Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
06/2010
06/30/2010CN101764151A SCR ESD protective structure with high maintaining voltage
06/30/2010CN101764148A 电致发光装置 Electroluminescent devices
06/30/2010CN101764145A Organic light emitting diode display
06/30/2010CN101764136A Interdigital structure capable of regulating channel current of vertical gate SOI CMOS devices
06/30/2010CN101764134A Three-dimensional semiconductor devices and methods of operating the same
06/30/2010CN101764129A Power module without solder terminal
06/30/2010CN101764128A Inductor in semiconductor device packaging structure
06/30/2010CN101764127A Semiconductor package without outer pins and stacked structure thereof
06/30/2010CN101764126A Multi-chip semiconductor package structure without outer leads and lead frame thereof
06/30/2010CN101764125A Overspeed delay test system and method
06/30/2010CN101764124A Measurement structure of interconnection resistance and method thereof
06/30/2010CN101764123A Millimeter wave transmission line for slow phase velocity
06/30/2010CN101764122A Semiconductor device with double conductive-line pattern and the forming method thereof
06/30/2010CN101764121A Interlayer insulated stacked composite material and preparation method thereof
06/30/2010CN101764120A Leadless packaging structure of semiconductor device
06/30/2010CN101764119A Lead frame structure for packaging SOT26-3L
06/30/2010CN101764118A Base plate for packaging and semiconductor packaging structure
06/30/2010CN101764117A Line structure of packaging carrier plate and multi-chip packaging body
06/30/2010CN101764116A Chip packaging lug structure and realization method thereof
06/30/2010CN101764115A Conducting structure for semiconductor integrated circuit and forming method thereof
06/30/2010CN101764114A Inversion type encapsulation structure and manufacturing method thereof
06/30/2010CN101764113A Metal protruding block structure on connecting pad of circuit surface of semiconductor element and forming method
06/30/2010CN101764112A 半导体集成电路 The semiconductor integrated circuit
06/30/2010CN101764111A Axial type surface contact type glass packaging rectifier tube and manufacture method
06/30/2010CN101764110A Radiator of IGBT (Insulated Gate Bipolar Translator) module for electric vehicle or hybrid electric vehicle
06/30/2010CN101764109A Thermoelectric cooler for semiconductor devices with tsv
06/30/2010CN101764108A Minitype radiator
06/30/2010CN101764107A Diamond heat sink of integrated thermistor
06/30/2010CN101764106A Moisture-proof device, moisture-proof chip and method for enhancing moisture-proof property of chip
06/30/2010CN101764105A Circuit board with hollow space portion and method for manufacturing the same
06/30/2010CN101764092A Semiconductor structure, forming and operating method thereof
06/30/2010CN101764074A Semiconductor device and preparation method thereof
06/30/2010CN101764073A Manufacturing process for a quad flat non-leaded chip package structure
06/30/2010CN101764072A Manufacturing process for a quad flat non-leaded chip package structure
06/30/2010CN101764066A Manufacturing process for a quad flat non-leaded chip package structure
06/30/2010CN101764054A Compound semiconductor epi-wafer and preparation method thereof
06/30/2010CN101763817A Flat panel display including electrostatic protection circuit
06/30/2010CN101763776A Organic electroluminescent display device and method of manufactuing the same
06/30/2010CN101763202A Capacitance type touch display panel and capacitance type touch display substrate
06/30/2010CN101762923A Electrophoretic display device and method of fabricating the same
06/30/2010CN101762917A Pixel array and display panel
06/30/2010CN101762195A Heat-transporting device, electronic apparatus, and method of producing a heat-transporting device
06/30/2010CN101761796A 发光二极管灯具 LED lamp
06/30/2010CN101761795A Light-emitting diode illumination device and encapsulation method thereof
06/30/2010CN101761792A Light-emitting diode fixture and luminescence unit thereof
06/30/2010CN101761786A Combined structure and method of light fitting component
06/30/2010CN101760035A Thermal interface material and using method thereof
06/30/2010CN101418946B Structure of LED heat radiating module, processing method and high heat radiation LED lamp
06/30/2010CN101392900B Heat radiating device of white light LED of automobile head light
