Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
05/2010
05/19/2010CN101317269B Monolithically integrable circuit arrangement
05/19/2010CN101300677B Electrically programmable fuse and its manufacture method
05/19/2010CN101297606B Lighting structure comprising at least one light-emitting diode, method for making same and uses thereof
05/19/2010CN101297403B Method for cutting solid-state image pickup device
05/19/2010CN101297401B Cooling structure of electric device
05/19/2010CN101295635B Method and device for improving capacity of MIM capacitance
05/19/2010CN101281898B Test method of test structure for testing integrality of grid medium layer
05/19/2010CN101278394B 半导体装置 Semiconductor device
05/19/2010CN101263599B Termination structure
05/19/2010CN101253623B Method for the production of a semiconductor component comprising a planar contact, and semiconductor component
05/19/2010CN101242726B Heat relay part for external heat radiator
05/19/2010CN101241896B Common centroid symmetric capacitor
05/19/2010CN101238763B Method of forming conductive pattern and wiring board
05/19/2010CN101236959B Encapsulation structure for multi-chip interleaving stack
05/19/2010CN101228627B Electronic module assembly with heat spreader, portable electronic communication device and printed circuit board
05/19/2010CN101226889B Reconfiguration line structure and manufacturing method thereof
05/19/2010CN101221929B Packaging structure and its radiating module
05/19/2010CN101217234B An electrostatic protection structure of high voltage drive integrated circuit
05/19/2010CN101213663B Semiconductor die package and method for making the same
05/19/2010CN101207169B Luminous chip encapsulation body and light source component
05/19/2010CN101207110B Light emitting diode module
05/19/2010CN101207102B High-power diode supporting structure and encapsulation combination
05/19/2010CN101203955B 电子控制单元及其制造方法 An electronic control unit and manufacturing method thereof
05/19/2010CN101201676B Radiating device
05/19/2010CN101187364B Inverter-integrated electric compressor
05/19/2010CN101175391B Buckling device of radiator and its combination
05/19/2010CN101174639B Electric ink display equipment and mending method thereof
05/19/2010CN101174638B Electric ink display equipment and mending method thereof
05/19/2010CN101162081B High-power LED street light fitting main casing
05/19/2010CN101160657B Semiconductor device and its manufacturing process
05/19/2010CN101156241B Heat sink device
05/19/2010CN101149564B Alignment mark and its imaging optical system and imaging method
05/19/2010CN101137279B Temperature control structure of photoelectric device
05/19/2010CN101133295B Heat pipe and method for manufacturing same
05/19/2010CN101128931B Microelectronic assemblies having compliancy
05/19/2010CN101120446B Semiconductor module and device
05/19/2010CN101110394B Semiconductor substrate having low defects and method of manufacturing the same
05/19/2010CN101091005B Method for forming tantalum nitride film
05/19/2010CN101091000B Method for forming tantalum nitride film
05/19/2010CN101060088B Semiconductor package structure and its making method
05/19/2010CN101031384B Silver-coated ball
05/19/2010CN101019227B Electronic-component container and piezoelectric resonator device
05/19/2010CN101013714B Solid-state imaging device and electronic endoscope using the same
05/19/2010CN101005093B Phase change memory device and method for manufacturing phase change memory device
05/19/2010CN101000906B Fuse region and method of fabricating the same
05/18/2010US7719851 Electronics module and method for manufacturing the same
05/18/2010US7719839 Heat conduction apparatus providing for selective configuration for heat conduction
05/18/2010US7719624 Active device array substrate
05/18/2010US7719585 Solid-state imaging device
05/18/2010US7719379 High speed electronics interconnect having a dielectric system with air holes of varying diameters and spans
05/18/2010US7719125 Method for detaching a semiconductor chip from a foil and device for mounting semiconductor chips
05/18/2010US7719124 Printed wiring board for mounting components
05/18/2010US7719123 Method of manufacturing semiconductor device
05/18/2010US7719122 System-in-package packaging for minimizing bond wire contamination and yield loss
