Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
05/2010
05/27/2010WO2010059133A1 Semiconductor package and manufacturing method thereof
05/27/2010WO2010059118A1 Functional capping
05/27/2010WO2010058825A1 Al ALLOY FILM FOR DISPLAY DEVICE, THIN FILM TRANSISTOR SUBSTRATE, METHOD FOR MANUFACTURING SAME, AND DISPLAY DEVICE
05/27/2010WO2010058739A1 Display panel substrate and display panel
05/27/2010WO2010058738A1 Substrate for display panel, and display panel
05/27/2010WO2010058646A1 Semiconductor package and method for manufacturing same
05/27/2010WO2010058595A1 Electronic component for wiring and method for manufacturing same, and electronic device package with built-in electronic component for wiring and method for manufacturing same
05/27/2010WO2010058520A1 Boiling and cooling device
05/27/2010WO2010058503A1 Semiconductor device and method of manufacturing same
05/27/2010WO2010058337A1 Millimetre-wave radio antenna module
05/27/2010WO2010058094A1 Device for protecting an electronic integrated circuit housing against physical or chemical ingression
05/27/2010WO2010057933A1 Integrated circuit device equipped with different connection means
05/27/2010WO2010057808A1 Semiconductor device having stacked components
05/27/2010WO2010057339A1 Semiconductor chip with through-silicon-via and sidewall pad
05/27/2010WO2010057236A2 Heat sink and method for the production thereof
05/27/2010WO2010039981A3 Integrated circuit with double seal ring having gaps therein
05/27/2010WO2010039358A3 Ceramic heat pipe with porous ceramic wick
05/27/2010US20100130004 Semiconductor device and method for manufacturing the same
05/27/2010US20100129977 Integrated circuit with capacitor and method for the production thereof
05/27/2010US20100127409 Microelectronic device wafers including an in-situ molded adhesive, molds for in-situ molding adhesives on microelectronic device wafers, and methods of molding adhesives on microelectronic device wafers
05/27/2010US20100127408 Bonding pad structure for back illuminated optoelectronic device and fabricating method thereof
05/27/2010US20100127407 Two-sided substrateless multichip module and method of manufacturing same
05/27/2010US20100127406 Semiconductor device
05/27/2010US20100127405 Wiring boad, semiconductor device in which wiring board is used, and method for manufaturing the same
05/27/2010US20100127404 Semiconductor device
05/27/2010US20100127403 Semiconductor apparatus manufacturing method and semiconductor apparatus
05/27/2010US20100127402 Interconnect System without Through-Holes
05/27/2010US20100127401 Semiconductor device
05/27/2010US20100127400 Semiconductor module and process for its fabrication
05/27/2010US20100127399 Wiring structure between steps and wiring method thereof
05/27/2010US20100127398 Wiring structure of a semiconductor device
05/27/2010US20100127397 Optoelectronic semiconductor device
05/27/2010US20100127396 Integrated circuit module and method of packaging same
05/27/2010US20100127395 Methods for selective reverse mask planarization and interconnect structures formed thereby
05/27/2010US20100127394 Through substrate vias for back-side interconnections on very thin semiconductor wafers
05/27/2010US20100127393 Electronic device and semiconductor device
05/27/2010US20100127392 Semiconductor die
05/27/2010US20100127391 Fixture for semiconductor device and assembly of semiconductor device
05/27/2010US20100127390 Cooling Structures and Methods
05/27/2010US20100127389 Power semiconductor module
05/27/2010US20100127388 Metal injection molded heat dissipation device
05/27/2010US20100127387 Power semiconductor module
05/27/2010US20100127386 Device including a semiconductor chip
05/27/2010US20100127385 Method for manufacturing an element having electrically conductive members for application in a microelectronic package
05/27/2010US20100127384 Semiconductor device and connection checking method for semiconductor device
05/27/2010US20100127383 Power semiconductor module
05/27/2010US20100127382 Semiconductor device
05/27/2010US20100127381 Integrated Circuit Devices Having Printed Circuit Boards Therein With Staggered Bond Fingers That Support Improved Electrical Isolation
05/27/2010US20100127380 Leadframe free leadless array semiconductor packages
05/27/2010US20100127379 Power Semiconductor Module with Control Functionality and Integrated Transformer
05/27/2010US20100127378 Semiconductor device and semiconductor package
05/27/2010US20100127377 Method for Producing a MEMS Package
05/27/2010US20100127376 System and method to provide rf shielding for a mems microphone package
05/27/2010US20100127375 Wafer level chip scale semiconductor packages
05/27/2010US20100127373 Package structure
05/27/2010US20100127372 Semiconductor packages
