Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
08/2010
08/03/2010US7765692 Method of manufacturing printed wiring board
08/03/2010CA2514515C Package for integrated circuit die
07/2010
07/29/2010WO2010085604A1 Low compressive force, non-silicone, high thermal conducting formulation for thermal interface material and package
07/29/2010WO2010085458A1 Electrical contacts for cmos devices and iii-v devices formed on a silicon substrate
07/29/2010WO2010085319A1 Lead frames with improved adhesion to plastic encapsulant
07/29/2010WO2010084955A1 Board for mounting component, and package for holding component using same
07/29/2010WO2010084844A1 Method for producing semiconductor wiring line
07/29/2010WO2010084824A1 Aluminum/graphite composite, and heat radiation part and led luminescent member both formed using same
07/29/2010WO2010084717A1 Cooling device
07/29/2010WO2010084550A1 Semiconductor module and control method of same
07/29/2010WO2010084540A1 Circuit board, circuit module, and electronic device provided with circuit module
07/29/2010WO2010084538A1 Semiconductor device and method for manufacturing same
07/29/2010WO2010084535A1 Semiconductor device and method for manufacturing same
07/29/2010WO2010083912A1 3d chip-stack with fuse-type through silicon via
07/29/2010WO2010056479A3 Flexible and stackable semiconductor die packages, systems using the same, and methods of making the same
07/29/2010WO2010047503A3 Resin protected thin sensor element
07/29/2010WO2010040016A3 Nickel-gold plateable thick film silver paste, and plating process for low temperature co fired ceramic devices and ltcc devices made therefrom
07/29/2010WO2009082516A3 Adhesive applications using alkali silicate glass for electronics
07/29/2010WO2008073908A3 Photovoltaic cells, modules and methods of making same
07/29/2010US20100190299 Semiconductor Device with Two or More Bond Pad Connections for Each Input/Output Cell and Method of Manufacture Thereof
07/29/2010US20100190287 Semiconductor image sensor and method for fabricating the same
07/29/2010US20100188823 Method for Manufacturing an Electronic Module
07/29/2010US20100188787 Method and apparatus to reduce footprint of esd protection within an integrated circuit
07/29/2010US20100188114 Circuit for Detecting Tier-to-Tier Couplings in Stacked Integrated Circuit Devices
07/29/2010US20100187700 Method and apparatus for manufacturing an electronic module, and electronic module
07/29/2010US20100187699 Semiconductor integrated circuit device
07/29/2010US20100187698 Semiconductor device and method for manufacturing the same
07/29/2010US20100187697 Electronic device package and method for fabricating the same
07/29/2010US20100187696 Semiconductor component and method of manufacture
07/29/2010US20100187695 Out-of-plane spring structures on a substrate
07/29/2010US20100187694 Through-Silicon Via Sidewall Isolation Structure
07/29/2010US20100187693 Diffusion barrier layers
07/29/2010US20100187692 Chip package without core and stacked chip package structure
07/29/2010US20100187691 Chip package without core and stacked chip package structure
07/29/2010US20100187690 Semiconductor device
07/29/2010US20100187689 Semiconductor chips including passivation layer trench structure
07/29/2010US20100187688 Reduced bottom roughness of stress buffering element of a semiconductor component
07/29/2010US20100187687 Underbump Metallization Structure
07/29/2010US20100187686 Semiconductor package comprising alignment memers
07/29/2010US20100187685 Semiconductor device
07/29/2010US20100187684 System and Method for 3D Integrated Circuit Stacking
07/29/2010US20100187683 3-D ICs EQUIPPED WITH DOUBLE SIDED POWER, COOLANT, AND DATA FEATURES
07/29/2010US20100187682 Electronic package and method of assembling the same
07/29/2010US20100187681 Silicon Substrate Having Through Vias and Package Having the Same
07/29/2010US20100187680 Heat radiator
07/29/2010US20100187679 Semiconductor device and method of manufacturing the same
07/29/2010US20100187678 Semiconductor device and method of manufacturing the same
07/29/2010US20100187677 Wafer level package and method of manufacturing the same
07/29/2010US20100187676 Cube semiconductor package composed of a plurality of stacked together and interconnected semiconductor chip modules
07/29/2010US20100187675 Semiconductor device and method of manufacturing the same
07/29/2010US20100187674 Package substrate structure and chip package structure and manufacturing process thereof
07/29/2010US20100187673 Adhesive tape and semiconductor package using the same
