Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
09/2014
09/25/2014WO2014150892A1 Electrically insulative coatings for led lamp and elements
09/25/2014WO2014150747A1 Capacitor with a dielectric between a via and a plate of the capacitor
09/25/2014WO2014150643A1 Gold containing die bond sheet preform spot-welded to a semiconductor bond site on a semiconductor package and corresponding manufacturing method
09/25/2014WO2014150564A1 Package-on-package structure with reduced height
09/25/2014WO2014150259A1 An electronic device with an interlocking mold package
09/25/2014WO2014150168A1 Reconfigurable pop
09/25/2014WO2014150025A1 Integration of a replica circuit and a transformer above a dielectric substrate
09/25/2014WO2014149851A1 Flexible memory system with a controller and a stack of memory
09/25/2014WO2014149579A1 Insulated top side bump connection for a power device, for example for gate, source and drain contacts of a power field effect transistor
09/25/2014WO2014149448A1 Packaging for an electronic circuit
09/25/2014WO2014149338A1 Multi-chip module with self-populating positive features
09/25/2014WO2014149274A1 Methods and structures to facilitate through-silicon vias
09/25/2014WO2014148717A1 Photocurable composition and enveloped device including same
09/25/2014WO2014148642A1 Protective film-forming film and protective film-forming composite sheet
09/25/2014WO2014148496A1 Film for forming protection film
09/25/2014WO2014148484A1 Lead frame for mounting semiconductor elements, and production method therefor
09/25/2014WO2014148478A1 Laminated structure and semiconductor device
09/25/2014WO2014148457A1 Ceramic package and electronic component
09/25/2014WO2014148425A1 Method for manufacturing bonded body and method for manufacturing power-module substrate
09/25/2014WO2014148420A1 Method for manufacturing power-module substrate
09/25/2014WO2014148362A1 Backlight device, and display device
09/25/2014WO2014148319A1 Contact component and semiconductor module
09/25/2014WO2014148308A1 Method for producing substrate for semiconductor element mounting
09/25/2014WO2014148119A1 Adhering apparatus and method for manufacturing electronic apparatus
09/25/2014WO2014148085A1 Electronic control apparatus and method for connecting substrate of electronic control apparatus
09/25/2014WO2014148026A1 Heat-sink structure, semiconductor device, and heat-sink mounting method
09/25/2014WO2014148019A1 Semiconductor device and method for manufacturing same
09/25/2014WO2014147990A1 Thin film transistor array
09/25/2014WO2014147862A1 Copper alloy for electrical and electronic equipment, copper alloy thin sheet for electrical and electronic equipment, and conductive component and terminal for electrical and electronic equipment
09/25/2014WO2014147861A1 Copper alloy for electrical and electronic equipment, copper alloy thin sheet for electrical and electronic equipment, and conductive component and terminal for electrical and electronic equipment
09/25/2014WO2014147787A1 Semiconductor device
09/25/2014WO2014147730A1 Package structure
09/25/2014WO2014147691A1 Temperature management system
09/25/2014WO2014147681A1 Populated board, pressing member, and electronic device
09/25/2014WO2014147677A1 Semiconductor device
09/25/2014WO2014147355A1 Flip-chip assembly process comprising pre-coating interconnect elements
09/25/2014WO2014146830A1 Power module with at least one power component
09/25/2014WO2014146369A1 Color film substrate, manufacturing method therefor, and display panel and display device thereof
09/25/2014US20140287568 Method for manufacturing semiconductor device and exposure mask used in the same method
09/25/2014US20140287566 Method of making a semiconductor chip including identifying marks
09/25/2014US20140287558 Package including an interposer having at least one topological feature
09/25/2014US20140287556 Methods of forming bump and semiconductor device with the same
09/25/2014US20140287555 Semiconductor device including semiconductor construct installed on base plate, and manufacturing method of the same
09/25/2014US20140287553 Method for Forming Chip-on-Wafer Assembly
09/25/2014US20140287239 Graphene based filler material of superior thermal conductivity for chip attachment in microstructure devices
09/25/2014US20140287227 Joint Material, and Jointed Body
