Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
05/2010
05/12/2010CN101707193A Metallic electrode forming method and semiconductor device having metallic electrode
05/12/2010CN101707192A Heat-radiation packaging structure and method for packaging high-power component pipe core thereof
05/12/2010CN101707191A Integrated circuit micropackage structure and method thereof
05/12/2010CN101706078A High-power LED street lamp
05/12/2010CN101706055A LED medium strong heat-conducting circulating system module
05/12/2010CN101304020B Test mechanism for testing chip fabrication defect and manufacturing method thereof
05/12/2010CN101211998B Luminous diode and heat radiating device combination
05/12/2010CN101211932B Method for manufacturing image sensing subassembly wafer-grade packaging structure
05/12/2010CN101211791B Wafer-grade chip packaging process and chip packaging structure
05/12/2010CN101179066B Chip embedding bury type packaging structure
05/12/2010CN101170104B Stacking chip encapsulation structure with multi-section bus bar in lead rack
05/12/2010CN101170103B Stacking wafer encapsulation structure with bus rack in lead rack
05/12/2010CN101155498B Combination structure of electronic component and heat radiating device
05/12/2010CN101141863B Heat radiating device
05/12/2010CN101123234B Encapsulation structure and its making method
05/12/2010CN101122377B Displaceable light-emitting diode module
05/12/2010CN101114637B Semiconductor component packaging structure
05/12/2010CN101114626B Wafer structure
05/12/2010CN101098606B Radiation device assembly and fastener using the same
05/12/2010CN101095228B Cooling device for cooling a semiconductor component, in particular, an optoelectronic semiconductor component
05/12/2010CN101090619B Heat sink device
05/12/2010CN101079461B Lighting device
05/12/2010CN101079460B Lighting device
05/12/2010CN101073151B Semiconductor package structure having enhanced thermal dissipation characteristics
05/12/2010CN101068025B Display device
05/12/2010CN101043789B Heat radiating device
05/12/2010CN101030571B Commutating diode device and its production
05/12/2010CN101030570B Semiconductor device
05/12/2010CN101022706B Lock joint device and radiating module using the same lock joint device
05/12/2010CN101022098B Connection structure and method for fabricating the same
05/12/2010CN101009269B 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
05/12/2010CN101009265B Semiconductor device and method for fabricating the same
05/11/2010US7716393 Network chip design for grid communication
05/11/2010US7715869 Semiconductor integrated circuit device
05/11/2010US7715196 Mounting device for chips
05/11/2010US7715007 Lateral shift measurement using an optical technique
05/11/2010US7714820 Contact structure of conductive films and thin film transistor array panel including the same
05/11/2010US7714633 Limiter and semiconductor device using the same
05/11/2010US7714598 Contact carriers (tiles) for populating larger substrates with spring contacts
05/11/2010US7714455 Semiconductor packages and methods of fabricating the same
05/11/2010US7714454 Chip module and method for producing a chip module
05/11/2010US7714453 Interconnect structure and formation for package stacking of molded plastic area array package
05/11/2010US7714452 Structure and method for producing multiple size interconnections
05/11/2010US7714451 Semiconductor package system with thermal die bonding
05/11/2010US7714450 On-die bond wires system and method for enhancing routability of a redistribution layer
05/11/2010US7714449 Semiconductor device with bonding pad support structure
05/11/2010US7714448 Semiconductor device and method for manufacturing semiconductor device
05/11/2010US7714447 Semiconductor chip arrangement
05/11/2010US7714446 Single mask via method and device
05/11/2010US7714445 Dynamic random access memory with an electrostatic discharge structure and method for manufacturing the same
05/11/2010US7714444 Conductive resin composition, connection method between electrodes using the same, and electric connection method between electronic component and circuit substrate using the same
05/11/2010US7714443 Pad structure design with reduced density
05/11/2010US7714442 Solid-state imaging device and method for making the same
05/11/2010US7714441 Barrier layer configurations and methods for processing microelectronic topographies having barrier layers
05/11/2010US7714440 Metal interconnection structure of a semiconductor device having low resistance and method of fabricating the same
05/11/2010US7714439 Nitride semiconductor device and method of manufacturing the same
05/11/2010US7714437 Semiconductor device and method for mounting semiconductor chip
05/11/2010US7714436 Electronic device and electronic apparatus
05/11/2010US7714435 Semiconductor device and method for fabricating the same
05/11/2010US7714434 Semiconductor apparatus with decoupling capacitor
05/11/2010US7714433 Piezoelectric cooling of a semiconductor package
05/11/2010US7714432 Ceramic/organic hybrid substrate
05/11/2010US7714431 Electronic component package comprising fan-out and fan-in traces
05/11/2010US7714430 Substrate with lossy material insert
05/11/2010US7714429 Wafer structure with a plurality of functional macro chips for chip-on-chip configuration
05/11/2010US7714428 High power semiconductor package and method of making the same
05/11/2010US7714427 Integrated circuit die configuration for packaging
05/11/2010US7714426 Ball grid array package format layers and structure
05/11/2010US7714425 Semiconductor device, method for manufacturing the same, and flexible substrate for mounting semiconductor
05/11/2010US7714424 Stacked-type semiconductor package
05/11/2010US7714423 Mid-plane arrangement for components in a computer system
05/11/2010US7714422 Electronic module with a semiconductor chip and a component housing and methods for producing the same
05/11/2010US7714421 Small structure and method for fabricating the same
05/11/2010US7714420 Apparatus for contactlessly coupling chips
05/11/2010US7714419 Integrated circuit package system with shielding
05/11/2010US7714418 Leadframe panel
05/11/2010US7714417 Substrate for mounting semiconductor element and method of manufacturing the same
05/11/2010US7714416 Electronic circuit in a package-in-package configuration and production method
05/11/2010US7714415 Leadframe structures for semiconductor packages
05/11/2010US7714414 Method and apparatus for polymer dielectric surface recovery by ion implantation
05/11/2010US7714413 Semiconductor device and method of manufacture thereof
05/11/2010US7714394 CMOS semiconductor devices having elevated source and drain regions and methods of fabricating the same
05/11/2010US7714392 Method for forming an improved low power SRAM contact
05/11/2010US7714391 Thin film transistor and method for fabricating the same
05/11/2010US7714390 Integrated circuit comprising a substrate and a resistor
05/11/2010US7714389 Semiconductor device having two bipolar transistors constituting electrostatic protective element
05/11/2010US7714387 Semiconductor device with thin-film transistors and method of fabricating the same
05/11/2010US7714371 Shielded capacitor structure
05/11/2010US7714369 Semiconductor chip having a photodiode
05/11/2010US7714363 Semiconductor integrated circuit for driving the address of a display device
05/11/2010US7714362 Semiconductor device with two or more bond pad connections for each input/output cell and method of manufacture thereof
05/11/2010US7714357 Semiconductor device
05/11/2010US7714346 Surface mounting LED substrate and LED
05/11/2010US7714236 Electric component
05/11/2010US7714232 Circuit device and method of manufacturing the same
05/11/2010US7714079 Ultra-large scale integrated (ULSI); film stack; hydrosilation
05/11/2010US7713835 Thermally decomposable spin-on bonding compositions for temporary wafer bonding
05/11/2010US7713790 Method and system of tape automated bonding
05/11/2010US7713789 Semiconductor device with a high thermal dissipation efficiency
05/11/2010US7713787 Mounted body and method for manufacturing the same
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