Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
06/2010
06/02/2010CN101197317B Phase change memory cell with thermal barrier and method for fabricating the same
06/02/2010CN101197314B Semiconductor device and fabricating method thereof
06/02/2010CN101188217B Structures to enhance cooling of computer memory modules
06/02/2010CN101183833B Hot pipe technique based frequency conversion power unit
06/02/2010CN101183677B Packaging structure and method for manufacturing the packaging structure
06/02/2010CN101183662B Method for forming MIM in semiconductor device and semiconductor device
06/02/2010CN101174619B Power semiconductor device
06/02/2010CN101170106B Laminate chip packages and its manufacture method and system
06/02/2010CN101162340B Pixel structure
06/02/2010CN101150123B Semiconductor encapsulation structure with electromagnetic shielding cover
06/02/2010CN101150112B Semiconductor device and fabrication process thereof
06/02/2010CN101146408B Wiring forming system and wiring forming method for forming wiring on wiring board
06/02/2010CN101145532B Method of plating semiconductor devices
06/02/2010CN101138084B Semiconductor device package with bump overlying a polymer layer
06/02/2010CN101127333B Semiconductor device and manufacturing method of the same
06/02/2010CN101119063B Frequency converter
06/02/2010CN101110374B Module and method of manufacturing the same
06/02/2010CN101097913B Capacitor array, capacitor and capacitor array layout method
06/02/2010CN101090120B A nand memory device with inversion bit lines and methods for making the same
06/02/2010CN101083236B Electronic device and method of manufacturing the electronic device
06/02/2010CN101080160B Cooling apparatus, cooled electronic device and methods of fabrication thereof
06/02/2010CN101071800B Tape carrier, semiconductor apparatus, and semiconductor module apparatus
06/02/2010CN101051614B Method for forming reinforced interconnects on a substrate
06/02/2010CN101038897B Electronic device
06/02/2010CN101022106B Semiconductor device
06/01/2010USRE41363 Thin film transistor substrate
06/01/2010US7730434 Contactless technique for evaluating a fabrication of a wafer
06/01/2010US7729676 Integrated switchless programmable attenuator and low noise amplifier
06/01/2010US7729129 Mounting device for high frequency microwave devices
06/01/2010US7729117 Housing for cooling electronic control units in motor vehicles
06/01/2010US7728945 Structure for circuit assembly
06/01/2010US7728507 Radiation-emitting component provided with metallic injected-molded carrier
06/01/2010US7728445 Semiconductor device production method and semiconductor device
06/01/2010US7728444 Wiring board
06/01/2010US7728443 Semiconductor components with through wire interconnects
06/01/2010US7728442 Semiconductor device and a method of manufacturing the same
06/01/2010US7728441 Method for mounting a semiconductor package onto PCB
06/01/2010US7728440 Warp-suppressed semiconductor device
06/01/2010US7728439 Semiconductor device, wiring substrate, and method for manufacturing wiring substrate
06/01/2010US7728438 Optical semiconductor device and method of manufacturing the same
06/01/2010US7728437 Semiconductor package form within an encapsulation
06/01/2010US7728436 applying first a selective, releasable self-assembled monolayer ( mercaptopropyltrimethoxysilane/3-/) that acts as a masking layer such that a second permanent self-assembled monolayer can be deposited which will be used as a Cu diffusion barrier deposited only on the dielectric material
06/01/2010US7728435 Semiconductor device with double barrier film
06/01/2010US7728434 Semiconductor device and method of manufacturing the same
06/01/2010US7728432 Narrow and wide copper interconnections composed of (111), (200) and (511) surfaces
06/01/2010US7728431 Electronic component, semiconductor device employing same, and method for manufacturing electronic component
06/01/2010US7728430 Semiconductor device and manufacturing method thereof
06/01/2010US7728429 Semiconductor device having recessed connector portions
06/01/2010US7728428 Multilayer printed circuit board
06/01/2010US7728427 Assembling stacked substrates that can form cylindrical inductors and adjustable transformers
06/01/2010US7728426 Semiconductor device
06/01/2010US7728425 Seal of fluid port
06/01/2010US7728424 Semiconductor device and method of manufacturing the same
06/01/2010US7728423 Semiconductor device having step-wise connection structures for thin film elements
06/01/2010US7728422 Semiconductor package, integrated circuit cards incorporating the semiconductor package, and method of manufacturing the same
