Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
06/2010
06/03/2010US20100133693 Semiconductor Package Leads Having Grooved Contact Areas
06/03/2010US20100133692 Process for producing silicic coating, silicic coating and semiconductor device
06/03/2010US20100133691 Thermally programmable anti-reverse engineering interconnects and methods of fabricating same
06/03/2010US20100133690 Semiconductor device
06/03/2010US20100133689 Copper (i) compounds useful as deposition precursors of copper thin films
06/03/2010US20100133688 Semiconductor integrated circuit device
06/03/2010US20100133687 Semiconductor Device with Solder Bump Formed on High Topography Plated Cu Pads
06/03/2010US20100133686 Chip package structure
06/03/2010US20100133685 Direct semiconductor contact ebullient cooling package
06/03/2010US20100133684 Power semiconductor module and manufacturing method thereof
06/03/2010US20100133683 System and apparatus for venting electronic packages and method of making same
06/03/2010US20100133682 Semiconductor device
06/03/2010US20100133681 Power semiconductor device
06/03/2010US20100133680 Wafer level package and method of manufacturing the same and method of reusing chip
06/03/2010US20100133679 Compliant integrated circuit package substrate
06/03/2010US20100133678 Semiconductor device and method for manufacturing semiconductor device
06/03/2010US20100133677 Semiconductor chip stacked body and method of manufacturing the same
06/03/2010US20100133676 A power semiconductor arrangement and a semiconductor valve provided therewith
06/03/2010US20100133675 Package-on-package device, semiconductor package and method for manufacturing the same
06/03/2010US20100133674 Compact Semiconductor Package with Integrated Bypass Capacitor and Method
06/03/2010US20100133673 Flash memory card
06/03/2010US20100133672 Dual-sided substate integrated circuit package including a leadframe having leads with increased thickness
06/03/2010US20100133671 Flip-chip package structure and the die attach method thereof
06/03/2010US20100133670 Top-side Cooled Semiconductor Package with Stacked Interconnection Plates and Method
06/03/2010US20100133669 Crack stopping structure and method for fabricating the same
06/03/2010US20100133668 Semiconductor device and manufacturing method thereof
06/03/2010US20100133667 Power semiconductor module
06/03/2010US20100133666 Device including a semiconductor chip and metal foils
06/03/2010US20100133665 Integrated circuit packaging system with lead frame and method of manufacture thereof
06/03/2010US20100133664 Module and mounted structure using the same
06/03/2010US20100133662 Semiconductor assemblies and methods of manufacturing such assemblies
06/03/2010US20100133661 Methods for forming conductive vias in semiconductor device components
06/03/2010US20100133660 Method for producing interconnect structures for integrated circuits
06/03/2010US20100133659 Semiconductor device and method of manufacturing semiconductor integrated circuit chip
06/03/2010US20100133653 Integrated circuit devices including passive device shielding structures and methods of forming the same
06/03/2010US20100133651 Semiconductor structure processing using multiple laterally spaced laser beam spots with joint velocity profiling
06/03/2010US20100133650 Semiconductor device
06/03/2010US20100133642 System and method for forming metal interconnection in image sensor
06/03/2010US20100133634 Production of a self-aligned cusin barrier
06/03/2010US20100133577 Method for producing electronic component and electronic component
06/03/2010US20100133565 Lead frame, light emitting diode having the lead frame, and backlight unit having the light emitting diode
06/03/2010US20100133558 Flip chip type led lighting device manufacturing method
06/03/2010US20100133535 Semiconductor device with reduced pad pitch
06/03/2010US20100133534 Integrated circuit packaging system with interposer and flip chip and method of manufacture thereof
06/03/2010US20100133502 CMOS-Process-Compatible Programmable Via Device
06/03/2010US20100133349 Semiconductor package, method of manufacturing semiconductor package, electronic component, and method of manufacturing electronic component
06/03/2010US20100133002 Apparatus, system and method for use in mounting electronic elements
06/03/2010US20100133001 Electronic Housing
06/03/2010US20100132932 Method for producing a metalized component, corresponding component, and a substrate for supporting the component during metalization
06/02/2010EP2192827A2 Method And Apparatus For Cooling Electronics
06/02/2010EP2192614A2 Electronic component mounting module and electrical apparatus
06/02/2010EP2192613A1 Semiconductor device and its fabrication method
06/02/2010EP2192612A2 Method for stacking and interconnecting integrated circuits
06/02/2010EP2192167A1 Adhesive composition for electronic components and adhesive sheet for electronic components using the same
