Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
07/2010
07/07/2010CN101771041A Complementary type SCR (Silicon Controlled Rectifier) structure by auxiliary triggering of PMOS (P-channel Metal Oxide Semiconductor) field effect transistors
07/07/2010CN101771040A Complementary-type SCR (Silicon Controlled Rectifier) structure triggered by diode string in an auxiliary way
07/07/2010CN101771038A Integrated circuit structure
07/07/2010CN101771036A Capacitor and manufacture method thereof
07/07/2010CN101771035A Integrated circuit
07/07/2010CN101771033A Integrated circuit including a fusing circuit capable for protecting a fusing spark
07/07/2010CN101771032A Method for forming through hole structure, semiconductor device, metal interconnection structure and mask plate
07/07/2010CN101771031A Photoelectric element-packaging structure with electrostatic protection function
07/07/2010CN101771027A High-power LED module assembly and manufacturing method thereof
07/07/2010CN101771024A Light-emitting diode (LED) and packaging method thereof
07/07/2010CN101771023A Wafer-level test structure
07/07/2010CN101771022A Circuit structure using graphene and manufacture method thereof
07/07/2010CN101771021A Electric fuse structure and manufacture method thereof
07/07/2010CN101771020A Through-silicon via with scalloped sidewalls
07/07/2010CN101771019A Dies, stacked structures, and systems
07/07/2010CN101771018A Through-silicon via with air gap
07/07/2010CN101771017A Base plate structure and semiconductor encapsulation structure comprising the same
07/07/2010CN101771016A Circuit board, manufacturing method thereof and flip chip bonding packaging structure
07/07/2010CN101771015A Wafer structure and wafer packaging structure
07/07/2010CN101771014A Wafer-level package structure and package method thereof
07/07/2010CN101771013A Semiconductor device and method of manufacturing the same
07/07/2010CN101771012A Semiconductor device and method of manufacturing the same
07/07/2010CN101771011A 半导体装置 Semiconductor device
07/07/2010CN101771010A Backside metal treatment of semiconductor chips
07/07/2010CN101771009A Down and up arranged resin circuit board and chip packaging structure with inverted T-shaped locking hole radiation block
07/07/2010CN101771008A External connection heat radiation plate encapsulation structure of positive installation lock hole heat radiation block of base island exposed chip
07/07/2010CN101771007A External connection heat radiation cap encapsulation structure of positive installation locking hole heat radiation block projected post of base island exposed chip
07/07/2010CN101771006A External connection heat radiator encapsulation structure of positive installation rectangular heat radiation block of base island exposed chip
07/07/2010CN101771005A External connection heat radiator encapsulation structure of positive installation reverse T-shaped lock hole of base island embedded chip
07/07/2010CN101771004A Down and up arranged resin circuit board and chip packaging structure with inverted rectangular radiation block
07/07/2010CN101771003A Down and up arranged resin circuit board and chip packaging structure with inverted rectangular locking hole radiation block
07/07/2010CN101771002A Flip heat dissipation block surface protuberance packaging structure of printed circuit board chip
07/07/2010CN101771001A Flip strip heat dissipation block packaging structure of printed circuit board chip
07/07/2010CN101771000A External connection heat radiator encapsulation structure of positive installation reverse T-shaped heat radiation block of base island embedded chip
07/07/2010CN101770999A External connection heat radiation cap encapsulation structure of positive installation lock hole heat radiation block projected post of base island embedded chip
07/07/2010CN101770998A Flip rectangular heat dissipation block packaging structure of printed circuit board chip
07/07/2010CN101770997A Down and up arranged resin circuit board and chip packaging structure with radiation block
07/07/2010CN101770996A Down and up arranged resin circuit board and chip packaging structure with inverted T-shaped radiation block
07/07/2010CN101770995A Chip module structure assembly
07/07/2010CN101770994A Semiconductor package substrate with metal bumps
07/07/2010CN101770993A Leadless packaging structure of semiconductor device
07/07/2010CN101770992A Semiconductor chip protection structure and semiconductor chip
07/07/2010CN101770985A Forming method for MOS device for ESD protection
07/07/2010CN101770982A Liquid crystal display, liquid crystal display substrate and formation method thereof
07/07/2010CN101770963A Method of forming conductive layer and semiconductor device
07/07/2010CN101770962A Structures and methods for improving solder bump connections in semiconductor devices
