Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
05/2010
05/11/2010US7713781 Methods for forming quad flat no-lead (QFN) packages
05/11/2010US7713350 Inorganic colors and related nanotechnology
05/11/2010CA2440522C Electronic module including a cooling substrate and related methods
05/06/2010WO2010051211A2 Pre-molded, clip-bonded multi-die semiconductor package
05/06/2010WO2010051134A1 Integrated circuit packages incorporating an inductor and methods
05/06/2010WO2010050929A1 Wire threading tensioner for a wire bonding machine
05/06/2010WO2010050896A1 Insulated metal substrate and method of forming the same
05/06/2010WO2010050625A1 Curable organopolysiloxane composition, optical semiconductor element sealant, and optical semiconductor device
05/06/2010WO2010050490A1 Semiconductor device and cooling method
05/06/2010WO2010050220A1 Organic-inorganic composite and manufacturing method therefor
05/06/2010WO2010050129A1 Cooling structure, electronic device, and cooling method
05/06/2010WO2010050094A1 Nonvolatile semiconductor storage device and manufacturing method therefor
05/06/2010WO2010050091A1 Semiconductor device
05/06/2010WO2010050087A1 Layered semiconductor device and manufacturing method therefor
05/06/2010WO2010049859A1 3d integration of a mim capacitor and a resistor
05/06/2010WO2010049852A1 Through-substrate via and redistribution layer with metal paste
05/06/2010WO2010049846A2 Semiconductor chip, method of manufacturing a semiconductor chip, and method of testing a semiconductor chip
05/06/2010WO2010049835A1 Microelectronic package assembly, method for disconnecting a microelectronic package
05/06/2010WO2010049642A1 Automation of the zero-pole identification methods for the stability analysis of microwave active circuits
05/06/2010WO2010049388A1 Method for producing silicone moulded bodies from light-curable silicone mixtures
05/06/2010WO2010049087A2 A semiconductor device including a reduced stress configuration for metal pillars
05/06/2010WO2010048926A1 Supporting body for a semiconductor component, semiconductor element and method for production of a supporting body
05/06/2010WO2010021776A9 Thin foil semiconductor package
05/06/2010WO2010017512A3 Enhanced reliability for semiconductor devices using dielectric encasement
05/06/2010WO2010012271A3 Apparatus, in particular for conducting current, and a method for producing an apparatus, in particular for conducting current
05/06/2010WO2010006876A3 Heat exchanger for a thermoelectric thin layer element
05/06/2010WO2010002969A3 Flip chip overmold package
05/06/2010US20100112760 Semiconductor module including circuit component and dielectric film, manufacturing method thereof, and application thereof
05/06/2010US20100110642 Module having at least two surfaces and at least one thermally conductive layer therebetween
05/06/2010US20100110637 High thermal conductivity metal matrix composites
05/06/2010US20100110527 Thermal conduction by encapsulation
05/06/2010US20100109690 Tcp-type semiconductor device and method of testing thereof
05/06/2010US20100109620 Semiconductor Body and Method for Voltage Regulation
05/06/2010US20100109169 Semiconductor package and method of making the same
05/06/2010US20100109168 Connecting microsized devices using ablative films
05/06/2010US20100109167 Conductive paths for transmitting an electrical signal through an electrical connector
05/06/2010US20100109166 Device with chiplets and adaptable interconnections
05/06/2010US20100109165 Semiconductor device
05/06/2010US20100109164 Stacked integrated circuit package fabrication methods that use vias formed and filled after stacking, and related stacked integrated circuit package structures
05/06/2010US20100109163 Semiconductor device and manufacturing method thereof
05/06/2010US20100109162 High Integrated Semiconductor Memory Device
05/06/2010US20100109161 Reducing metal voids in a metallization layer stack of a semiconductor device by providing a dielectric barrier layer
05/06/2010US20100109160 Semiconductor device and method of manufacturing the same
05/06/2010US20100109159 Bumped chip with displacement of gold bumps
05/06/2010US20100109158 Semiconductor device including a reduced stress configuration for metal pillars
05/06/2010US20100109157 Chip structure and chip package structure
05/06/2010US20100109156 Back side protective structure for a semiconductor package
