Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
06/2010
06/08/2010US7733650 Motor controller
06/08/2010US7733621 Energy conditioning circuit arrangement for integrated circuit
06/08/2010US7733205 Electrically decoupled integrated transformer having at least one grounded electric shield
06/08/2010US7732937 Semiconductor package with mold lock vent
06/08/2010US7732936 Buffer coating having a physical mixture of high toughness polymer and a low shrinkage polymer
06/08/2010US7732935 Wiring board, electronic circuit board, electronic apparatus and manufacturing method of electronic circuit board
06/08/2010US7732934 Semiconductor device having conductive adhesive layer and method of fabricating the same
06/08/2010US7732932 Semiconductor chips with crack stop regions for reducing crack propagation from chip edges/corners
06/08/2010US7732931 Semiconductor package and method for manufacturing the same for decreasing number of processes
06/08/2010US7732930 Semiconductor device, relay chip, and method for producing relay chip
06/08/2010US7732929 Power semiconductor component with semiconductor chip stack in a bridge circuit and method for producing the same
06/08/2010US7732928 Structure for protecting electronic packaging contacts from stress
06/08/2010US7732927 Semiconductor device having a interlayer insulation film with low dielectric constant and high mechanical strength
06/08/2010US7732926 Semiconductor device having a through electrode with a low resistance and method of manufacturing the same
06/08/2010US7732925 Semiconductor device and manufacturing method thereof
06/08/2010US7732924 Semiconductor wiring structures including dielectric cap within metal cap layer
06/08/2010US7732923 Impurity doped UV protection layer
06/08/2010US7732921 Window type BGA semiconductor package and its substrate
06/08/2010US7732920 Flip chip mounting body, flip chip mounting method and flip chip mounting apparatus
06/08/2010US7732919 Semiconductor device
06/08/2010US7732918 Vapor chamber heat sink having a carbon nanotube fluid interface
06/08/2010US7732916 Semiconductor package
06/08/2010US7732915 Semiconductor sensor device with sensor chip and method for producing the same
06/08/2010US7732914 Cavity-type integrated circuit package
06/08/2010US7732913 Semiconductor package substrate
06/08/2010US7732912 Semiconductor chip packages and assemblies with chip carrier units
06/08/2010US7732911 Semiconductor packaging substrate improving capability of electrostatic dissipation
06/08/2010US7732910 Lead frame including suspending leads having trenches formed therein
06/08/2010US7732909 Method for embedding a component in a base
06/08/2010US7732908 Semiconductor device and semiconductor memory device
06/08/2010US7732907 Integrated circuit package system with edge connection system
06/08/2010US7732906 Semiconductor device
06/08/2010US7732905 Stack package and semiconductor module implementing the same
06/08/2010US7732904 Multi-surface contact IC packaging structures and assemblies
06/08/2010US7732903 High capacity memory module using flexible substrate
06/08/2010US7732902 Semiconductor package with getter formed over an irregular structure
06/08/2010US7732901 Integrated circuit package system with isloated leads
06/08/2010US7732900 Wired circuit board
06/08/2010US7732899 Etch singulated semiconductor package
06/08/2010US7732898 Electrical fuse and associated methods
06/08/2010US7732897 Methods of die sawing and structures formed thereby
06/08/2010US7732894 Electronic components on trenched substrates and method of forming same
06/08/2010US7732882 Method and system for electrically coupling a chip to chip package
06/08/2010US7732869 Insulated-gate semiconductor device
06/08/2010US7732866 Grounding front-end-of-line structures on a SOI substrate
06/08/2010US7732864 Semiconductor device and semiconductor integrated circuit using the same
06/08/2010US7732848 Power semiconductor device with improved heat dissipation
06/08/2010US7732820 Substrate for display device having a protective layer provided between the pixel electrodes and wirings of the active matrix substrate, manufacturing method for same and display device
06/08/2010US7732339 Plasma-etching the organic/inorganic hybrid film containing silicon-carbon-hydrogen-oxygen while eliminating a carbon component from a surface portion of the film; photoresists; photomasks; chemical mechanical polishing
06/08/2010US7732333 Process for producing and apparatus for improving the bonding between a plastic and a metal
06/08/2010US7732331 Copper interconnect structure having stuffed diffusion barrier
06/08/2010US7732321 Method for shielding integrated circuits
06/08/2010US7732317 Methods of forming contact structures for memory cells using both anisotropic and isotropic etching
06/08/2010US7732307 Method of forming amorphous TiN by thermal chemical vapor deposition (CVD)
