Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
07/2010
07/14/2010CN101777526A Packaging structure of heat radiating block, with rectangular locking hole, positively arranged on base island embedded chip
07/14/2010CN101777525A Luminous module group with high heat conductivity and light conductivity functions and application device
07/14/2010CN101777524A Chip packaging structure and conducting wire framework
07/14/2010CN101777523A Case of extra-high voltage high-power thyristor component
07/14/2010CN101777512A Local interconnect structure for a CMOS image sensor and its manufacturing method
07/14/2010CN101777504A System level packaging method of flip chip and attached passive element on support plate chip
07/14/2010CN101776941A Radiating device
07/14/2010CN101776254A Light emitting diode lamp and photo engine thereof
07/14/2010CN101776248A Lamp and illumination device thereof
07/14/2010CN101775211A Polyimide film
07/14/2010CN101515576B COF packaging structure, method of manufacturing the COF packaging structure, and method for assembling theCOF packaging structure thereof
07/14/2010CN101447465B Metal carrier band for packaging noncontact module with large size
07/14/2010CN101383328B Passivation film of composite semiconductor silicon device and passivation generating process
07/14/2010CN101345225B Electronic component and method of forming the same
07/14/2010CN101320730B Semiconductor chip with built-in test circuit
07/14/2010CN101295719B LED panel and its active element array substrate
07/14/2010CN101295717B Thin-film transistor panel and its production method
07/14/2010CN101271535B Storage medium with stack element structure
07/14/2010CN101257031B Thin-film transistor array substrate and manufacturing method thereof
07/14/2010CN101212888B Bionic power driven radiator that simulates cardiac structure
07/14/2010CN101208574B Radiator
07/14/2010CN101206848B Multicolor field control display
07/14/2010CN101142676B Electronic device and carrier substrate
07/14/2010CN101091247B Dual flat non-leaded semiconductor package
07/14/2010CN101051634B Silicon lining bottom plane LED integrated chip and producing method
07/13/2010US7757195 Methods and systems for implementing dummy fill for integrated circuits
07/13/2010US7757083 Integrated circuit that uses a dynamic characteristic of the circuit
07/13/2010US7756503 High frequency module
07/13/2010US7755910 Capacitor built-in interposer and method of manufacturing the same and electronic component device
07/13/2010US7755897 Memory module assembly with heat dissipation device
07/13/2010US7755896 Information processing device
07/13/2010US7755280 Active matrix electroluminescence device having a metallic protective layer and method for fabricating the same
07/13/2010US7755207 Wafer, reticle, and exposure method using the wafer and reticle
07/13/2010US7755206 Pad structure to provide improved stress relief
07/13/2010US7755205 Electronic component, semiconductor device, methods of manufacturing the same, circuit board, and electronic instrument
07/13/2010US7755204 Stacked die module including multiple adhesives that cure at different temperatures
07/13/2010US7755201 Semiconductor device and method of fabricating the same
07/13/2010US7755200 Methods and arrangements for forming solder joint connections
07/13/2010US7755199 Flexible lead surface-mount semiconductor package
07/13/2010US7755198 Al-Ni-based alloy wiring material and element structure using the same
07/13/2010US7755197 UV blocking and crack protecting passivation layer
07/13/2010US7755196 Method for production of an integrated circuit bar arrangement, in particular comprising a capacitor assembly, as well as an integrated circuit arrangement
07/13/2010US7755195 Semiconductor apparatus integrating an electrical device under an electrode pad
07/13/2010US7755194 Tantalum/graded tantalum nitride barrier layer is formed in Cu interconnects for improved adhesion, electromigration resistance and reliability; high speed integrated circuits in semiconductor devices
07/13/2010US7755193 Non-rectilinear routing in rectilinear mesh of a metallization layer of an integrated circuit
07/13/2010US7755192 Copper interconnection structure, barrier layer including carbon and hydrogen
07/13/2010US7755191 Semiconductor device and method of manufacturing the same
07/13/2010US7755188 Method and apparatus for stacking electrical components using via to provide interconnection
07/13/2010US7755187 Load driving device
07/13/2010US7755186 Cooling solutions for die-down integrated circuit packages
