Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
05/2010
05/25/2010US7723833 Stacked die packages
05/25/2010US7723832 Semiconductor device including semiconductor elements mounted on base plate
05/25/2010US7723831 Semiconductor package having die with recess and discrete component embedded within the recess
05/25/2010US7723830 Substrate and method for mounting silicon device
05/25/2010US7723829 Embedded metal heat sink for semiconductor
05/25/2010US7723828 Semiconductor package with leads on a chip having multi-row of bonding pads
05/25/2010US7723827 Semiconductor storage device and production method therefor
05/25/2010US7723826 Semiconductor wafer, semiconductor chip cut from the semiconductor wafer, and method of manufacturing semiconductor wafer
05/25/2010US7723823 Buried asymmetric junction ESD protection device
05/25/2010US7723813 Method and structure for improved alignment in MRAM integration
05/25/2010US7723801 Semiconductor device and method of fabricating the same, and nor gate circuit using the semiconductor device
05/25/2010US7723799 Semiconductor device
05/25/2010US7723796 Semiconductor device with current mirror circuit having two transistors of identical characteristics
05/25/2010US7723794 Load driving device
05/25/2010US7723792 Floating diodes
05/25/2010US7723790 Semiconductor device and method of manufacturing the same
05/25/2010US7723786 Apparatus of memory array using FinFETs
05/25/2010US7723759 Stacked wafer or die packaging with enhanced thermal and device performance
05/25/2010US7723736 Light emitting device having a plurality of light emitting cells and package mounting the same
05/25/2010US7723730 Carrier layer for a semiconductor layer sequence and method for producing semiconductor chips
05/25/2010US7723724 System for using test structures to evaluate a fabrication of a wafer
05/25/2010US7723642 Laser-based system for memory link processing with picosecond lasers
05/25/2010US7723444 retarding the curing of the epoxy resin by adjusting an amount of the retarder while curing in presence of a curing accelerator cation phosphorus compound; used for semiconductor encapsulation; providing latency; storage stability; resist to soldering without forming cracks by the soldering
05/25/2010US7723244 Method for internal electrical insulation of a substrate for a power semiconductor module
05/25/2010US7723208 Integrated re-combiner for electroosmotic pumps using porous frits
05/25/2010US7723161 Lead frame, method of manufacturing the same, semiconductor device using lead frame and method of manufacturing semiconductor device
05/25/2010US7723160 Thermal interface structure with integrated liquid cooling and methods
05/25/2010US7723156 Electronic system modules and method of fabrication
05/25/2010US7722687 Methods for the deposition of electrocatalyst particles
05/25/2010US7721789 Heat pipe type cooler
05/25/2010US7721425 Method for connecting electronic parts
05/20/2010WO2010057145A1 X-ray opaque coating
05/20/2010WO2010057068A2 Method and apparatus for wafer bonding with enhanced wafer mating
05/20/2010WO2010057041A2 Package including proximately-positioned lead frame
05/20/2010WO2010057010A1 Pressure-compensated enclosure
05/20/2010WO2010056857A2 Extremely stretchable electronics
05/20/2010WO2010056826A1 Inks and pastes for solar cell fabrication
05/20/2010WO2010056479A2 Flexible and stackable semiconductor die packages, systems using the same, and methods of making the same
05/20/2010WO2010056212A2 Method for encapsulating semiconductor dies
05/20/2010WO2010056210A1 Semiconductor substrate, package and device and manufacturing methods thereof
05/20/2010WO2010055912A1 Electronic circuit device
05/20/2010WO2010055754A1 Thermoelectric conversion module and thermoelectric conversion device
05/20/2010WO2010055682A1 Resin multilayer device and method for manufacturing same
05/20/2010WO2010055620A1 Thermally conductive composition and manufacturing method therefor
05/20/2010WO2010054875A1 Arrangement of at least two wafers with a bonding connection and method for producing such an arrangement
05/20/2010WO2010054613A1 Surface-mountable apparatus
05/20/2010WO2010036579A3 Low cost die-to-wafer alignment/bond for 3d ic stacking
05/20/2010WO2010036304A3 Laser ablation to create pocket for die placement
05/20/2010WO2010030962A3 Structures and methods for wafer packages, and probes
05/20/2010WO2010027890A3 Mainboard assembly including a package overlying a die directly attached to the mainboard
05/20/2010WO2010025012A3 Molded ultra thin semiconductor die packages, systems using the same, and methods of making the same
