 Rare earth-oxides, rare earth-nitrides, rare earth-phosphies, and ternary alloys with silicon