Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
08/2010
08/11/2010CN101803016A methods for attachment and devices produced using the methods
08/11/2010CN101803015A Semiconductor chip package with bent outer leads
08/11/2010CN101803014A Methods of forming nano-coatings for improved adhesion between first level interconnects and epoxy under-fills in microelectronic packages and structures formed thereby
08/11/2010CN101803013A Semiconductor device and wire bonding method
08/11/2010CN101803012A Method of forming low profile wire bonds between integrated circuits dies and printed circuit boards
08/11/2010CN101803011A Cooling apparatus
08/11/2010CN101803010A Thermal interface material, electronic device containing the thermal interface material, and methods for their preparation and use
08/11/2010CN101803009A Composite, thermal interface material containing the composite, and methods for their preparation and use
08/11/2010CN101803008A Semiconductor device and method for manufacturing the same
08/11/2010CN101803007A Element mounting substrate, method for manufacturing element mounting substrate, circuit device, method for manufacturing circuit device, and portable device
08/11/2010CN101802990A Semiconductor packaging process using through silicon vias
08/11/2010CN101802989A Method and apparatus for forming arbitrary structures for integrated circuit devices
08/11/2010CN101802988A Chip package with pin stabilization layer
08/11/2010CN101802256A Exhaust system structure of film forming apparatus, film forming apparatus and method of disposing of exhaust gas
08/11/2010CN101802049A Inclusion complex containing epoxy resin composition for semiconductor encapsulation
08/11/2010CN101801886A Component having a ceramic base the surface of which is metalized
08/11/2010CN101801581A Method for preventing void formation in a solder joint
08/11/2010CN101801167A Solderless heatsink anchor and system thereof
08/11/2010CN101801166A Heat sink
08/11/2010CN101801162A Wireless communication module
08/11/2010CN101801154A Circuit board
08/11/2010CN101800246A ESD device
08/11/2010CN101800244A Semiconductor device
08/11/2010CN101800238A Organic electroluminescence device and test method thereof
08/11/2010CN101800229A 显示装置 Display device
08/11/2010CN101800227A Thin film transistor array substrate and manufacturing method thereof
08/11/2010CN101800219A Luminescent element
08/11/2010CN101800216A Electronic module with emi protection
08/11/2010CN101800215A Wireless communication module package structure
08/11/2010CN101800214A Construction method of anti-electromagnetic interference electronic module
08/11/2010CN101800213A Electrostatic discharge protection device, manufacturing method and drain used thereinto
08/11/2010CN101800212A Test structure for the integrity of semiconductor element gate oxide
08/11/2010CN101800211A 半导体装置 Semiconductor device
08/11/2010CN101800210A Chip layout for reducing warp and method thereof
08/11/2010CN101800209A Flip chip mounted semiconductor device package having a dimpled leadframe
08/11/2010CN101800208A Semiconductor packaging structure and heat radiating fin thereof
08/11/2010CN101800207A Packaging structure of semiconductor element and manufacture method thereof
08/11/2010CN101800206A Semiconductor package and method of packaging the same
08/11/2010CN101800205A Semiconductor package and method of packaging the same
08/11/2010CN101800204A Semiconductor sealing structure with model lock and radiating fin thereof
08/11/2010CN101800203A Radiating structure for semiconductor device
08/11/2010CN101800202A Radiating device and radiator
08/11/2010CN101800201A Package for electron element and electronic component
08/11/2010CN101800195A Method of manufacturing display device and display device
08/11/2010CN101800184A Packaging base plate with cave structure and manufacture method thereof
08/11/2010CN101800183A Combined semiconductor apparatus with thin semiconductor films
08/11/2010CN101800181A Manufacture method of flip chip encapsulation structure
08/11/2010CN101800073A Memory array and memory device
08/11/2010CN101800005A Flat-angle chip aslant sticking type back-off packaged electronic tag
