Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
05/2010
05/20/2010US20100122840 Multi-layer printed circuit board and method of manufacturing multilayer printed circuit board
05/20/2010DE112008001023T5 Leistungs-Halbleitermodul Power semiconductor module
05/20/2010DE102009053434A1 Substrat mit einem Loch mit einer Metallsilizidschicht Substrate with a hole with a metal silicide
05/20/2010DE102009046549A1 Semiconductor device e.g. acceleration sensor, for vehicle, has semiconductor chip with trench present within connecting edge if bump edge present at edge section of contact surface of contact area and bump is defined as connecting edge
05/20/2010DE102009023404A1 Elektrische Sicherung, Halbleitervorrichtung und Verfahren zum Abtrennen einer elektrischen Sicherung Electrical protective device, semiconductor device and method for separating an electrical fuse
05/20/2010DE102009007625A1 Verbundsubstrat für einen Halbleiterchip Composite substrate for a semiconductor chip
05/20/2010DE102008058032A1 Microstructure fluid cooler for e.g. CPU of personal computer, has base plate and intermediate levels produced by etching process, where material strength and remaining base thickness utilized by etching process amounts to specific values
05/20/2010DE102008058003A1 Halbleitermodul und Verfahren zu dessen Herstellung Semiconductor module and method for its production
05/20/2010DE102008057174A1 Oberflächenmontierbare Vorrichtung Surface mount device
05/20/2010DE102008054094A1 Semiconductor element has semiconductor body, in which semiconductor zone is formed by single cable type, where semiconductor zone has resistance structure with two sections
05/20/2010DE102008043773A1 Electrical and/or micromechanical component, has base substrate whose main side is provided with portions, where portions exceeding over region of cap are decoupled from material of package
05/20/2010DE102008043735A1 Anordnung von mindestens zwei Wafern mit einer Bondverbindung und Verfahren zur Herstellung einer solchen Anordnung Arrangement of at least two wafers with a bonding compound and method for producing such an arrangement
05/20/2010DE10137667B4 Schutzvorrichtung für Baugruppen mit Abstandhalter Protection device for assemblies with spacers
05/20/2010CA2780747A1 Extremely stretchable electronics
05/19/2010EP2187717A1 Circuit board, circuit module and circuit board manufacturing method
05/19/2010EP2187519A1 Crystal device and method for manufacturing crystal device
05/19/2010EP2187440A2 Heat radiation material, electronic device and method of manufacturing electronic device
05/19/2010EP2187439A1 Interposer and interposer manufacturing method
05/19/2010EP2187438A1 Interposer and manufacturing method of the interposer
05/19/2010EP2187437A1 Electronic component
05/19/2010EP2187436A1 Electronic component
05/19/2010EP2187435A1 Electronic component
05/19/2010EP2187158A1 Method for combining heat pipes with a fixing base and structure of the same
05/19/2010EP2186649A1 Method for marking valuable articles
05/19/2010EP2186135A1 Packaged integrated circuit devices with through- body conductive vias, and methods of making same
05/19/2010EP2186133A2 Reduced bottom roughness of stress buffering element of a semiconductor component
05/19/2010EP2186132A2 Interconnection element with posts formed by plating
05/19/2010EP2186125A1 Method of packaging an integrated circuit die
05/19/2010EP2186122A2 Intermetallic conductors
05/19/2010EP2186114A2 Semiconductor component and method of manufacture
05/19/2010EP1911092B1 Integrated circuit packaging
05/19/2010EP1108267B1 Methods of forming roughened layers of platinum and methods of forming capacitors containing said roughened layers of platinum
05/19/2010EP0738424B1 Integrated circuit passivation process
05/19/2010CN201479534U Radiating device
05/19/2010CN201479531U U-shaped tubular phase-change electronic radiator
05/19/2010CN201479527U Radiator structure
05/19/2010CN201479526U Fixing component of radiating element
05/19/2010CN201479525U Pivoting unit and support frame structure thereof
05/19/2010CN201479523U Radiator with rectangular serrated radiating fins