06/01/2010US7728421 Semiconductor device
06/01/2010US7728420 High current lead electrode for semiconductor device
06/01/2010US7728419 Semiconductor package adapted for high-speed data processing and damage prevention of chips packaged therein and method for fabricating the same
06/01/2010US7728418 Semiconductor device and manufacturing method thereof
06/01/2010US7728417 Integrated circuit package system including shield
06/01/2010US7728416 Semiconductor device, a method of manufacturing the same and an electronic device
06/01/2010US7728415 Power semiconductor component stack using lead technology with surface-mountable external contacts and a method for producing the same
06/01/2010US7728414 Lead frame and resin-encapsulated semiconductor device
06/01/2010US7728413 Resin mold type semiconductor device
06/01/2010US7728412 Semiconductor device having plurality of leads
06/01/2010US7728411 COL-TSOP with nonconductive material for reducing package capacitance
06/01/2010US7728410 Semiconductor device comprising light-blocking region enclosing semiconductor element
06/01/2010US7728398 Micro camera module and method of manufacturing the same
06/01/2010US7728390 Multi-level interconnection memory device
06/01/2010US7728389 Semiconductor device and fabrication method for the semiconductor device
06/01/2010US7728385 Trench MOSFET with an ONO insulating layer sandwiched between an ESD protection module atop and a semiconductor substrate
06/01/2010US7728384 Magnetic random access memory using single crystal self-aligned diode
06/01/2010US7728361 Method of testing an integrated circuit die, and an integrated circuit die
06/01/2010US7728331 Thin film transistor panel and manufacturing method thereof
06/01/2010US7728065 Polycarbosilane substituted with a benzyl or diazo group and/or a polysilazane having a substituent capable of absorbing exposure light; high exposure light (particularly ultraviolet light) absorptivity, which efficiently blocks the exposure light that reaches porous insulating films
06/01/2010US7727898 Semiconductor device and method of fabricating same
06/01/2010US7727892 Method and apparatus for forming metal-metal oxide etch stop/barrier for integrated circuit interconnects
06/01/2010US7727861 Method and device for contacting semiconductor chips
06/01/2010US7727853 Processing method, manufacturing method of semiconductor device, and processing apparatus
06/01/2010US7727847 Method for manufacturing display device
06/01/2010US7727804 Method and apparatus for fabricating self-assembling microstructures
06/01/2010US7727803 Semiconductor device, package structure thereof, and method for manufacturing the semiconductor device
06/01/2010US7727799 Integrated circuit package
06/01/2010US7727630 nickel powder batches include particles having a small particle size, narrow size distribution and a spherical morphology, encapulated by a metal oxide selected from ZrO2, SiO2, b2O3, TiO2, Cu2O, CuO, Bi2o3, V2O5 and Al2O3
06/01/2010US7727601 edge-sealed barrier stack includes a decoupling layer and at least two barrier layers(selected from metals, metal oxides, metal nitrides, metal carbides, metal oxynitrides, metal oxyborides); edges sealed against lateral moisture and gas diffusion
06/01/2010US7727344 Copper alloy suitable for an IC lead pin for a pin grid array provided on a plastic substrate
06/01/2010US7726851 LED lamp with a heat dissipation device
06/01/2010US7726544 Method of packaging flip chip and method of forming pre-solders on substrate thereof
06/01/2010US7726385 Heat dissipation interface for semiconductor chip structures
06/01/2010US7726145 Temperature control unit for electronic component and handler apparatus
06/01/2010US7726013 Method of manufacturing circuit board including transfer chip having a plurality of first pad electrodes connected to wiring
06/01/2010CA2471629C Improved thermal interface material
05/2010
05/27/2010WO2010059879A2 Heat exchanger apparatus and methods of manufacturing cross reference
05/27/2010WO2010059724A2 Capacitor die design for small form factors
05/27/2010WO2010059338A1 Integrated capacitor with array of crosses
05/27/2010WO2010059337A1 Integrated capacitor with alternating layered segments
05/27/2010WO2010059336A1 Integrated capacitor with grid plates
05/27/2010WO2010059335A1 Shielding for integrated capacitors
05/27/2010WO2010059334A1 Integrated capacitor with interlinked lateral fins
05/27/2010WO2010059333A2 Semiconductor die structures for wafer-level chipscale packaging of power devices, packages and systems for using the same, and methods of making the same
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