Patents
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
05/2010
05/12/2010DE102008051081A1 Heat dissipation module, has semiconductor emitter arranged between heat dissipating bodies, where one of bodies is provided to side of semiconductor emitter and no channel extends for conducting cooling fluid within area of side
05/12/2010DE102008043517A1 Sensormodul und Verfahren zur Herstellung eines Sensormoduls Sensor module and method of manufacturing a sensor module
05/12/2010DE102007002961B4 Speichervorrichtung und Verfahren zu deren Herstellung Storage device and process for their preparation
05/12/2010CN201467616U Heat dissipation structure of electronic device
05/12/2010CN201467614U High-efficiency phase-change heating device with combined spry cooling and microflute group phase-change heat exchange
05/12/2010CN201467613U Combined radiator for electronic device with enclosed shell
05/12/2010CN201467612U Radiator
05/12/2010CN201467611U Radiator system and electronic equipment
05/12/2010CN201467610U Cavity radiating device with loop heat pipe
05/12/2010CN201467608U Fixed structure of radiator
05/12/2010CN201467607U Split type radiator structure
05/12/2010CN201467091U Optocoupler-driven protection device
05/12/2010CN201466977U Current transforming device of open type thyristor building-block structure unit
05/12/2010CN201466046U Integral energy-saving system and energy-saving unit of buildings for photoelectricity-optothermal heat insulation
05/12/2010CN201466031U Table type rectification chip capable of preventing high voltage discharge
05/12/2010CN201466027U Integrated circuit stacked capacitor
05/12/2010CN201466026U Power module with direct bonding power terminal
05/12/2010CN201466025U Air-cooled silicon-controlled valve string structure
05/12/2010CN201466024U Light-emitting diode electrode holder with platform
05/12/2010CN201466022U Lead frame and chip connecting structure encapsulated with micro-patch diode
05/12/2010CN201466021U Lead frame-packaged type semiconductor device
05/12/2010CN201466020U Encapsulating structure for surface mount component (SMC)
05/12/2010CN201466019U High-power rectifying device
05/12/2010CN201466018U Power semiconductor device
05/12/2010CN201466017U Planar carrier cavity hermetic encapsulating structure of ultraminiature microelectronic circuit
05/12/2010CN201466016U Semi-conductor device
05/12/2010CN201466015U Ultrathin packaged semiconductor rectifying device
05/12/2010CN201462748U LED down lamp
05/12/2010CN201462746U Dissipation device of high power LED lamp
05/12/2010CN201462745U Open-type LED radiating plate
05/12/2010CN201462742U Lighting radiating fin structure
05/12/2010CN201462740U LED lamp
05/12/2010CN201462739U Radiating device
05/12/2010CN201462738U Aluminium heat radiator for LED lamp
05/12/2010CN201462737U Heat dissipation device for LED light source
05/12/2010CN201462736U General heat dissipation device for LED
05/12/2010CN201462710U Metal substrate SMD (surface mounted device) LED light source module
05/12/2010CN201462624U LED auto headlamp for efficiently and stably outputting luminous flux
05/12/2010CN201462593U Led路灯 Led lights
05/12/2010CN201462572U LED tunnel lamp of finned radiator with heat pipe
05/12/2010CN201462571U LED street lamp of finned radiator with heat pipe
05/12/2010CN201462561U LED outdoor lamp
05/12/2010CN201462501U LED indoor illuminating lamp
05/12/2010CN201462500U Heat pipe-type LED lamp
05/12/2010CN201462495U LED lamp structure with novel heat abstractor
05/12/2010CN201462469U Energy-saving environment-friendly fluorescent lamp
05/12/2010CN1996593B Static protection system using the floating and/or deflected multi-crystal silicon area and its method
05/12/2010CN1996592B Encapsulation of the image sensing and detecting apparatus
05/12/2010CN1996590B Silicon-class electromigration testing heater structure
05/12/2010CN1984553B Electronic apparatus including removable dust catcher
05/12/2010CN1983608B Pixel sensor unit and method of protecting device region from electromagnetic radiation
05/12/2010CN1983593B High-power active thin light-emitting diode