07/13/2010US7755185 Arrangement for cooling a power semiconductor module
07/13/2010US7755184 Liquid metal thermal interface material system
07/13/2010US7755183 Wiring board, method of manufacturing the same, and semiconductor device
07/13/2010US7755182 Hybrid integrated circuit device, and method for fabricating the same, and electronic device
07/13/2010US7755181 IC package and method of manufacturing the same
07/13/2010US7755180 Integrated circuit package-in-package system
07/13/2010US7755179 Semiconductor package structure having enhanced thermal dissipation characteristics
07/13/2010US7755178 Base semiconductor component for a semiconductor component stack and method for the production thereof
07/13/2010US7755177 Carrier structure of SoC with custom interface
07/13/2010US7755176 Die-mounting substrate and method incorporating dummy traces for improving mounting film planarity
07/13/2010US7755175 Multi-stack chip package with wired bonded chips
07/13/2010US7755169 Semiconductor device, method of manufacturing the same, and phase shift mask
07/13/2010US7755151 Wafer level package for surface acoustic wave device and fabrication method thereof
07/13/2010US7755147 Semiconductor device, semiconductor system and semiconductor device manufacturing method
07/13/2010US7755143 Semiconductor device
07/13/2010US7755140 Process charging and electrostatic damage protection in silicon-on-insulator technology
07/13/2010US7755110 Architecture of function blocks and wirings in a structured ASIC and configurable driver cell of a logic cell zone
07/13/2010US7755090 Solid state image pickup device and method of producing solid state image pickup device
07/13/2010US7755084 Semiconductor wafer, semiconductor chip and method of manufacturing semiconductor chip
07/13/2010US7755083 Package module with alignment structure and electronic device with the same
07/13/2010US7754983 Electronic parts packaging structure and method of manufacturing the same
07/13/2010US7754978 Multilayer printed wiring board and method of manufacturing the same
07/13/2010US7754903 adamantyl diglycidyl ether or 1-adamantanol epichlorohydrin adduct curable to polyepoxides; encapsulant for light-emitting diode; superior optical properties, heat resistance, photostability, and shrinkage inhibition
07/13/2010US7754606 Shielded capacitor structure
07/13/2010US7754574 Optimum padset for wire bonding RF technologies with high-Q inductors
07/13/2010US7754558 Method of avoiding unwanted metal deposition on a semiconductor resistor structure
07/13/2010US7754537 Manufacture of mountable capped chips
07/13/2010US7754535 Method of manufacturing chip integrated substrate
07/13/2010US7754534 Semiconductor device and manufacturing method thereof
07/13/2010US7754531 Method for packaging microelectronic devices
07/13/2010US7754343 lead-free interconnects; integrated circuits; printed circuits
07/13/2010US7753253 Dispensing device and mounting system
07/13/2010CA2360372C An optoelectronic assembly
07/08/2010WO2010078021A2 Removable package underside device attach
07/08/2010WO2010077778A1 Stacked die parallel plate capacitor
07/08/2010WO2010076733A1 Physical structure for use in a physical unclonable function
07/08/2010WO2010076187A2 Integrated electronic device with transceiving antenna and magnetic interconnection
07/08/2010WO2010076074A1 Interconnect structure with improved dielectric line to via electromigration resistant interfacial layer and method of fabricating same
07/08/2010WO2010076068A1 Heat sink blockage detector
07/08/2010WO2010076056A1 Structures and methods for improving solder bump connections in semiconductor devices
07/08/2010WO2010075831A1 Method for producing lamps
07/08/2010WO2010075669A1 Self-cooling type thyristor valve
07/08/2010WO2010053730A3 Combined diode, lead assembly incorporating an expansion joint
07/08/2010WO2009130416A3 Method for forming porous material in microcavity or micropassage by mechanochemical polishing
07/08/2010US20100173165 Intercalated Superlattice Compositions and Related Methods for Modulating Dielectric Property
07/08/2010US20100172091 Cooling apparatus for semiconductor chips
07/08/2010US20100172060 System and Method for ESD Protection
07/08/2010US20100171543 Packaged power switching device
07/08/2010US20100171228 Integrated circuit package system and method of manufacture thereof
07/08/2010US20100171227 Method of producing a via in a reconstituted substrate
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