08/11/2010CN101799627A Positive photosensitive resin composition
08/11/2010CN101798057A Doped elongated semiconductors, growing such semiconductors, devices including such semiconductors and fabricating such devices
08/11/2010CN101561129B LED lamp provided with phase change radiator structure
08/11/2010CN101452913B Device structure using silicon controlled rectifier as electrostatic protection
08/11/2010CN101452909B Etching method of contact hole on contact hole interlayer film
08/11/2010CN101447473B Integrated circuit layout structure and manufacturing method thereof
08/11/2010CN101431028B Enhancement type back grid zinc oxide nano wire field effect transistor and method for producing the same
08/11/2010CN101425497B On-chip lead wire encapsulation construction and lead wire frame thereof
08/11/2010CN101413632B Led lamp strip
08/11/2010CN101409272B Ring-shaped surface adherence type conductor holder
08/11/2010CN101395531B Cooling apparatus and electronic device comprising same
08/11/2010CN101373061B LED light fitting
08/11/2010CN101369568B Packaging structure, packaging method and photosensitive device
08/11/2010CN101330045B Manufacturing method of semiconductor device
08/11/2010CN101329049B LED module group capable of radiating and manufacturing method thereof
08/11/2010CN101325845B Multilayer printed circuit board and method of fabricating the same
08/11/2010CN101315919B Chip packaging structure and technique
08/11/2010CN101304013B Method for preventing top layer metallic layer on encapsulation chip from fracturing
08/11/2010CN101266979B Nonvolatile semiconductor memory
08/11/2010CN101252096B Chip package structure and preparation method thereof
08/11/2010CN101221939B Package structure for optoelectronic device and fabrication method thereof
08/11/2010CN101150109B Leading wire frame
08/11/2010CN101127345B Semiconductor device and manufacturing method thereof
08/11/2010CN101072808B Method for producing acid anhydride based epoxy resin curing agent, acid anhydride based epoxy resin curing agent, epoxy resin composition, cured article therefrom and optical semiconductor device
08/11/2010CN101071839B 发光装置 Light-emitting device
08/10/2010USRE41478 Semiconductor device having an improved connection arrangement between a semiconductor pellet and base substrate electrodes and a method of manufacture thereof
08/10/2010US7774186 Power and ground shield mesh to remove both capacitive and inductive signal coupling effects of routing in integrated circuit device
08/10/2010US7773955 Radio frequency unit analog level detector and feedback control system
08/10/2010US7773384 Thermal module
08/10/2010US7773383 Heatsink assembly
08/10/2010US7773164 Active device array substrate
08/10/2010US7772831 Systems and methods for testing packaged dies
08/10/2010US7772710 Zero-order overlay targets
08/10/2010US7772709 Resin sealed semiconductor device and manufacturing method therefor
08/10/2010US7772708 Stacking integrated circuit dies
08/10/2010US7772707 Methods for wafer-level packaging of microelectronic devices and microelectronic devices formed by such methods
08/10/2010US7772705 Low thermal resistance package
08/10/2010US7772704 Semiconductor device
08/10/2010US7772703 Package substrate
08/10/2010US7772702 Dielectric spacers for metal interconnects and method to form the same
08/10/2010US7772701 Integrated circuit having improved interconnect structure
08/10/2010US7772700 Semiconductor device
08/10/2010US7772699 Semiconductor device and method of manufacturing the same
08/10/2010US7772698 Package structure for integrated circuit device
08/10/2010US7772697 Semiconductor device and method for producing the same
08/10/2010US7772696 IC package having IC-to-PCB interconnects on the top and bottom of the package substrate
08/10/2010US7772694 Integrated circuit module and method of packaging same
08/10/2010US7772693 Panel, semiconductor device and method for the production thereof
08/10/2010US7772692 Semiconductor device with cooling member
08/10/2010US7772691 Thermally enhanced wafer level package
08/10/2010US7772690 Insulating film
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