Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
05/2010
05/18/2010US7718216 cross-linked by free-radical or cationic polymerization at low temperature; activated by heat or exposure to light to polymerize mixture
05/18/2010US7718025 Method of forming folded-stack packaged device using progressive folding tool
05/18/2010US7716823 Bonding an interconnect to a circuit device and related devices
05/18/2010CA2313611C Semiconductor device
05/14/2010WO2010053821A2 Technique for interconnecting integrated circuits
05/14/2010WO2010053778A1 Application of a self-assembled monolayer as an oxide inhibitor
05/14/2010WO2010053730A2 Combined diode, lead assembly incorporating an expansion joint
05/14/2010WO2010053452A1 Semiconductor package and trace substrate with enhanced routing design flexibility and method of manufacturing thereof
05/14/2010WO2010053135A1 Al alloy film for display device, display device and sputtering target
05/14/2010WO2010053001A1 Transparent heat-curable organic-inorganic hybrid material for sealing functional microparticles
05/14/2010WO2010052973A1 Semiconductor device and method for manufacturing same
05/14/2010WO2010052933A1 Semiconductor device and semiconductor device manufacturing method
05/14/2010WO2010052889A1 Cooling member, and method and device for manufacturing same
05/14/2010WO2010052856A1 Lead, wiring member, package component, metal component with resin, resin-encapsulated semiconductor device, and methods for producing same
05/14/2010WO2010052816A1 Semiconductor device
05/14/2010WO2010036953A3 Lead-free conductive compositions and methods of using them
05/14/2010WO2010022009A3 Process for through silicon via filling
05/14/2010WO2010007560A3 Semiconductor device and manufacturing method
05/13/2010US20100118918 Spread spectrum isolator
05/13/2010US20100118636 Methods and Systems Involving Electrically Reprogrammable Fuses
05/13/2010US20100118502 Printed circuit board
05/13/2010US20100117711 Semiconductor chip and radio frequency circuit
05/13/2010US20100117678 Semiconductor device and method of testing the same
05/13/2010US20100117451 Package circuit board with a reduced number of pins and package including a package circuit board with a reduced number of pins and methods of manufacturing the same
05/13/2010US20100117245 Integrated circuit package substrate having configurable bond pads
05/13/2010US20100117244 Semiconductor device and manufacturing method therefor
05/13/2010US20100117243 Method and apparatus for stacked die package with insulated wire bonds
05/13/2010US20100117242 Technique for packaging multiple integrated circuits
05/13/2010US20100117241 Semiconductor device and method for producing same
05/13/2010US20100117240 Process for wet passivation of bond pads for protection against subsequent tmah-based processing
05/13/2010US20100117239 Interconnection structure of electronic device and method of manufacturing package thereof
05/13/2010US20100117237 Silicided Trench Contact to Buried Conductive Layer
05/13/2010US20100117236 Top layers of metal for high performance ic's
05/13/2010US20100117235 Metal line in semiconductor device
05/13/2010US20100117234 Semiconductor device and method of manufacturing the same
05/13/2010US20100117233 Metal line in semiconductor device and method for forming the same
05/13/2010US20100117232 Semiconductor device and method for manufacturing the same
05/13/2010US20100117231 Reliable wafer-level chip-scale solder bump structure
05/13/2010US20100117230 Flip Chip Interconnection Structure Having Void-Free Fine Pitch and Method Thereof
05/13/2010US20100117229 Copper-containing C4 ball-limiting metallurgy stack for enhanced reliability of packaged structures and method of making same
05/13/2010US20100117228 Semiconductor device and method of manufacturing semiconductor device
05/13/2010US20100117227 Method of preparing detectors for oxide bonding to readout integrated chips
05/13/2010US20100117226 Structure and method for stacked wafer fabrication
05/13/2010US20100117225 Semiconductor device and a manufacturing method of the same
05/13/2010US20100117224 Sensor
05/13/2010US20100117223 Semiconductor module
05/13/2010US20100117222 Void Reduction in Indium Thermal Interface Material
05/13/2010US20100117221 Capped Wafer Method and Apparatus
05/13/2010US20100117220 Semiconductor package and manufacturing method for the same
05/13/2010US20100117219 Power semiconductor device
05/13/2010US20100117218 Stacked wafer level package and method of manufacturing the same
05/13/2010US20100117217 Semiconductor package
05/13/2010US20100117216 Chip package structure
05/13/2010US20100117215 Planar multi semiconductor chip package
