Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
06/2010
06/02/2010CN101720311A Conductor paste for ceramic substrate and electric circuit
06/02/2010CN101720165A Component built-in wiring substrate and manufacturing method thereof
06/02/2010CN101719513A 30V double-diffusion MOS device and 18V double-diffusion MOS device
06/02/2010CN101719502A Vertical type semiconductor device and forming method of the same
06/02/2010CN101719497A New type integrated circuit for resisting full-scale irradiation of NMOS component
06/02/2010CN101719494A Delay circuit
06/02/2010CN101719493A Display device
06/02/2010CN101719489A Ultra-low parasitic ESD protection device
06/02/2010CN101719488A Bond pad connection to redistribution lines having tapered profiles
06/02/2010CN101719487A Inverted packaging device of monolithic integration switching-type regulator and its packaging method
06/02/2010CN101719486A Semiconductor device, manufacturing method thereof, and manufacturing method of semiconductor module
06/02/2010CN101719485A Chip structure, substrate structure, chip package structure and process thereof
06/02/2010CN101719484A Backside connection to tsvs having redistribution lines
06/02/2010CN101719483A Substrate for growing wurtzite type crystal and method for manufacturing the same and semiconductor device
06/02/2010CN101719477A Alignment mark and defect detection method
06/02/2010CN101718929A Fan-out circuit of array substrate
06/02/2010CN101718897A Optical receiving assembly for hundred trillion-grade 850nm optical communication and preparation method thereof
06/02/2010CN101488486B Circuit substrate capable of opening slots
06/02/2010CN101465349B Semiconductor device
06/02/2010CN101452977B Light emitting construction and LED chip fixture apparatus
06/02/2010CN101452927B A self-cooling type thyratron transistor valve
06/02/2010CN101447443B Method for manufacturing high-frequency integrated circuit encapsulation structure
06/02/2010CN101447437B Encapsulation structure for reconfiguring crystal grain and preconfigured fan-out structure used thereinto
06/02/2010CN101436553B Method for manufacturing package structure with reconfigured chip by metal projection
06/02/2010CN101431066B Semiconductor packaging stack combination construction with movable outer terminal
06/02/2010CN101431031B Semiconductor package and manufacturing method thereof
06/02/2010CN101427367B Aluminum/silicon carbide composite and radiating part comprising the same
06/02/2010CN101419947B Transition metal oxide p-n hetero-junction and preparation method thereof
06/02/2010CN101399237B Rapid heat radiation ceramic case formed by full compression joint
06/02/2010CN101393948B Front-back enclosing type LED encapsulation construction and encapsulation method
06/02/2010CN101393939B Nano tube hetero-junction constituted by zinc oxide and carbon, preparation thereof
06/02/2010CN101379611B Cooling structure of power semiconductor element and inverter
06/02/2010CN101375378B Element structure of display device and its production method
06/02/2010CN101373757B Mask target and method for forming the same
06/02/2010CN101371355B Interposer and electronic device using the same and their production method
06/02/2010CN101371345B Semiconductor device for high frequency
06/02/2010CN101359661B High effective packaging structure of multi-chip dc-dc reduced power converter
06/02/2010CN101359643B Package substrate and manufacturing method therefor
06/02/2010CN101355078B Crosstalk-free semiconductor element, packaging system and its manufacture method
06/02/2010CN101350390B LED encapsulation structure
06/02/2010CN101350346B Light emitting device and method of manufacturing the same
06/02/2010CN101350335B Open window type ball grid array semiconductor packaging piece and web board structure used thereby
06/02/2010CN101345237B Embedded tenon type packaging structure and manufacturing method thereof
06/02/2010CN101344236B Short-pitch thin LED lead frame
06/02/2010CN101340802B Heat radiating module
06/02/2010CN101339941B Electrostatic discharging protection circuit
06/02/2010CN101336067B Mechanism of media for vacuum sealed radiating and method thereof
06/02/2010CN101335224B Semiconductor package structure and its production method
06/02/2010CN101330075B Stereo encapsulation structure