05/20/2010WO2007022399A9 Semiconductor assembly and packaging for high current and low inductance
05/20/2010US20100124246 Method for production of a plurality of semicoductor chips, and a semiconductor component
05/20/2010US20100124243 Semiconductor light emitting apparatus including elongated hollow wavelength conversion tubes and methods of assembling same
05/20/2010US20100123259 Photosensitive resin composition
05/20/2010US20100123258 Low Temperature Board Level Assembly Using Anisotropically Conductive Materials
05/20/2010US20100123257 Flexible and Stackable Semiconductor Die Packages, Systems Using the Same, and Methods of Making the Same
05/20/2010US20100123256 Semiconductor device, manufacturing method thereof, and electronic apparatus
05/20/2010US20100123255 Electronic package structure and method
05/20/2010US20100123254 Semiconductor Device and a Method for Making the Semiconductor Device
05/20/2010US20100123253 Semiconductor device
05/20/2010US20100123252 Layout design method and semiconductor integrated circuit
05/20/2010US20100123251 Integrated circuit packaging system with multi level contact and method of manufacture thereof
05/20/2010US20100123250 Feature Patterning Methods and Structures Thereof
05/20/2010US20100123249 Semiconductor device and method of manufacturing semiconductor device
05/20/2010US20100123248 Semiconductor device and method for manufacturing the same
05/20/2010US20100123247 Base package system for integrated circuit package stacking and method of manufacture thereof
05/20/2010US20100123246 Double Solid Metal Pad with Reduced Area
05/20/2010US20100123245 Semiconductor integrated circuit devices and display apparatus including the same
05/20/2010US20100123244 Semiconductor device and method of manufacturing the same
05/20/2010US20100123243 Flip-chip chip-scale package structure
05/20/2010US20100123242 Integrated circuit package system with support carrier and method of manufacture thereof
05/20/2010US20100123241 Semiconductor chip with through-silicon-via and sidewall pad
05/20/2010US20100123240 Semiconductor device and manufacturing method thereof
05/20/2010US20100123239 Semiconductor package and method of manufacturing the same
05/20/2010US20100123238 Packaging structure of sip and a manufacturing method thereof
05/20/2010US20100123235 Package on package substrate
05/20/2010US20100123234 Multi-chip package and manufacturing method thereof
05/20/2010US20100123233 Integrated circuit package system and method of package stacking
05/20/2010US20100123232 Integrated circuit packaging system having an internal structure protrusion and method of manufacture thereof
05/20/2010US20100123231 Semiconductor device and method of manufacturing the same
05/20/2010US20100123230 Integrated circuit packaging system having bumped lead and method of manufacture thereof
05/20/2010US20100123229 Integrated circuit packaging system with plated pad and method of manufacture thereof
05/20/2010US20100123228 Package including proximately-positioned lead frame
05/20/2010US20100123227 Integrated circuit packaging system with increased connectivity and method of manufacture thereof
05/20/2010US20100123226 Semiconductor package
05/20/2010US20100123225 Semiconductor Die Structures for Wafer-Level Chipscale Packaging of Power Devices, Packages and Systems for Using the Same, and Methods of Making the Same
05/20/2010US20100123224 High mechanical strength additives for porous ultra low-k material
05/20/2010US20100123223 Method of manufacturing porous insulating film, method of manufacturing semiconductor device, and semiconductor device
05/20/2010US20100123221 Backside nitride removal to reduce streak defects
05/20/2010US20100123220 Trench shielding structure for semiconductor device and method
05/20/2010US20100123219 Heat Spreader Structures in Scribe Lines
05/20/2010US20100123217 Semiconductor device
05/20/2010US20100123215 Capacitor Die Design for Small Form Factors
05/20/2010US20100123212 Semiconductor device and method of manufacturing the same
05/20/2010US20100123144 Circuit structure of package carrier and multi-chip package
05/20/2010US20100123136 Semiconductor device and manufacturing method thereof
05/20/2010US20100123135 Pad structure and method of testing
05/20/2010US20100123134 Method of producing semiconductor device and soq (silicon on quartz) substrate used in the method
05/20/2010US20100123115 Interconnect And Method For Mounting An Electronic Device To A Substrate
1 ... 645 646 647 648 649 650 651 652 653 654 655 656 657 658 659 660 661 662 663 664 665 ... 2262