09/25/2014US20140286605 Self-aligned chip carrier and package structure thereof
09/25/2014US20140284821 Method of curing thermoplastics with microwave energy
09/25/2014US20140284820 Substrate for mounting semiconductor, semiconductor device and method for manufacturing semiconductor device
09/25/2014US20140284819 Method for manufacturing semiconductor devices having a metallisation layer
09/25/2014US20140284818 Semiconductor chip and semiconductor device
09/25/2014US20140284816 Through silicon via wafer, contacts and design structures
09/25/2014US20140284815 Interlevel dielectric stack for interconnect structures
09/25/2014US20140284814 Semiconductor device and manufacturing method thereof
09/25/2014US20140284813 Interconnect level structures for confining stitch-induced via structures
09/25/2014US20140284812 Forming array contacts in semiconductor memories
09/25/2014US20140284811 Methods for Multi-Wire Routing and Apparatus Implementing Same
09/25/2014US20140284810 Semiconductor device
09/25/2014US20140284809 Power converter
09/25/2014US20140284808 Stacked semiconductor device, and method and apparatus of manufacturing the same
09/25/2014US20140284806 Semiconductor device die attachment
09/25/2014US20140284805 Multiple helix substrate and three-dimensional package with same
09/25/2014US20140284804 Semiconductor device
09/25/2014US20140284803 Semiconductor package and fabrication method thereof
09/25/2014US20140284802 Semiconductor device and method of manufacturing the same
09/25/2014US20140284801 Semiconductor device and method for manufacturing same
09/25/2014US20140284800 Graphene wiring
09/25/2014US20140284799 Semiconductor device and method of manufacturing the same
09/25/2014US20140284798 Graphene wiring and method of manufacturing the same
09/25/2014US20140284797 Power semiconductor device fabrication method, power semiconductor device
09/25/2014US20140284796 Microelectronic devices and methods for filling vias in microelectronic devices
09/25/2014US20140284795 Semiconductor package and method for manufacturing the same
09/25/2014US20140284794 Tin-based solder ball and semiconductor package including the same
09/25/2014US20140284793 Semiconductor device having a through-substrate via
09/25/2014US20140284792 Electronic device package
09/25/2014US20140284791 Coreless integrated circuit packaging system and method of manufacture thereof
09/25/2014US20140284790 Semiconductor device and method of manufacturing the same
09/25/2014US20140284789 Method of manufacturing semiconductor device and semiconductor device
09/25/2014US20140284788 Semiconductor device and method of forming pip with inner known good die interconnected with conductive bumps
09/25/2014US20140284787 Jet impingement cooling apparatuses having non-uniform jet orifice sizes
09/25/2014US20140284786 Semiconductor device
09/25/2014US20140284785 Semiconductor device and manufacturing method thereof
09/25/2014US20140284784 Semiconductor device
09/25/2014US20140284783 Semiconductor device
09/25/2014US20140284782 Semiconductor device and method for manufacturing the same
09/25/2014US20140284781 Semiconductor module and manufacturing method thereof
09/25/2014US20140284780 Method of manufacturing semiconductor device, and semiconductor device
09/25/2014US20140284779 Semiconductor device having reinforced wire bonds to metal terminals
09/25/2014US20140284778 Methods And Systems For Selectively Forming Metal Layers On Lead Frames After Die Attachment
09/25/2014US20140284776 Semiconductor device
09/25/2014US20140284775 Semiconductor device and method for manufacturing the same
09/25/2014US20140284772 Semiconductor device manufacturing method and semiconductor device thereof
09/25/2014US20140284771 Method for Manufacturing a Plurality of Chips
09/25/2014US20140284765 Electric power conversion apparatus
09/25/2014US20140284764 Semiconductor package having heat slug and passive device
09/25/2014US20140284761 Integrated inductor and integrated inductor fabricating method
09/25/2014US20140284756 Semiconductor device
09/25/2014US20140284749 Semiconductor device, method for manufacturing the same, and electronic device
09/25/2014US20140284745 Solid-state imaging device
09/25/2014US20140284731 Semiconductor device
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