06/02/2010CN101329144B Once forming and assembling method of radiating rib and hot pipe
06/02/2010CN101315927B High power LED phase transition heat sink structure
06/02/2010CN101312636B Heat radiation module assembled to substrate plate by magnetic force
06/02/2010CN101312198B 半导体装置 Semiconductor device
06/02/2010CN101312165B A1N substrate and cleaning method for the same
06/02/2010CN101312162B Method for manufacturing semiconductor device
06/02/2010CN101308844B Semiconductor structure and manufacture method thereof
06/02/2010CN101308838B Flip LED integrated chip with high break-over voltage and production method
06/02/2010CN101308829B Semiconductor device and method for manufacturing BOAC/COA
06/02/2010CN101308793B Integrated circuit construction and forming method thereof
06/02/2010CN101307996B Flat-plate evaporators structure and loop type hot pipe possessing flat-plate evaporators structure
06/02/2010CN101304025B Mask layout method, and semiconductor device and method for fabricating the same
06/02/2010CN101304009B Semiconductor device and method for manufacturing the same
06/02/2010CN101303889B Memory cell and method for manufacturing non-volatile apparatus thereof
06/02/2010CN101294698B Luminous diode lighting device
06/02/2010CN101292330B Chemically-enhanced package singulation process
06/02/2010CN101290934B 半导体装置 Semiconductor device
06/02/2010CN101290931B Self-cooled thyristor valve of high power and mounting vehicle
06/02/2010CN101286483B 半导体芯片及集成电路结构 The semiconductor chip and integrated circuit structure
06/02/2010CN101281875B Sstack type encapsulation structure as well as manufacturing method thereof
06/02/2010CN101281874B Encapsulation structure as well as manufacturing method thereof
06/02/2010CN101276834B Display apparatus and method for making the same
06/02/2010CN101276833B Organic electroluminescent display device and method of fabricating the same
06/02/2010CN101276799B 半导体装置及其制造方法 Semiconductor device and manufacturing method thereof
06/02/2010CN101276791B Semiconductor wafer and process for its production
06/02/2010CN101271890B Semiconductor device, method of manufacturing the same, capacitor structure and its manufacture method
06/02/2010CN101261989B Integrated circuits
06/02/2010CN101261946B Metallic electrode forming method and semiconductor device having metallic electrode
06/02/2010CN101256989B Semiconductor epitaxial thin film encapsulation of vertical structure and its production method
06/02/2010CN101256962B Electronic part and method for manufacturing the same
06/02/2010CN101256852B Thin film short circuit tablet for microwave circuit and manufacturing method thereof
06/02/2010CN101251975B Display apparatus and drive method therefor, and electronic equipment
06/02/2010CN101246862B Wafer with radiating structure and its production method
06/02/2010CN101241898B 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
06/02/2010CN101236935B Bearer with built-in part and its making method
06/02/2010CN101232783B Printed circuit board productttion mthod
06/02/2010CN101232012B Stack type semiconductor packaging structure
06/02/2010CN101232010B Thick film mixed circuit device
06/02/2010CN101231974B Multilayer coating, device and method for using the multilayer coating
06/02/2010CN101231196B Temperature detection method of semiconductor device and power conversion apparatus
06/02/2010CN101226951B Resistance random access memory
06/02/2010CN101226914B Chip carrier substrate capacitor and method for fabrication thereof
06/02/2010CN101221977B Organic light emitting display
06/02/2010CN101217156B Electronic element and cmos image sensor chip scale packages and manufacture method
06/02/2010CN101211928B Nonvolatile memory device and method for fabricating the same
06/02/2010CN101211890B Metal line of semiconductor device and method of manufacturing the same
06/02/2010CN101207140B Array substrate and manufacturing method thereof
06/02/2010CN101207117B System grade encapsulation body and fabrication methods thereof
06/02/2010CN101207115B Semiconductor integrated circuit
06/02/2010CN101207077B Image sensor and manufacturing method thereof
06/02/2010CN101202272B Sealing structure for MEMS devices and method of the same
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