Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
06/2010
06/09/2010CN101728287A Wafer-level package with column-shaped projection coated with solder
06/09/2010CN101728282A Electronic device and process for manufacturing electronic device
06/09/2010CN101726811A Optical transmission apparatus
06/09/2010CN101725950A LED illuminating lamp heat abstraction module and heat abstractor composed of same
06/09/2010CN101725948A Light-emitting diode lamp
06/09/2010CN101725947A Light-emitting diode lighting device
06/09/2010CN101725946A Light-emitting diode lamp
06/09/2010CN101725944A Light source component and backlight module
06/09/2010CN101725943A Fluid-convection heat-dissipating device
06/09/2010CN101725876A LED automobile headlamp with integrated distant and near light
06/09/2010CN101725861A Full-color light-emitting diode fishing gathering lamp
06/09/2010CN101724361A Aeolotropic conductive adhesive and conductive film and electric connection method thereof
06/09/2010CN101724354A Resin composition and semiconductor devices made by using the same
06/09/2010CN101722408A Radiator plate, perforated plate and methods of making the same
06/09/2010CN101471330B Semiconductor encapsulation structure
06/09/2010CN101471328B Substrate panel
06/09/2010CN101465337B Electrical test key and test method
06/09/2010CN101459121B Through hole and through hole forming method
06/09/2010CN101459044B Dishing phenomenon detection unit in chemical mechanical polishing, manufacturing method and detection method
06/09/2010CN101452912B Device for forming alignment mark on back surface, and method for forming alignment mark
06/09/2010CN101442262B High integration IGBT converter module
06/09/2010CN101440915B Combined type polar heat radiation high power LED electronic lamp
06/09/2010CN101432875B Apparatus and method for mounting electronic elements
06/09/2010CN101425488B Novel liquid cooling heat radiator for semiconductor device
06/09/2010CN101413655B Heat radiation structure of LED lamp backlight device
06/09/2010CN101409262B Pixel structure manufacturing method
06/09/2010CN101404273B Semiconductor device
06/09/2010CN101399301B Surface adhesion conducting wire rack
06/09/2010CN101388385B Semiconductor device
06/09/2010CN101387390B Lamp heat radiating device and LED lamp
06/09/2010CN101383355B Pixel construction, display panel, photovoltaic device and production process thereof
06/09/2010CN101373807B Preparation of conductive metallic layer on semiconductor device
06/09/2010CN101369573B Perforation structure of chip-level electronic package
06/09/2010CN101369571B Semiconductor device, wafer coarse alignment mark and coarse alignment method
06/09/2010CN101369560B Packed electronic element
06/09/2010CN101359704B Light element device and method for manufacturing same
06/09/2010CN101355040B Stacking structure for multiple chips and manufacturing method thereof
06/09/2010CN101351885B Semiconductor package and its manufacture method
06/09/2010CN101349416B Radiating structure of LED
06/09/2010CN101336059B Fan fixer
06/09/2010CN101331604B Circuit device and method for manufacturing circuit device
06/09/2010CN101330078B High on-state voltage LED integrated chip with electrostatic protection and manufacturing method thereof
06/09/2010CN101330067B Self-aligning wafer or chip structure and self-aligning stacking structure and manufacturing method thereof
06/09/2010CN101330039B Method for eliminating load effect using through-hole plug
06/09/2010CN101325183B Ultra-thin cavity type power module and encapsulation method thereof
06/09/2010CN101325166B Structure of IC and forming method thereof
06/09/2010CN101319775B High thermal conductivity flexible sealant of power type LED lamp
06/09/2010CN101310382B 热交换增强 Heat exchange enhancement
06/09/2010CN101308831B Lead frame of leadless encapsulation and encapsulation construction thereof
06/09/2010CN101297066B Copper based composite base material for electronic part, electronic part and process for producing copper based composite base material for electronic part
06/09/2010CN101295684B Cooling encapsulation of heating element
06/09/2010CN101286525B Electro-optical device and electronic instrument
06/09/2010CN101286497B Chip packaging structure and manufacture process thereof
06/09/2010CN101283631B Method for manufacturing printed wiring board
06/09/2010CN101271905B Pixel structure and active element array substrate
06/09/2010CN101271885B Image sensor encapsulation and image taking device using the same
06/09/2010CN101271878B Lead frame
06/09/2010CN101266935B Method of producing semiconductor device
06/09/2010CN101257011B Low profile flip chip power module and method of making
06/09/2010CN101257000B Structure including via and manufacturing method thereof
06/09/2010CN101252110B Encapsulation structure and manufacturing method thereof
06/09/2010CN101246911B Metal microgrid transparent electrode and method for producing the same
06/09/2010CN101232777B Printed circuit board
06/09/2010CN101232775B Printed circuit board and method for producing the printed circuit board
06/09/2010CN101231958B Lead frame and its manufacture method, and lead frame including an interlocking structure
06/09/2010CN101221930B Chip packaging structure and its packaging method
06/09/2010CN101217131B Pixel structure and its making method
06/09/2010CN101207121B Esd protection circuit
06/09/2010CN101202299B Organic light emitting diode display device and method of manufacturing the same
06/09/2010CN101197361B Power module and method of manufacturing the same
06/09/2010CN101194547B Electronic component thermo-compression tool, and electronic component mounting apparatus and mounting method
06/09/2010CN101192593B Semiconductor device and method for manufacturing the same
06/09/2010CN101188216B Semiconductor device
06/09/2010CN101183675B Method and system for wafer-stage package of chip having a number of pieces
06/09/2010CN101174641B Display device
06/09/2010CN101170120B Phase change memory cells with dual access devices
06/09/2010CN101164162B Semiconductor device and semiconductor device manufacturing method
06/09/2010CN101159287B Tunnel transistor having spin-related transfer characteristic and nonvolatile memory using same
06/09/2010CN101154670B Pixel structure and its manufacturing method
06/09/2010CN101150087B Device with plating through structure and its making method
06/09/2010CN101145546B Semiconductor device and method for fabricating the same
06/09/2010CN101142677B Device and method for depositing passive structure on target
06/09/2010CN101141849B Built-in capacity cell structure and method for producing same
06/09/2010CN101136427B Organic light emitting display
06/09/2010CN101136422B CMOS image sensor and method for manufacturing the same
06/09/2010CN101131976B 半导体装置及半导体封装件 The semiconductor device and the semiconductor package
06/09/2010CN101131938B Ram lead frame and its manufacturing method
06/09/2010CN101124684B Superconductive articles having density characteristics
06/09/2010CN101123247B LED encapsulation structure
06/09/2010CN101118901B Stack type chip packaging structure and manufacture process
06/09/2010CN101097963B Semiconductor device and manufacturing method thereof
06/09/2010CN101090625B Active loop heat sink device with atomizer
06/09/2010CN101083256B Semiconductor device
06/09/2010CN101064289B Power inverter
06/09/2010CN101048868B Method for manufacturing semiconductor device having three-dimensional multilayer structure
06/09/2010CN101015056B Integrated transistor module and method of fabricating same
06/08/2010USRE41369 Semiconductor device and method of manufacturing the same
06/08/2010US7734750 Real-time feedback for policies for computing system management
06/08/2010US7733655 Lid edge capping load
06/08/2010US7733652 Heat sink assembly for a pluggable module
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