07/07/2010CN101770959A Rigid-flex module and manufacturing method
07/07/2010CN101770958A Protective thin film coating in chip packaging
07/07/2010CN101770952A Metal oxide semiconductor field effect transistor and forming method thereof
07/07/2010CN101770599A COB soft foundation module, RFID electronic tag using same and manufacturing method thereof
07/07/2010CN101770563A Intelligent card heat dissipating device and manufacturing method thereof
07/07/2010CN101769524A Light emitting diode lamp and light engine thereof
07/07/2010CN101769523A 发光二极管灯具 LED lamp
07/07/2010CN101769521A Heat dissipation device for light-emitting device and light-emitting device thereof
07/07/2010CN101769458A Light-emitting diode lamp and light engine thereof
07/07/2010CN101768427A Thermal interface material and preparation method thereof
07/07/2010CN101768412A CMP slurry composition for barrier polishing for manufacturing copper interconnects, polishing method using the composition, and semiconductor device manufactured by the method
07/07/2010CN101510497B Superimposition marker and method for producing the same
07/07/2010CN101471324B Ultra-low K interconnection structure and method of manufacturing the same
07/07/2010CN101459174B Conductive structure for semiconductor chip and its producing method
07/07/2010CN101459173B Static charging protective semiconductor device
07/07/2010CN101442056B Pixel array substrate
07/07/2010CN101431029B Composite metal line for packaging wire and manufacturing method thereof
07/07/2010CN101425513B Light emitting module having heat radiation function, reflection cover and assembling method thereof
07/07/2010CN101425494B Solder-top enhanced semiconductor device and method for low parasitic impedance packaging
07/07/2010CN101369591B Image sensing element packaging body and preparation thereof
07/07/2010CN101226945B Thin-film transistor array substrate
07/07/2010CN101207074B Integrated circuit having a metal element
07/07/2010CN101044259B Plasma sputtering film deposition method and equipment
07/06/2010US7751924 C4NP servo controlled solder fill head
07/06/2010US7751793 Integrated structure of inductances with shared values on a semiconductor substrate
07/06/2010US7751194 Circuit device, circuit module, and outdoor unit
07/06/2010US7751193 Electronic control apparatus
07/06/2010US7751047 Alignment and alignment marks
07/06/2010US7750487 Metal-metal bonding of compliant interconnect
07/06/2010US7750486 Sensor device having stopper for limitting displacement
07/06/2010US7750485 Semiconductor device and method for manufacturing the same
07/06/2010US7750484 Semiconductor device with flip-chip connection that uses gallium or indium as bonding material
07/06/2010US7750483 Semiconductor chip assembly with welded metal pillar and enlarged plated contact terminal
07/06/2010US7750482 Integrated circuit package system including zero fillet resin
07/06/2010US7750481 Die offset die to die bonding
07/06/2010US7750480 Semiconductor device
07/06/2010US7750478 Semiconductor device with via hole of uneven width
07/06/2010US7750477 Through-hole contacts in a semiconductor device
07/06/2010US7750476 Semiconductor device having a reliable contact
07/06/2010US7750475 Smooth surfaces; shrinkage inhibition; alloy containing silver, copper, iron and cobalt
07/06/2010US7750474 Metal programmable logic and multiple function pin interface
07/06/2010US7750473 LSI wiring pattern for reduced deformation and cracking
07/06/2010US7750471 Metal and alloy silicides on a single silicon wafer
07/06/2010US7750470 Methods for planarization of dielectric layer around metal patterns for optical efficiency enhancement
07/06/2010US7750469 Insulating layer between bumps of semiconductor chip, and display panel using the same with anisotropic conductive film between semiconductor chip and substrate
07/06/2010US7750468 Semiconductor device and method for manufacturing the same
07/06/2010US7750467 Chip scale package structure with metal pads exposed from an encapsulant
07/06/2010US7750466 Microelectronic assembly having second level interconnects including solder joints reinforced with crack arrester elements and method of forming same
07/06/2010US7750465 Packaged integrated circuit
07/06/2010US7750464 Semiconductor device
07/06/2010US7750463 Bidirectional switch module
07/06/2010US7750462 Microelectromechanical systems using thermocompression bonding
07/06/2010US7750461 Metal-ceramic substrate for electric circuits or modules, method for producing one such substrate and module comprising one such substrate
07/06/2010US7750460 Ball grid array package layout supporting many voltage splits and flexible split locations
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