05/06/2010US20100109155 Reliable interconnect integration
05/06/2010US20100109154 Semiconductor device and method for manufacturing the semiconductor device
05/06/2010US20100109153 High bandwidth package
05/06/2010US20100109152 Electronic device and lid
05/06/2010US20100109151 Semiconductor device
05/06/2010US20100109150 Method of assembly of a semiconductor package for the improvement of the electrical testing yield on the packages so obtained
05/06/2010US20100109149 Flip chip with interposer, and methods of making same
05/06/2010US20100109148 Semiconductor device
05/06/2010US20100109147 Less expensive high power plastic surface mount package
05/06/2010US20100109146 Semiconductor device
05/06/2010US20100109144 Semiconductor device and method of manufacturing the same
05/06/2010US20100109143 Semiconductor package and method of manufacturing the same
05/06/2010US20100109142 Interposer for semiconductor package
05/06/2010US20100109141 Semiconductor memory device and semiconductor memory card
05/06/2010US20100109140 Flexible semiconductor package apparatus having a responsive bendable conductive wire member and a manufacturing the same
05/06/2010US20100109139 Stack package made of chip scale packages
05/06/2010US20100109137 Layered chip package with heat sink
05/06/2010US20100109136 Semiconductor device including semiconductor chip mounted on lead frame
05/06/2010US20100109135 Semiconductor die package including lead with end portion
05/06/2010US20100109134 Pre-molded, clip-bonded multi-die semiconductor package
05/06/2010US20100109133 Semiconductor device
05/06/2010US20100109132 Chip package and manufacturing method thereof
05/06/2010US20100109131 Reduced wafer warpage in semiconductors by stress engineering in the metallization system
05/06/2010US20100109129 Wafer level buck converter
05/06/2010US20100109128 Crack Deflector Structure for Improving Semiconductor Device Robustness Against Saw-Induced Damage
05/06/2010US20100109122 Method to reduce metal fuse thickness without extra mask
05/06/2010US20100109103 Mems package
05/06/2010US20100109094 Method for forming silicide contacts
05/06/2010US20100109053 Semiconductor device having integrated circuit with pads coupled by external connecting component and method for modifying integrated circuit
05/06/2010US20100109016 Power semiconductor module
05/06/2010US20100109006 Semiconductor device
05/06/2010US20100109005 Semiconductor device comprising a distributed interconnected sensor structure for die internal monitoring purposes
05/06/2010US20100108637 Multilayer printed wiring board and method of manufacturing the same
05/06/2010US20100108237 Device and method for joining substrates
05/06/2010US20100108122 Combined diode, lead assembly incorporating an expansion joint
05/06/2010US20100107786 Base design for self-centering
05/06/2010US20100107672 Dual substrate loadlock process equipment
05/06/2010DE202010000922U1 Wärmeaustauscher Heat exchanger
05/06/2010DE102008008853B4 Schaltungsanordnung mit Bondverbindung Circuitry with bond
05/06/2010DE102007025775B4 Elektrostatische Mehrmodus-Entladeschaltung und Verfahren zur Eingangskapazitätsreduzierung Electrostatic discharge mode and method for reducing input capacitance
05/05/2010EP2182550A1 Semiconductor device with screen for electromagnetic shielding
05/05/2010EP2182548A2 Group lll-V semiconductor device on SiC substrate
05/05/2010EP2182019A1 Heat curable resin compositon
05/05/2010EP2181461A1 Module construction and connection technology by means of metal scrap web or bent stamping parts bent from a plane
05/05/2010EP2099867B1 Curable silicone composition and electronic component
05/05/2010CN201450669U Protection device for electronic elements
05/05/2010CN201450339U 66kv optically controlled water-cooling thyristor valve group
05/05/2010CN201450006U Semi-conductor device of integrated memory chip and control chip
05/05/2010CN201450005U Three-end voltage stabilizer
05/05/2010CN201450004U Six-lead high density integrated circuit frame
05/05/2010CN201450003U Chip packaging lug structure with flexible convex pad
05/05/2010CN201450002U Radiator used for high-voltage direct current transmission thyristor converter valve component
05/05/2010CN201450001U Non-magnetic ceramic air-tight packaging outer casing structure of high-reliability hall integrated circuit
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