Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
09/2014
09/25/2014US20140284720 Semiconductor device for electrostatic discharge protection
09/25/2014US20140284687 Nonvolatile memory device and method for manufacturing same
09/25/2014US20140284624 Semiconductor Component, Semiconductor Module and Methods for Producing a Semiconductor Component and a Semiconductor Module
09/25/2014US20140284617 Semiconductor device
09/25/2014US20140284604 Semiconductor structure for extreme ultraviolet electrostatic chuck with reduced clamping effect
09/25/2014US20140284376 Pb-free solder bumps with improved mechanical properties
09/25/2014US20140284040 Heat spreading layer with high thermal conductivity
09/25/2014DE112011105967T5 Mikroelektronisches Gehäuse und gestapelte mikroelektronische Baugruppe und Rechensystem mit denselben Microelectronic housing and stacked microelectronic assembly and computing system with the same
09/25/2014DE102014103773A1 Mehrchip-Halbleiter-Leistungsbauelement A multi-chip semiconductor power component
09/25/2014DE102013218486A1 Halbleitereinrichtung Semiconductor device
09/25/2014DE102013205138A1 Halbleiterbauelement, Halbleitermodul sowie Verfahren zur Herstellung eines Halbleiterbauelements und eines Halbleitermoduls A semiconductor device, semiconductor module, and method of manufacturing a semiconductor device and a semiconductor module
09/25/2014DE102013204889A1 Leistungsmodul mit mindestens einem Leistungsbauelement Power module with at least one power device
09/25/2014DE102013204883A1 Verfahren zur Kontaktierung eines elektrischen und/oder elektronischen Bauelements und korrespondierendes Elektronikmodul A method of contacting an electrical and / or electronic component and corresponding electronics module
09/25/2014DE102013204828A1 Rückseitenkontaktiertes Halbleiterbauelement und Verfahren zu dessen Herstellung Back-contacted semiconductor device and process for its preparation
09/25/2014DE102013113764B3 Leistungshalbleitereinrichtung Power semiconductor device
09/25/2014DE102013102829A1 Leistungshalbleitermodul und Anordnung hiermit Power semiconductor module and assembly hereby
09/25/2014DE102013102828A1 Leistungsbaugruppe mit einer als Folienverbund ausgebildeten Verbindungeinrichtung Power module with a designed as a film composite connector
09/25/2014DE102013102820A1 Stereokameramodul sowie Verfahren zur Herstellung Stereo camera module and methods for preparing
09/25/2014DE102013102819A1 Kameramodul sowie Verfahren zur Herstellung Camera module and methods for preparing
09/25/2014DE102011080066B4 Halbleitervorrichtung und Verfahren zur Herstellung einer Halbleitervorrichtung A semiconductor device and method of manufacturing a semiconductor device
09/25/2014DE102010038910B4 Halbleitervorrichtung mit Durchgangselektrode und Herstellungsverfahren A semiconductor device having through-electrode and production method
09/25/2014DE102010021764B4 Verfahren zur Niedertemperatur Drucksinterverbindung zweier Verbindungspartner Method for low temperature pressure sintering connection of two link partners
09/25/2014DE102009035920B4 Halbleiterbauelement, Baugruppe und Verfahren zum Herstellen des Halbleiterbauelements A semiconductor device assembly and method of manufacturing the semiconductor device
09/25/2014DE102008049193B4 Niederinduktive Leistungshalbleiteranordnung The low-power semiconductor device
09/25/2014DE102008046724B4 Halbleitervorrichtung Semiconductor device
09/25/2014DE102008037835B4 Elektronische Komponente mit Pufferschicht, Herstellungsverfahren dafür und Halbleiteranordnung mit Puffermitteln Electronic component having a buffer layer, manufacturing method thereof, and semiconductor device comprising buffer means
09/24/2014EP2782133A2 High-frequency module
09/24/2014EP2782132A2 Power system with a connecting device in the form of a film composite
09/24/2014EP2782131A2 Power semiconductor module and assembly using the same
09/24/2014EP2782124A1 Power semiconductor mounting
09/24/2014EP2782123A1 Transfer substrate for forming metal wiring line and method for forming metal wiring line by means of said transfer substrate
09/24/2014EP2781553A1 Silane-containing composition, curable resin composition, and sealing material
09/24/2014EP2781528A1 Curable composition, composition for application, cured film, laser processing method, and manufacturing method for multi-layer wiring structure
09/24/2014EP2781381A1 Device for cooling electrical apparatus
09/24/2014EP2781380A1 Device for cooling electrical apparatus
09/24/2014EP2780941A1 Radio frequency package on package circuit
09/24/2014EP2780940A2 Semiconductor die assemblies with enhanced thermal management, semiconductor devices including same and related methods
09/24/2014EP2780939A2 Stacked semiconductor die assemblies with multiple thermal paths and associated systems and methods
09/24/2014EP2780938A2 Active shield with electrically configurable interconnections
09/24/2014EP2780931A2 Machine suitable for plating a cavity of a semi-conductive or conductive substrate such as a through via structure
09/24/2014EP2780774A1 Electronic apparatus, such as a modem or the like, comprising a plurality of air-cooled processors