05/13/2010US20100117214 Image forming apparatus, chip, and chip package
05/13/2010US20100117213 Coil and semiconductor apparatus having the same
05/13/2010US20100117212 Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices
05/13/2010US20100117211 Integrated circuit package
05/13/2010US20100117210 Semiconductor device
05/13/2010US20100117209 Multiple chips on a semiconductor chip with cooling means
05/13/2010US20100117208 Semiconductor package for improving characteristics for transmitting signals and power
05/13/2010US20100117207 Bond pad array for complex ic
05/13/2010US20100117206 Microarray package with plated contact pedestals
05/13/2010US20100117205 Integrated circuit package system with encapsulation lock and method of manufacture thereof
05/13/2010US20100117201 Cooling Channels in 3DIC Stacks
05/13/2010US20100117200 Substrate for semiconductor package having a reinforcing member that prevents distortions and method for fabricating the same
05/13/2010US20100117198 Integrated process for thin film resistors with silicides
05/13/2010US20100117195 Capacitor integration at top-metal level with a protective cladding for copper surface protection
05/13/2010US20100117191 Semiconductor device
05/13/2010US20100117190 Fuse structure for intergrated circuit devices
05/13/2010US20100117162 Semiconductor Body and Method for the Design of a Semiconductor Body with a Connecting Line
05/13/2010US20100117129 Scratch protection for direct contact sensors
05/13/2010US20100117099 Multi-chip light emitting diode modules
05/13/2010US20100117084 Method for sorting and acquiring semiconductor element, method for producing semiconductor device, and semiconductor device
05/13/2010US20100117083 Semiconductor device
05/13/2010US20100117081 Semiconductor integrated circuit device for driving display device and manufacturing method thereof
05/13/2010US20100117080 Semiconductor test pad structures
05/12/2010EP2184960A1 Circuit board and method for manufacturing circuit board
05/12/2010EP2184778A1 Semiconductor device
05/12/2010EP2184777A1 Interconnect structure
05/12/2010EP2184776A1 Method for making an interconnect structure and low-temperature interconnect component recovery process
05/12/2010EP2184771A1 Interlayer insulation film and wiring structure, and their manufacturing method
05/12/2010EP2183793A1 Nickel tin bonding system with barrier layer for semiconductor wafers and devices
05/12/2010EP2183778A2 A leadframe structure for electronic packages
05/12/2010EP2183777A1 Flexible joint
05/12/2010EP2183776A1 Enabling holographic media backwards compatibility with dual-use media card connector
05/12/2010EP2183775A2 Reinforced structure for a stack of layers in a semiconductor component
05/12/2010EP2183185A2 Wafer joining method, wafer assemblage, and chip
05/12/2010EP2182848A1 Analyte monitoring device and methods of use
05/12/2010EP1327491B1 Functional metal alloy particles
05/12/2010EP1114457B1 Method for producing integrated circuits
05/12/2010EP1114456B1 Collective method for conditioning a plurality of components initially formed in a common substrate
05/12/2010DE202008017728U1 Vorrichtung zur Abschirmung und Hitzeableitung Apparatus for shielding and heat dissipation
05/12/2010DE10307537B4 Integrierter Baustein mit einem Verzögerungselement und Verfahren zum Einstellen einer zeitlichen Lage eies Signals Integrated module with a delay element and method for adjusting a timing signal eies
05/12/2010DE102009043520A1 Halbleiterbauelement Semiconductor device
05/12/2010DE102008056464A1 Controllable cooling system for cooling e.g. CPU of personal computer, has electronic controller for controlling Peltier element and temperature sensor, and ventilator removing heat produced in wind channel and during suction process
05/12/2010DE102008054073A1 Halbleiterbauelement mit elektronischen Sicherungen mit erhöhter Programmiereffizienz Semiconductor device with electronic fuses with increased programming efficiency
05/12/2010DE102008054069A1 Reduzierte Scheibendurchbiegung in Halbleitern durch Verspannungstechniken im Metallisierungssystem Reduced disk deflection in semiconductors by bracing techniques metallization
05/12/2010DE102008054054A1 Halbleiterbauelement mit einem Aufbau für reduzierte Verspannung von Metallsäulen A semiconductor device having a structure for reduced strain of metal columns
05/12/2010DE102008053956A1 Halbleiterbauelement mit einer aufgeteilten intern verbundenen Sensorstruktur für chipinterne Überwachungszwecke A semiconductor device having a divided structure for internally connected sensor chip monitoring purposes
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