05/19/2010CN201479463U Printed circuit board with bonding pad with air exhaust through holes
05/19/2010CN201479458U Radiation structure capable of controlling electromagnetic radiation
05/19/2010CN201479030U Thin three-phase bridge rectifier
05/19/2010CN201478338U Flip-chip element for golden ball to golden ball connection (GGI) welding process
05/19/2010CN201478316U Special solar diode
05/19/2010CN201478315U Plane-welding-type power diode
05/19/2010CN201478314U High voltage rectifier
05/19/2010CN201478311U Ultrathin CMOS image sensor
05/19/2010CN201478308U Miniature encapsulated half-controlled bridge wall device
05/19/2010CN201478307U Flat type packaged double-gate field effect transistor
05/19/2010CN201478306U Flat type packaged double-gate field effect transistor
05/19/2010CN201478305U Flat type packaged dual insulated-gate bipolar transistor device
05/19/2010CN201478304U Flat type packaged dual insulated-gate bipolar transistor
05/19/2010CN201478303U Anti-parallel double diode
05/19/2010CN201478302U Encapsulation structure of luminous element
05/19/2010CN201478301U Optical sensing component structure for wafer level package and wafer structure thereof
05/19/2010CN201478300U Electrode structure of power module and power module
05/19/2010CN201478299U Power module electrode and power module
05/19/2010CN201478298U Fastening structure for cooling fin of memory
05/19/2010CN201478297U Fixation rack
05/19/2010CN201478296U High-power radiating substrate
05/19/2010CN201478295U Chip radiator
05/19/2010CN201478294U Forced air cooling type thyristor air duct
05/19/2010CN201478293U Airtight Seal Structure for Flip Chip Bonding
05/19/2010CN201478292U Surface encapsulating structure for micro device
05/19/2010CN201478291U SMD metal cover board
05/19/2010CN201478290U 半导体芯片模块 Semiconductor chip module
05/19/2010CN201478289U Packaging case of electronic device
05/19/2010CN201478288U Pin grid array encapsulating shell
05/19/2010CN201478287U Metal encapsulation shell
05/19/2010CN201475955U Heat dissipation device capable of bidirectionally ventilating on LED box
05/19/2010CN201475951U LED lamp radiation module capable of combining to amplify
05/19/2010CN201475950U Heat dissipation substrate of LED lamp
05/19/2010CN201475821U Water cooling heat dissipation high-power LED underground lamp
05/19/2010CN201475817U Water cooling heat dissipation high-power LED outdoor spot lamp
05/19/2010CN201475816U Water cooling heat dissipation high-power LED tunnel lamp
05/19/2010CN201475800U LED spot lamp
05/19/2010CN201475757U High power LED lamp
05/19/2010CN201475752U Efficient heat radiating LED illuminating lamp with heat pipes
05/19/2010CN201475747U High-power LED lighting lamp with radiating structure
05/19/2010CN201475738U High-power LED lamp
05/19/2010CN201475737U Crown led illuminating lamp
05/19/2010CN201475730U High power LED integrated module lamp
05/19/2010CN201475723U Hollow liquid-cooled light distribution LED lamp
05/19/2010CN201475696U High power lamp
05/19/2010CN1996595B Capacitance structure for the integrated circuit
05/19/2010CN1988157B Gate array
05/19/2010CN1983582B Semiconductor device
05/19/2010CN1980526B Circuit board assembly and flat coil
05/19/2010CN1975942B Sheet capacitor
05/19/2010CN1971905B Power semiconductor module with coupling element
05/19/2010CN1971903B Semiconductor device having align mark layer and method of fabricating the same
05/19/2010CN101711104A Graphite heat radiator
05/19/2010CN101710587A Organic light emitting display
05/19/2010CN101710583A Integrated circuit with built-in electrical inductor
05/19/2010CN101710582A Layout structure for promoting pixel defection detectivity of thin film transistor substrate
05/19/2010CN101710581A Encapsulating structure of semiconductor chip and manufacturing technology thereof
05/19/2010CN101710580A Multi-layer compound passivation layer structure of Bipolar circuit and manufacturing process thereof
05/19/2010CN101710471A Display device
05/19/2010CN101330041B Interconnecting hole of metal front medium layer and method for forming the same
05/19/2010CN101326648B Light emitting device, semiconductor device, and its manufacturing method
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