Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
05/2010
05/26/2010EP1435658B1 Substrates and method for producing the same
05/26/2010CN201491449U Inclined radiating module used for improving radiating effect and reducing length of welding pin
05/26/2010CN201491445U radiating module
05/26/2010CN201491443U Fixing component of radiating module
05/26/2010CN201491441U Radiator structure
05/26/2010CN201491440U Heat dissipation device
05/26/2010CN201491437U fixing fastener
05/26/2010CN201491430U Electronic equipment case
05/26/2010CN201491372U Module for directly manufacturing circuit board and electronic component on radiator
05/26/2010CN201490649U Chamber separating type solar module connecting box with radiator
05/26/2010CN201490227U Package structure of light emitting diode
05/26/2010CN201490226U Package structure of light emitting diode
05/26/2010CN201490192U Light emitting diode module
05/26/2010CN201490190U Control module for semiconductor device
05/26/2010CN201490189U Chip structure with electrostatic protection function
05/26/2010CN201490188U Data recording device capable of distinguishing wafer characteristics
05/26/2010CN201490187U Novel direct bonding power module of power terminal
05/26/2010CN201490186U Flat and long glass encapsulation SMD LED and package belt thereof
05/26/2010CN201490185U Chip cooling device
05/26/2010CN201490184U Integrated circuit chip with microfluid cooling channel and encapsulating structure thereof
05/26/2010CN201490183U Integrated fastener with heat radiating effect
05/26/2010CN201490182U Water circulating heat sink of semiconductor refrigerating sheet
05/26/2010CN201490181U Chip heat radiation device
05/26/2010CN201490180U radiator
05/26/2010CN201490179U Circuit board structure
05/26/2010CN201490178U Light emitting diode bracket structure
05/26/2010CN201490177U Metal-based copper clad laminate for mounting semiconductor power devices
05/26/2010CN201489435U Fixed support for computer mainboard CPU heat radiator
05/26/2010CN201489433U Heat sink for on-board computer
05/26/2010CN201488193U Frequency conversion control device of inverter air conditioner
05/26/2010CN201487899U Luminaire
05/26/2010CN201487896U High-power LED illumination heat dissipation structure
05/26/2010CN201487894U Heat radiation structure for high-power LED light fixture
05/26/2010CN201487893U Separated radiating device of luminaire
05/26/2010CN201487892U Radiating structure of luminaire
05/26/2010CN201487891U Novel heat-dissipating structure of semi-conductor illuminating lamp
05/26/2010CN201487854U High thermal conductivity LED lamp
05/26/2010CN201487849U Heat dissipation substrate for alternating current LED light source
05/26/2010CN201487842U LED lamp cup with temperature compensation function
05/26/2010CN201487838U LED illuminating module and LED street lamp
05/26/2010CN201487741U Convection type high-power LED streetlamp
05/26/2010CN201487735U LED street lamp
05/26/2010CN201487703U LED projection lamp
05/26/2010CN201487702U Outdoor high-power LED light source
05/26/2010CN201487670U Matrix led illuminating lamp
05/26/2010CN201487614U LED packaging structure with high radiating and luminous efficiency
05/26/2010CN201487613U High-efficiency radiation type high-power LED lamp
05/26/2010CN201487611U Lamp adopting LED lamp core
05/26/2010CN201487609U LED fluorescent lamp
05/26/2010CN201487600U LED fluorescent lamp tube
05/26/2010CN1996565B Wafer level package having a stress relief spacer and manufacturing method thereof
05/26/2010CN1983590B High luminance light emitting diode and liquid crystal display using the same
05/26/2010CN1971897B Ball grid array wiring structure
05/26/2010CN1967869B Semiconductor device
05/26/2010CN1949960B Method and apparatus for optimizing heat transfer with electronic components
05/26/2010CN1937269B Surface mounting LED substrate
05/26/2010CN1929118B Heat dispersing device and its manufacturing method
05/26/2010CN1925721B Wiring board and ceramic capacitor
05/26/2010CN1925179B Semiconductor light-emitting device
05/26/2010CN1914514B Method and module for testing integrated circuits for susceptibility to latch-up
05/26/2010CN1913137B Cooling mould set
05/26/2010CN1902754B A cooling system with a bubble pump
05/26/2010CN1855477B Circuit device
05/26/2010CN1847308B Flame retardant and an epoxy resin composition comprising the same for encapsulating semiconductor devices
05/26/2010CN1835223B Semiconductor device and insulating substrate for the same
05/26/2010CN1832152B Semiconductor package and fabrication method thereof
05/26/2010CN1779932B Semiconductor package and fabrication method
05/26/2010CN1696231B Reprocessing conductive adhesive composition and its preparation method
05/26/2010CN1661799B Semiconductor device
05/26/2010CN1638113B Semiconductor integrated circuit apparatus
05/26/2010CN1630033B Wireless communication apparatus and semiconductor device
05/26/2010CN1625926B Method for embedding a component in a base
05/26/2010CN1624718B Module for contactless chip cards or identification systems
05/26/2010CN1623232B RF amplifier and related module and method
05/26/2010CN1621481B Epoxy resin composition for encapsulating optical semiconductor element and optical semiconductor device using the same
05/26/2010CN1612328B Medium window of a buried capacitor and method for fabricating a medium window of a buried capacitor
05/26/2010CN1581475B Interconnecting structure manufacture method
05/26/2010CN1581366B Electronic equipment provided with cooling system
05/26/2010CN1577755B Laser beam processing method and laser beam processing machine
05/26/2010CN1534776B Semiconductor package and its lead wire frame
05/26/2010CN1531754B Direct heatpipe attachment to die using center point loading
05/26/2010CN1531084B Semiconductor assembly
05/26/2010CN1526166B Electronic package with high density interconnect and associated methods
05/26/2010CN1519925B Semiconductor device and its manufacture method
05/26/2010CN1518075B Organic insulating film, its manufacturing method, semiconductor device using the organic insulating film and its manufacturing method
05/26/2010CN1502669B Decreasing thermal contact resistance at a material interface
05/26/2010CN1493088B IC package pressure release apparatus and method
05/26/2010CN1360346B 电子结构及其形成方法 Electronic structure and method of forming
05/26/2010CN101715606A Plated pillar package formation
05/26/2010CN101715284A Fixed structure
05/26/2010CN101715282A Fixing member
05/26/2010CN101714827A Modularized vehicle rectifier bridge
05/26/2010CN101714823A Power transducer
05/26/2010CN101714759A Low-capacitance bidirectional ESD protective device and preparation method thereof
05/26/2010CN101714575A Electrostatic discharge protection semiconductor device and method for mafacturing the same
05/26/2010CN101714565A Semiconductor device and fabricating method thereof
05/26/2010CN101714564A Image sensor device with opaque coating
05/26/2010CN101714562A Semiconductor wafer
05/26/2010CN101714559A Non-volatile memory semiconductor device
05/26/2010CN101714554A Photo alignment mark for a gate last process
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