07/29/2010US20100187672 Electronic apparatus and circuit board
07/29/2010US20100187671 Forming Seal Ring in an Integrated Circuit Die
07/29/2010US20100187670 On-Chip Heat Spreader
07/29/2010US20100187669 Process for packaging components, and packaged components
07/29/2010US20100187668 Novel build-up package for integrated circuit devices, and methods of making same
07/29/2010US20100187667 Bonded Microelectromechanical Assemblies
07/29/2010US20100187666 Lead frame and method of manufacturing semiconductor device
07/29/2010US20100187665 Integral metal structure with conductive post portions
07/29/2010US20100187664 Electrical connectivity for circuit applications
07/29/2010US20100187663 Method for manufacturing a semiconductor component and structure therefor
07/29/2010US20100187659 Semiconductor device and method for manufacturing semiconductor device
07/29/2010US20100187651 Integrated circuit package and method of forming the same
07/29/2010US20100187638 Anti-fuse cell and its manufacturing process
07/29/2010US20100187611 Contacts in Semiconductor Devices
07/29/2010US20100187605 Monolithic semiconductor switches and method for manufacturing
07/29/2010US20100187574 Memory Cell For Modification of Revision Identifier In An Integrated Circuit Chip
07/29/2010US20100187533 Thin film transistor array panel for a liquid crystal display
07/29/2010US20100187528 Guard ring extension to prevent reliability failures
07/29/2010US20100187527 Tamper-resistant semiconductor device and methods of manufacturing thereof
07/29/2010US20100187526 Semiconductor device and method for manufacturing same
07/29/2010US20100187525 Implementing tamper evident and resistant detection through modulation of capacitance
07/29/2010US20100187317 Semiconductor device
07/29/2010US20100186231 Method for producing a metal-ceramic substrate for electric circuits on modules
07/29/2010DE102009044659A1 Leistungshalbleitermodul The power semiconductor module
07/29/2010DE102009044486A1 Halbleiter-Bauelement Semiconductor component
07/29/2010DE102009006216A1 Cooling device for e.g. battery, in motor vehicle, has housing for accommodating electrical elements, where intermediate space between elements contains inert fluid, granular bulk material and lattice like structure
07/29/2010DE102009004725A1 Halbleiterschaltung mit Durchkontaktierung und Verfahren zur Herstellung vertikal integrierter Schaltungen A semiconductor circuit with plated through-hole and methods for making vertically integrated circuits
07/29/2010DE102009000427A1 Verfahren zur Herstellung eines Sensormoduls A process for producing a sensor module
07/29/2010DE102009000389A1 Integrierter Schaltkreis und Herstellungsverfahren hierfür Integrated circuit and manufacturing method thereof
07/29/2010DE102008060113A1 Verfahren zur Kapselung einer elektronischen Anordnung A method for encapsulating an electronic arrangement
07/29/2010DE102008026216B4 Elektronische Schaltung Electronic circuit
07/29/2010DE102006044690B4 Elektronisches Bauteil und Verfahren zum Herstellen Electronic component and methods for making
07/29/2010DE102004036982B4 Leistungshalbleitermodulsystem mit einem in einen Baugruppenträger einsteckbaren und mit einem Gehäuse des Baugruppenträgers verrastbaren Leistungshalbleitermodul Power semiconductor module system can be latched with an insertable in a rack and a housing of the rack power semiconductor module
07/29/2010DE10004964B4 Mikromechanische Kappenstruktur Micromechanical cap structure
07/28/2010EP2211598A2 Method for making a sensor module
07/28/2010EP2211597A1 Wiring board and capacitor to be built into wiring board
07/28/2010EP2211384A2 Power semiconductor module in pressure contact with active cooling arrangement
07/28/2010EP2211383A2 Metal bonded nanotube array
07/28/2010EP2211382A2 Watertight barrier for a microcomponent and method for manufacturing such a barrier
07/28/2010EP2211377A2 Package substrate structure and chip package structure and manufacturing process thereof
07/28/2010EP2210265A1 Semiconductor structure and method of manufacture
07/28/2010EP2091081B1 Switching assembly with bond connection
07/28/2010EP1729174B1 Photolithographically-patterned out-of-plane coil structures and method of making
07/28/2010CN201536105U Mini-sized expansible-pin surface-mounted diode
07/28/2010CN201536104U 一种静电保护电路 An electrostatic protection circuit
07/28/2010CN201536103U Cylindrical welding column packaging structure for members
07/28/2010CN201536102U Heat radiation encapsulation structure
07/28/2010CN201535493U Led散热装置 Led heatsink
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