06/08/2010US7732260 Semiconductor device power interconnect striping
06/08/2010US7732259 Non-leaded semiconductor package and a method to assemble the same
06/08/2010US7732258 Lead frame and method for fabricating semiconductor package employing the same
06/08/2010US7732254 Semiconductor multi-package module having package stacked over die-up flip chip ball grid array package and having wire bond interconnect between stacked packages
06/08/2010US7732252 Multi-chip package system incorporating an internal stacking module with support protrusions
06/08/2010US7731833 Electrodeposition of electroconductive metals on wafers, panels, magnetic heads or substrates having cavities, by applying power and electrolyte solutions to the surfaces; integrated circuits; chemical mechanical polishing
06/08/2010US7731796 Nitrogen semiconductor compound and device fabricated using the same
06/08/2010US7731078 Semiconductor system with fine pitch lead fingers
06/08/2010US7731076 Laser trimming problem suppressing semiconductor device manufacturing apparatus and method
06/08/2010US7730606 Manufacturing method for a wireless communication device and manufacturing apparatus
06/08/2010US7730605 Method of fabricating heat dissipating apparatus
06/03/2010WO2010062360A1 Semiconductor device comprising efuses of enhanced programming efficiency
06/03/2010WO2010062334A1 Method and apparatus for reducing semiconductor package tensile stress
06/03/2010WO2010061826A1 Lead frame, semiconductor device using the lead frame, intermediate product thereof, and methods for producing same
06/03/2010WO2010061552A1 Electronic component package and electronic component package manufacturing method
06/03/2010WO2010061551A1 Semiconductor device and electronic device
06/03/2010WO2010061495A1 Semiconductor device and method for manufacturing same
06/03/2010WO2010061470A1 Wafer and method for manufacturing package product
06/03/2010WO2010061311A1 Electrical contact configuration of micro-electromechanical component and fabrication method
06/03/2010WO2010061259A1 Plating substrate having sn plating layer, and fabrication method therefor
06/03/2010WO2010061245A1 Power mos transistor device
06/03/2010WO2010061244A1 Power mos transistor device and switch apparatus comprising the same
06/03/2010WO2010060755A1 Method for producing an rfid transponder product, and rfid transponder product produced using the method
06/03/2010WO2010060638A1 Compensation of degradation of performance of semiconductor devices by clock duty cycle adaptation
06/03/2010WO2010060342A1 Heat pipe with micro-pore tubes array and making method thereof and heat exchanging system
06/03/2010WO2010060302A1 A heat pipe with arranged micro-pore tubes, its fabricating method and a heat exchanging system
06/03/2010WO2010060286A1 Structure of conductive holes of multilayer board and manufacturing method thereof
06/03/2010WO2010033322A3 Stacking quad pre-molded component packages, systems using the same, and methods of making the same
06/03/2010WO2009024913A9 Identification of devices using physically unclonable functions
06/03/2010WO2007050101A8 Packaging systems incorporating thin film liquid crystal polymer (lcp) and methods of manufacture
06/03/2010US20100136840 Apparatus for providing controlled impedance in an electrical contact
06/03/2010US20100136738 Solid-state imaging device, solid-state imaging apparatus and methods for manufacturing the same
06/03/2010US20100134139 Signal isolators using micro-transformers
06/03/2010US20100133952 Complex Microdevices and Apparatus and Methods for Fabricating Such Devices
06/03/2010US20100133705 Apparatus and method for reducing pitch in an integrated circuit
06/03/2010US20100133704 Semiconductor Device and Method of Forming an Interposer Package with Through Silicon Vias
06/03/2010US20100133703 Semiconductor Chip Laminate and Adhesive Composition for Semiconductor Chip Lamination
06/03/2010US20100133702 Method for eliminating loading effect using a via plug
06/03/2010US20100133701 Semiconductor device and method for manufacturing semiconductor device
06/03/2010US20100133700 Performance enhancement in metallization systems of microstructure devices by incorporating grain size increasing metal features
06/03/2010US20100133699 Microstructure device including a metallization structure with air gaps formed commonly with vias
06/03/2010US20100133698 Semiconductor device and method of manufacturing semiconductor device
06/03/2010US20100133697 Low resistance through-wafer via
06/03/2010US20100133696 Isolation Structure for Protecting Dielectric Layers from Degradation
06/03/2010US20100133695 Electronic circuit with embedded memory
06/03/2010US20100133694 Metal interconnect and ic chip including metal interconnect
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