Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
05/2010
05/26/2010CN101714551A Low leakage capacitors including portions in inter-layer dielectrics
05/26/2010CN101714546A A display device and method for producing the same
05/26/2010CN101714545A 半导体装置 Semiconductor device
05/26/2010CN101714542A Circuit device
05/26/2010CN101714540A Data type encoding for media independent handover
05/26/2010CN101714539A Zigzag Pattern for TSV Copper Adhesion
05/26/2010CN101714538A Semiconductor device and method of manufacturing the same
05/26/2010CN101714537A Universal bump array structure
05/26/2010CN101714536A Flip-chip package structure and the die attach method thereof
05/26/2010CN101714535A Ic encapsulation member with number of pin less than required
05/26/2010CN101714534A Resin sheet, circuit device and method of manufacturing the same
05/26/2010CN101714533A Circuit device and method of manufacturing the same
05/26/2010CN101714532A Package and fabricating method thereof
05/26/2010CN101714531A Semiconductor module and method for manufacturing the semiconductor module
05/26/2010CN101714530A Nitride semiconductor substrate
05/26/2010CN101714529A Semiconductor device and method for manufacturing the same
05/26/2010CN101714525A Semiconductor integrated circuit device and a method for manufacturing a semiconductor integrated circuit device
05/26/2010CN101714521A Semiconductor device and method of manufacturing the same
05/26/2010CN101714516A Process for making contact with and housing integrated circuits
05/26/2010CN101714513A Adhesive sheet, semiconductor device, and method for producing the semiconductor device
05/26/2010CN101714512A Method of fabricating semiconductor device having three-dimensional stacked structure
05/26/2010CN101713897A 显示装置 The display device
05/26/2010CN101713618A A flow distributor assembly and a cooling unit with a flow distributor assembly
05/26/2010CN101713528A Lamp heat radiating device
05/26/2010CN101713496A LED illuminating lamp and LED lamp wick thereof
05/26/2010CN101442039B Structure for reducing trigger voltage of silicon control rectifier
05/26/2010CN101346054B Thermal interface material, its preparation method and packaging body with the same
05/26/2010CN101330813B Radiating device and thermal fin thereof
05/26/2010CN101312632B Heat radiating device
05/26/2010CN101304644B Buckling device of radiator
05/26/2010CN101287349B Heat radiating device
05/26/2010CN101282629B Cooling device
05/26/2010CN101281902B High power LED lighting lamp and radiating module thereof
05/26/2010CN101277600B Cooling device
05/26/2010CN101267723B Heat radiation device
05/26/2010CN101246878B LED chip packaging structure with ceramic as substrate and its production method
05/26/2010CN101220943B Integral LED lamp
05/26/2010CN101213658B Semiconductor device and semiconductor device assembly
05/26/2010CN101212886B Heat radiator
05/26/2010CN101201271B Internal modulation type ferro-electricity non-refrigeration infrared focal plane prober
05/26/2010CN101179057B Novel bond pad structure and its manufacture method
05/26/2010CN101154653B 功率半导体模块 Power semiconductor module
05/26/2010CN101141858B Fixer for heat radiator
05/26/2010CN101128101B Heat radiator assembly
05/26/2010CN101120438B Semiconductor device manufacturing method and semiconductor device
05/26/2010CN101118785B Semiconductor unit array, and static random access memory array
05/26/2010CN101115367B Heat radiating device
05/26/2010CN101091243B Single mask via method and device
05/26/2010CN101090618B Fastening device for heat sink
05/26/2010CN101090599B Circuit board
05/26/2010CN101083894B Electronic device and heat radiating module
05/26/2010CN101072978B Cooling systems incorporating heat transfer meshes
05/26/2010CN101072487B Fan fixing device
05/26/2010CN101068456B Radiating device
05/26/2010CN101064331B Phase change memory fabricated using self-aligned process
05/26/2010CN101060103B Semiconductor device
05/26/2010CN101055853B Non-volatile semiconductor memory device and its making method
05/26/2010CN101055110B Heat exchanger and indoor thermoelectric air conditioner possessing same
05/26/2010CN101047186B Memory cell and related memory device
05/26/2010CN101047172B Compact type power semi-conductor module with connecting device
05/26/2010CN101039027B Improved electrostatic discharge protecting circuit
05/26/2010CN101034696B Electrically programmable fuse structures with terminal portions residing at different heights, and methods of fabrication thereof
05/26/2010CN101030568B Semiconductor device and metal interconnection
05/26/2010CN101026174B Semiconductor device and method for manufacturing same
05/26/2010CN101021659B Liquid crystal picture element and producing method thereof and liquid crystal display device
05/26/2010CN101018469B Heat radiator
05/26/2010CN101018467B Heat radiator
05/26/2010CN101013697B Semiconductor integrated circuit and method of designing the same
05/26/2010CN101009241B Wiring manufacturing method and display device manufacturing method
05/26/2010CN101005747B Liquid cooling heat sink and heat exchanger for said liquid cooling heat sink
05/25/2010USRE41355 Method for placing active circuits beneath active bonding pads
05/25/2010US7725865 Method, storage media storing program, and component for avoiding increase in delay time in semiconductor circuit having plural wiring layers
05/25/2010US7725862 Signal routing on redistribution layer
05/25/2010US7725850 Methods for design rule checking with abstracted via obstructions
05/25/2010US7724523 Electric power converter and mounting structure of semiconductor device
05/25/2010US7724520 Protruding lock for notebook computer or other personal electronic device
05/25/2010US7724517 Case for a liquid submersion cooled electronic device
05/25/2010US7724099 High frequency oscillator circuit with feedback circuit of fet and short-stub transmission line
05/25/2010US7723856 Epoxy resin composition for the encapsulation of semiconductors and semiconductor devices
05/25/2010US7723855 Pad and circuit board, electronic device using same
05/25/2010US7723854 Assembly and method of assembling by soldering an object and a support
05/25/2010US7723853 Chip package without core and stacked chip package structure
05/25/2010US7723852 Stacked semiconductor package and method of making same
05/25/2010US7723851 Method of fabricating ultra-deep vias and three-dimensional integrated circuits using ultra-deep vias
05/25/2010US7723850 Electronic devices having air gaps
05/25/2010US7723849 Semiconductor device and manufacturing method thereof
05/25/2010US7723848 Semiconductor device and method for designing same
05/25/2010US7723847 Semiconductor device having an electrode pad, a bump provided above the electrode pad and a bump foundation layer therebetween
05/25/2010US7723846 Power semiconductor module and method of manufacturing the same
05/25/2010US7723845 System and method of a heat transfer system with an evaporator and a condenser
05/25/2010US7723843 Multi-package module and electronic device using the same
05/25/2010US7723842 Integrated circuit device
05/25/2010US7723841 Thermal spacer for stacked die package thermal management
05/25/2010US7723840 Integrated circuit package system with contoured die
05/25/2010US7723839 Semiconductor device, stacked semiconductor device, and manufacturing method for semiconductor device
05/25/2010US7723838 Package structure having semiconductor device embedded within wiring board
05/25/2010US7723837 Semiconductor device
05/25/2010US7723836 Chip stack structure having shielding capability and system-in-package module using the same
05/25/2010US7723835 Semiconductor device package structure
05/25/2010US7723834 POP package and method of fabricating the same
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