09/23/2014USRE45146 Composite multi-layer substrate and module using the substrate
09/23/2014US8843868 Method for assigning terminal of semiconductor package, apparatus, and semiconductor package
09/23/2014US8842440 Printed circuit board and method of manufacturing printed circuit board
09/23/2014US8842438 3D power module package
09/23/2014US8842400 Initial-on SCR device on-chip ESD protection
09/23/2014US8842034 Resistor network implemented in an integrated circuit
09/23/2014US8841983 Inductor structure
09/23/2014US8841784 Semiconductor apparatus and substrate
09/23/2014US8841783 Semiconductor device and method of manufacturing semiconductor device
09/23/2014US8841782 Integrated circuit package system with mold gate
09/23/2014US8841781 Chip having a driving integrated circuit
09/23/2014US8841780 Dicing tape-integrated wafer back surface protective film
09/23/2014US8841779 Semiconductor device and method of forming high routing density BOL BONL and BONP interconnect sites on substrate
09/23/2014US8841778 Three dimensional memory structure
09/23/2014US8841775 Semiconductor device having groove-shaped via-hole
09/23/2014US8841774 Semiconductor device including a first wiring having a bending portion a via
09/23/2014US8841773 Multi-layer interconnect structure for stacked dies
09/23/2014US8841772 Semiconductor device and method of manufacturing the same
09/23/2014US8841771 Semiconductor device
09/23/2014US8841770 Semiconductor interconnect structure having enhanced performance and reliability
09/23/2014US8841769 Semiconductor device having metal plug and method of manufacturing the same
09/23/2014US8841768 Chip package and a method for manufacturing a chip package
09/23/2014US8841767 Bumping process and structure thereof
09/23/2014US8841766 Cu pillar bump with non-metal sidewall protection structure
09/23/2014US8841765 Multi-chip module with stacked face-down connected dies
09/23/2014US8841763 Three-dimensional system-in-a-package
09/23/2014US8841762 Sensor module, sensor device, manufacturing method of sensor device, and electronic apparatus
09/23/2014US8841761 Organic light emitting diode display
09/23/2014US8841760 Stacked semiconductor device and method of manufacturing the same
09/23/2014US8841759 Semiconductor package and manufacturing method thereof
09/23/2014US8841758 Semiconductor device package and method of manufacture
09/23/2014US8841757 Film for the backside of flip-chip type semiconductor, dicing tape-integrated film for the backside of semiconductor, method of manufacturing film for the backside of flip-chip type semiconductor, and semiconductor device
09/23/2014US8841755 Through silicon via and method of forming the same
09/23/2014US8841754 Semiconductor devices with stress relief layers
09/23/2014US8841753 Semiconductor device having seal wiring
09/23/2014US8841752 Semiconductor structure and method for interconnection of integrated circuits
09/23/2014US8841751 Through silicon vias for semiconductor devices and manufacturing method thereof
09/23/2014US8841749 Semiconductor device comprising a capacitor and an electrical connection via, and fabrication method
09/23/2014US8841748 Semiconductor device comprising a capacitor and an electrical connection via and fabrication method
09/23/2014US8841745 Stress-engineered resistance-change memory device
09/23/2014US8841744 Semiconductor apparatus
09/23/2014US8841727 Circuit with electrostatic discharge protection
09/23/2014US8841720 Semiconductor substrate and semiconductor chip
09/23/2014US8841719 Semiconductor device and method for manufacturing the same
09/23/2014US8841696 High-trigger current SCR
09/23/2014US8841694 LED module with separate heat-dissipation and electrical conduction paths, and related heat dissipation board
09/23/2014US8841693 Light emitting device package and manufacturing method thereof
09/23/2014US8841692 Lead frame, its manufacturing method, and semiconductor light emitting device using the same
09/23/2014US8841681 Wide-gap semiconductor substrate and method to fabricate wide-gap semiconductor device using the same
09/23/2014US8841212 Method of making a copper interconnect having a barrier liner of multiple metal layers
09/23/2014US8841208 Method of forming vertical electronic fuse interconnect structures including a conductive cap
09/23/2014US8841204 High yield substrate assembly
09/23/2014US8841173 Integrated circuit packaging system with leadframe lead array routing and method of manufacture thereof
09/23/2014US8841171 Method of making stackable semiconductor assembly with bump/flange heat spreader and dual build-up circuitry
09/23/2014US8841169 High density chip packages, methods of forming, and systems including same
09/23/2014US8841168 Soldering relief method and semiconductor device employing same
09/23/2014US8841167 Manufacturing method of a semiconductor package of small footprint with a stack of lead frame die paddle sandwiched between high-side and low-side MOSFET
09/23/2014US8841166 Manufacturing method of semiconductor device, and semiconductor device
09/23/2014US8841140 Technique for forming a passivation layer without a terminal metal
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