06/02/2010EP2192139A1 Inclusion complex containing epoxy resin composition for semiconductor encapsulation
06/02/2010EP2191506A1 Wrap-around overmold for electronic assembly
06/02/2010EP2191502A1 Electronic system, and method for manufacturing a three-dimensional electronic system
06/02/2010EP2191500A1 A mems package
06/02/2010EP2191285A1 Testable integrated circuit and test method
06/02/2010EP1966824B1 Metal-ceramic substrate
06/02/2010DE19859119B4 Leiterplatte mit sehr guter Wärmeabstrahlung, Verfahren zu ihrer Herstellung und ihre Verwendung Printed circuit board having excellent heat radiation, process for their preparation and their use
06/02/2010DE19654096B4 Verfahren zur Herstellung eines Halbleiterbauelementes A process for producing a semiconductor device
06/02/2010DE112008001892T5 Verfahren zur Herstellung eines Wärmeübertragungsbauteils, eines Leistungsmoduls, eines Fahrzeuginverters sowie eines Fahrzeugs A method for preparing a heat transfer member, a power module of a vehicle and a vehicle inverter
06/02/2010DE102009048528A1 Gehäuse mit einem toleranzbehafteten elektronischen Bauteil Housing, with certain tolerances electronic component
06/02/2010DE102009044392A1 Kühlstrukturen und Kühlverfahren Cooling structures and cooling methods
06/02/2010DE102009031388A1 Elektronische Trägervorrichtung Electronic support device
06/02/2010DE102009006177A1 Strahlungsemittierender Halbleiterchip Radiation-emitting semiconductor chip
06/02/2010DE102008059552A1 Leuchtdiodenmodul und Leuchtdiodenbauteil LEDs and LED module component
06/02/2010DE102008059452A1 Electronic component i.e. power semiconductor component, cooling arrangement, has conductor plates arranged at mounting body, where to-be-cooled electronic components electrically contact contacting connector or component of plates
06/02/2010DE102008059316A1 Arrangement for electronic component in housing made of plastic, comprises cover and lower piece, where cover is connected with lower piece
06/02/2010DE102008059314A1 Electronic component i.e. sensor, arrangement for use in e.g. vehicle application, has lower part, where direction of lid on lower part deviates from direction of connection of lower part with lid, and preset force lies on component region
06/02/2010DE102008044106A1 Method for applying bumps on substrate, involves providing substrate with surface layer, which has wetting layer and dewetting layer, and immersing partially substrate into molten mass made of bumping material
06/02/2010DE102008016431B4 Metalldeckschicht mit erhöhtem Elektrodenpotential für kupferbasierte Metallgebiete in Halbleiterbauelementen sowie Verfahren zu ihrer Herstellung Metal coating layer with increased electrode potential for copper-based metal regions in semiconductor devices and methods for their preparation
06/02/2010DE102007022517B4 Wärmetauscher zur Kühlung einer elektronischen Baugruppe Heat exchanger for cooling of an electronic assembly
06/02/2010DE102006012645B4 Verfahren zum Verpacken von integrierten Schaltungen auf Waferniveau, zusammengesetzter Wafer und Packung auf Waferniveau A method of packaging integrated circuits at the wafer level, composite wafer, and wafer-level package
06/02/2010CN201499414U Fixed buckle
06/02/2010CN201499413U radiating module
06/02/2010CN201499371U Circuit board structure
06/02/2010CN201499085U Minitype encapsulation power factor corrector
06/02/2010CN201498853U Electrical connector combination
06/02/2010CN201498797U Electronic component
06/02/2010CN201498515U Flat package type bridge arm component with bidirectional thyristor
06/02/2010CN201498514U Full-range light-emitting LED device
06/02/2010CN201498513U Device for protecting hydraulic rectifier diodes
06/02/2010CN201498512U semiconductor refrigeration radiator
06/02/2010CN201496918U LED lamp radiator
06/02/2010CN201496917U High-power LED street lamp cap adopting water-cooling heat dissipation
06/02/2010CN201496916U Radiation device for high-power LED lamp
06/02/2010CN201496914U Heat-pipe heat-dissipating device with reinforced-type evaporation section for LED lamp
06/02/2010CN201496913U Heat-radiating device for LED streetlamp
06/02/2010CN201496912U LED lamp cooling device
06/02/2010CN201496845U Water cooled radiating high-power LED street lamp base
06/02/2010CN201496824U High power LED illuminating device based on combinational radiation of radiating fin and micro-fan
06/02/2010CN1985014B Material for conductor tracks made of copper alloy
06/02/2010CN1866506B 半导体器件 Semiconductor devices
06/02/2010CN1832160B Interconnect arrangement and associated production methods
06/02/2010CN1779949B Method for bonding microstructures to semiconductor substrate
06/02/2010CN1701649B Method for supplying solder and solder projection forming method
06/02/2010CN1679162B Substrate based unmolded package and method for forming the package
06/02/2010CN101720504A Semiconductor package having dimpled plate interconnections
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