06/30/2010CN101378043B Semiconductor device
06/30/2010CN101286482B Pixel structure and transistor therein and method for making the same
06/30/2010CN101261928B Guard ring of semiconductor device and manufacturing method thereof
06/30/2010CN101236918B Method of manufacturing semiconductor apparatus, and semiconductor apparatus
06/29/2010US7746653 Clamp for electrical devices
06/29/2010US7746652 Cooling module retentioner
06/29/2010US7746651 Heat sink assembly having a clip
06/29/2010US7746650 Arrangement for cooling SMD power components on a printed circuit board
06/29/2010US7746648 Modular heat-radiation structure and controller including the structure
06/29/2010US7746647 Clip and heat dissipation assembly using the same
06/29/2010US7746646 Securing device for assembling heat dissipation module onto electronic component
06/29/2010US7746643 Heat sink assembly with a locking device
06/29/2010US7746641 Radiation device for computer or electric appliances
06/29/2010US7746640 Heat dissipation device with heat pipes
06/29/2010US7745952 Electric circuit module with improved heat dissipation characteristics using a fixing tool for fixing an electric apparatus to a heat sink
06/29/2010US7745945 Semiconductor package with position member
06/29/2010US7745944 Microelectronic devices having intermediate contacts for connection to interposer substrates, and associated methods of packaging microelectronic devices with intermediate contacts
06/29/2010US7745943 Microelectonic packages and methods therefor
06/29/2010US7745942 Die package and probe card structures and fabrication methods
06/29/2010US7745941 Semiconductor device having shifted stacked chips
06/29/2010US7745940 Forming ultra dense 3-D interconnect structures
06/29/2010US7745939 Semiconductor device and method of manufacturing the same
06/29/2010US7745938 Circuit device, a method for manufacturing a circuit device, and a semiconductor module
06/29/2010US7745937 Semiconductor device and method of manufacturing the same
06/29/2010US7745936 Semiconductor integrated circuit device
06/29/2010US7745934 Integrated circuit and seed layers
06/29/2010US7745933 Circuit structure and process thereof
06/29/2010US7745932 Semiconductor package, semiconductor package module including the semiconductor package, and methods of fabricating the same
06/29/2010US7745931 Semiconductor device and manufacturing method thereof
06/29/2010US7745930 Semiconductor device packages with substrates for redistributing semiconductor device electrodes
06/29/2010US7745929 Semiconductor device and method for producing the same
06/29/2010US7745928 Heat dissipation plate and semiconductor device
06/29/2010US7745927 Heat sink formed of multiple metal layers on backside of integrated circuit die
06/29/2010US7745926 Composite multi-layer substrate and module using the substrate
06/29/2010US7745925 Multi-functional metal shield case and method for making the same
06/29/2010US7745924 Capacitor embedded in interposer, semiconductor device including the same, and method for manufacturing capacitor embedded in interposer
06/29/2010US7745923 Cover substrate attached to a rim substrate with electrically connected through hole
06/29/2010US7745922 Package board having internal terminal interconnection and semiconductor package employing the same
06/29/2010US7745921 Multi-chip semiconductor device
06/29/2010US7745920 Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices
06/29/2010US7745919 Semiconductor device including a plurality of semiconductor chips and a plurality of through-line groups
06/29/2010US7745918 Package in package (PiP)
06/29/2010US7745917 Compliant integrated circuit package substrate
06/29/2010US7745916 Module comprising polymer-containing electrical connecting element
06/29/2010US7745915 Semiconductor device
06/29/2010US7745914 Package for receiving electronic parts, and electronic device and mounting structure thereof
06/29/2010US7745913 Power semiconductor component with a power semiconductor chip and method for producing the same
06/29/2010US7745912 Stress absorption layer and cylinder solder joint method and apparatus
06/29/2010US7745911 Semiconductor chip package
06/29/2010US7745910 Semiconductor device having RF shielding and method therefor
06/29/2010US7745898 Multichip package, methods of manufacture thereof and articles comprising the same
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