05/12/2010CN1976019B Semiconductor apparatus integrating an electrical device under an electrode pad
05/12/2010CN1971899B Package substrate
05/12/2010CN1960016B Light emitting diode
05/12/2010CN1959979B 半导体器件 Semiconductor devices
05/12/2010CN1959966B Integrated circuit device incorporating metallurgical bond to enhance thermal conduction to a heat sink
05/12/2010CN1956173B Semiconductor device and method of manufacture thereof
05/12/2010CN1941362B Semiconductor power module with excess current protection unit
05/12/2010CN1921071B Semiconductor device manufacturing apparatus and semiconductor device manufacturing method
05/12/2010CN1917202B Wiring structure, wiring method, a thin film transistor substrate, and a method for fabricating the thin film transistor substrate
05/12/2010CN1917197B Bonded structure and bonding method
05/12/2010CN1917189B Modular heat sink assembly
05/12/2010CN1909363B 半导体功率器件和rf信号放大器 The semiconductor power device and the rf signal amplifier
05/12/2010CN1901186B Device and method for emitting output light using multiple light sources with photoluminescent material
05/12/2010CN1901177B Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board
05/12/2010CN1897285B Thin film transistor array panel and fabrication
05/12/2010CN1893802B Liquid cooling system comprising component capable of heat exchanging
05/12/2010CN1881638B Light source with improved life
05/12/2010CN1881571B Heat radiation structure of integrated circuit chip of plasma display module and plasma display module including the same
05/12/2010CN1870436B Signal alignment circuit, drawing down circuit and pulling up circuit
05/12/2010CN1856218B Printed circuit board having embedded capacitors using hybrid material and method of manufacturing the same
05/12/2010CN1845329B Layout structure in semiconductor memory device and layout method therefor
05/12/2010CN1842265B Heat pipe radiator
05/12/2010CN1837317B Semiconductor device, adhesive, and double-sided adhesive film
05/12/2010CN1835196B Method for manufacturing semiconductor device and semiconductor device
05/12/2010CN1832128B Method of manufacturing interconnection structure and interconnection structure formed by the same
05/12/2010CN1810506B Device package structure, device packaging method, droplet ejection head, connector, and semiconductor device
05/12/2010CN1805657B Wired circuit board
05/12/2010CN1768423B Semiconductor device
05/12/2010CN1729731B Electronic assembly having composite electronic contacts for attaching a package substrate to a printed circuit board
05/12/2010CN1655185B Semiconductor chip with coil antenna and communication system with such a semiconductor chip
05/12/2010CN1647106B Electronic microcircuit module band
05/12/2010CN1595641B 半导体装置及其制造方法 Semiconductor device and manufacturing method
05/12/2010CN1560911B Manufacturing method of circuit board
05/12/2010CN1540477B Heat sink and structure of fan frame
05/12/2010CN1531071B Semiconductor device and producing method thereof
05/12/2010CN1519829B 半导体集成装置 Semiconductor integrated device
05/12/2010CN1476090B Bipolar transistor used on chip for electrostatic discharging protection and its method
05/12/2010CN1375875B Semiconductor device and its manufacturing method
05/12/2010CN101707368A Electrostatic damage protective device with noise immunologic function and control method thereof
05/12/2010CN101707362A Electrostatic damage protection circuit
05/12/2010CN101707207A Silicon controlled device adopting glass passivation protection between gate pole and negative pole and manufacturing method thereof
05/12/2010CN101707204A Organic electroluminescent device and electronic device provided with same
05/12/2010CN101707201A Bottom guide pixel structure
05/12/2010CN101707200A Split grid type flash memory for sharing word line
05/12/2010CN101707197A Omnibearing luminous LED device
05/12/2010CN101707196A Improved electrostatic discharge protective device, corresponding method and integrated circuit
05/12/2010CN101707195A Lead frame for use in production of contact smart card modules and preparation method thereof
05/12/2010CN101707194A Palladium-plated bonded copper wire and production method thereof