05/18/2010US7719121 Microelectronic packages and methods therefor
05/18/2010US7719120 Multi-component integrated circuit contacts
05/18/2010US7719119 Semiconductor device, electronic apparatus comprising the same, and method for fabrication of substrate for semiconductor device used therein
05/18/2010US7719118 Semiconductor chip scale package incorporating through-vias electrically connected to a substrate and other vias that are isolated from the substrate, and method of forming the package
05/18/2010US7719117 Semiconductor device having multilayer wiring structure
05/18/2010US7719116 Semiconductor device having reduced number of external pad portions
05/18/2010US7719114 Edit structure that allows the input of a logic gate to be changed by modifying any one of the metal or via masks used to form the metal interconnect structure
05/18/2010US7719113 Semiconductor device including dummy patterns
05/18/2010US7719112 On-chip magnetic components
05/18/2010US7719110 Flip chip package including a non-planar heat spreader and method of making the same
05/18/2010US7719109 Embedded capacitors for reducing package cracking
05/18/2010US7719107 Semiconductor device and electronic apparatus equipped with the semiconductor device
05/18/2010US7719106 Semiconductor device, electronic card and pad rearrangement substrate
05/18/2010US7719105 High speed electrical interconnects and method of manufacturing thereof
05/18/2010US7719104 Circuit board structure with embedded semiconductor chip and method for fabricating the same
05/18/2010US7719103 Semiconductor device
05/18/2010US7719102 Semiconductor device
05/18/2010US7719101 Semiconductor device with surface-mountable external contacts and method for manufacturing the same
05/18/2010US7719100 Power semiconductor module with MOS chip
05/18/2010US7719099 Package structure for solid-state lighting devices and method of fabricating the same
05/18/2010US7719098 Stacked modules and method
05/18/2010US7719097 Semiconductor device having transparent member
05/18/2010US7719096 Semiconductor device and method for manufacturing a semiconductor device
05/18/2010US7719095 Lead frame and semiconductor device provided with lead frame
05/18/2010US7719094 Semiconductor package and manufacturing method thereof
05/18/2010US7719093 Circuit board with decoupling capacitors
05/18/2010US7719092 Power semiconductor module
05/18/2010US7719083 Integrated spiral inductor
05/18/2010US7719079 Chip carrier substrate capacitor and method for fabrication thereof
05/18/2010US7719063 Semiconductor integrated circuit having plural transistors
05/18/2010US7719062 Tuned tensile stress low resistivity slot contact structure for n-type transistor performance enhancement
05/18/2010US7719054 High-voltage lateral DMOS device
05/18/2010US7719053 Semiconductor device having increased gate-source capacity provided by protruding electrode disposed between gate electrodes formed in a trench
05/18/2010US7719044 Platinum-containing integrated circuits and capacitor constructions
05/18/2010US7719023 Light emitting device
05/18/2010US7719007 Flexible electroluminescent capacitive sensor
05/18/2010US7719006 Physical quantity sensor and semiconductor device having package and cover
05/18/2010US7719005 Structure and method for monitoring and characterizing pattern density dependence on thermal absorption in a semiconductor manufacturing process
05/18/2010US7719004 Sensor having hydrophobic coated elements
05/18/2010US7718508 Semiconductor bonding and layer transfer method
05/18/2010US7718504 Semiconductor device having align key and method of fabricating the same
05/18/2010US7718502 Semiconductor apparatus including a thin-metal-film resistor element and a method of manufacturing the same
05/18/2010US7718472 Integrated circuit package-on-package stacking system and method of manufacture thereof
05/18/2010US7718471 Method and apparatus for stacked die package with insulated wire bonds
05/18/2010US7718452 Display apparatus and method of manufacturing the same
05/18/2010US7718274 Method for welding two welding parts by means of a fillet weld and welding part with an inclined tapered edge area therefor
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