05/27/2010US20100127371 Power semiconductor module with segmented base plate
05/27/2010US20100127370 Wiring board, semiconductor device and semiconductor element
05/27/2010US20100127369 Lead frame, method for manufacturing the same and semiconductor device
05/27/2010US20100127368 Lead frame
05/27/2010US20100127367 Chip package and manufacturing method thereof
05/27/2010US20100127366 Integrated Leadframe And Bezel Structure And Device Formed From Same
05/27/2010US20100127365 Leadframe-based chip scale semiconductor packages
05/27/2010US20100127364 Semiconductor device and heat radiation member
05/27/2010US20100127363 Very extremely thin semiconductor package
05/27/2010US20100127362 Semiconductor package having isolated inner lead
05/27/2010US20100127361 Encapsulant interposer system with integrated passive devices and manufacturing method therefor
05/27/2010US20100127360 Semiconductor Device and Method of Forming WLCSP Using Wafer Sections Containing Multiple Die
05/27/2010US20100127359 Die-To-Die Power Consumption Optimization
05/27/2010US20100127357 Semiconductor device
05/27/2010US20100127356 Structures and methods for reducing junction leakage in semiconductor devices
05/27/2010US20100127355 Semiconductor device and method
05/27/2010US20100127305 Esd protection device and method of forming an esd protection device
05/27/2010US20100127258 Lcd panel having shared shorting bars for array inspection and panel inspection
05/27/2010DE202009016875U1 Lichtemitteranordnung für einstellbare optische Leistungsabstrahlung und Wellenlängenverteilung Light emitter array for adjustable optical power radiation and wavelength distribution
05/27/2010DE202009000615U1 Formmassenvergossenes Leistungshalbleiterelement Form of Mass Destruction Encapsulated power semiconductor element
05/27/2010DE102009044967A1 System auf einem Chip mit HF-Abschirmung auf dem Chip System on a chip with RF shield on the chip
05/27/2010DE102009040557A1 Bauelement mit zwei Montageoberflächen Component with two mounting surfaces
05/27/2010DE102009024310A1 Vorrichtung mit einer Halbleiterbauelement-Anordnung und einem Kühlelement Device having a semiconductor component arrangement and a cooling element
05/27/2010DE102009018049A1 (Mono)Metall-Bonddraht bzw. Bändchen zum Drahtbonden mit Gradientenübergang der unterschiedlichen Material- und Gefügeeigenschaften zwischen Drahtkern und Drahtmantel zur Reduzierung der Heelschwächung und gleichzeitiger Verbesserung der Interfacefestigkeit (Mono) metal bonding wire or ribbon for wire bonding with Gradientenübergang of different material and structural properties between core wire and wire sheath to reduce Heelschwächung and while improving the interface strength
05/27/2010DE102008058001A1 Verfahren zur Herstellung eines Halbleiterbauelementes und Halbleiterbauelement A process for producing a semiconductor device and semiconductor device
05/27/2010DE102008057832A1 Leistungshalbleitermodul mit vorgespannter Hilfskontaktfeder Power semiconductor module with auxiliary pre-stressed contact spring
05/27/2010DE102008043929A1 Elektronisches Bauelement Electronic component
05/27/2010DE10163460B4 Siliziumsubstrat mit einer Isolierschicht und Anordnung mit einem Siliziumsubstrat mit einer Isolierschicht Silicon substrate with an insulating and assembly with a silicon substrate having an insulating layer
05/26/2010EP2190273A1 Multi-layer baseboard and manufacturing method thereof
05/26/2010EP2190061A1 Radiating element network and antenna comprising such a network
05/26/2010EP2190016A1 Semiconductor module with control functionality and integrated transformer
05/26/2010EP2190014A1 Lead frame and lead frame manufacturing method
05/26/2010EP2190013A2 Connection wire and method for manufacturing the same
05/26/2010EP2190011A2 Moisture-proof semiconductor module with centring device
05/26/2010EP2189928A1 Device with integrated circuit equipped with different connection means
05/26/2010EP2189765A1 High frequency module for measuring fill levels in the w frequency
05/26/2010EP2189051A1 Device for disassembling electronic power components and method for implementing said device
05/26/2010EP2188839A1 Electrical device and drive
05/26/2010EP2188838A2 Security chip
05/26/2010EP2188837A1 Method and device for cooling a heat generating component
05/26/2010EP2188836A2 Thermal interface material, electronic device containing the thermal interface material, and methods for their preparation and use
05/26/2010EP2188834A2 Composite, thermal interface material containing the composite, and methods for their preparation and use
05/26/2010EP2070127B1 Electronic device module comprising an ethylene multi-block copolymer
05/26/2010EP1683202B1 Trench gate field effect devices
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