Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
07/2010
07/06/2010US7750459 Integrated module for data processing system
07/06/2010US7750458 Light source module and lighting device for a vehicle
07/06/2010US7750457 Semiconductor apparatus, manufacturing method thereof, semiconductor module apparatus using semiconductor apparatus, and wire substrate for semiconductor apparatus
07/06/2010US7750456 Printed circuit board and method of manufacturing semiconductor package using the same
07/06/2010US7750455 Triple tier package on package system
07/06/2010US7750454 Stacked integrated circuit package system
07/06/2010US7750453 Semiconductor device package with groove
07/06/2010US7750452 Same size die stacked package having through-hole vias formed in organic material
07/06/2010US7750451 Multi-chip package system with multiple substrates
07/06/2010US7750450 Stacked die package with stud spacers
07/06/2010US7750449 Packaged semiconductor components having substantially rigid support members and methods of packaging semiconductor components
07/06/2010US7750448 Semiconductor package and method for manufacturing the same
07/06/2010US7750447 High voltage and high power boost converter with co-packaged Schottky diode
07/06/2010US7750446 IC package structures having separate circuit interconnection structures and assemblies constructed thereof
07/06/2010US7750445 Stacked synchronous buck converter
07/06/2010US7750444 Lead-on-chip semiconductor package and leadframe for the package
07/06/2010US7750443 Semiconductor device package
07/06/2010US7750439 ESD protection device
07/06/2010US7750436 Electronic device comprising an integrated circuit and a capacitance element
07/06/2010US7750435 Inductively coupled integrated circuit and methods for use therewith
07/06/2010US7750432 Semiconductor fuse box and method for fabricating the same
07/06/2010US7750413 Semiconductor device and method for manufacturing same
07/06/2010US7750409 Semiconductor device
07/06/2010US7750408 Integrated circuit structure incorporating an inductor, a conductive sheet and a protection circuit
07/06/2010US7750406 Design structure incorporating a hybrid substrate
07/06/2010US7750398 Trench MOSFET with trench termination and manufacture thereof
07/06/2010US7750397 Semiconductor component including compensation zones and discharge structures for the compensation zones
07/06/2010US7750351 Epitaxial substrate for field effect transistor
07/06/2010US7750268 Energy efficient, laser-based method and system for processing target material
07/06/2010US7749921 Semiconductor element, method for manufacturing the semiconductor element, electronic device and method for manufacturing the electronic device
07/06/2010US7749901 Method for forming a tapered via of a semiconductor device
07/06/2010US7749888 Semiconductor element and a producing method for the same, and a semiconductor device and a producing method for the same
07/06/2010US7749836 Nonvolatile semiconductor memory and manufacturing method thereof
07/06/2010US7749813 Circuit board for direct flip chip attachment
07/06/2010US7749807 Method of fabricating a semiconductor multipackage module including a processor and memory package assemblies
07/06/2010US7749797 Semiconductor device having a sensor chip, and method for producing the same
07/06/2010US7749622 Multilayer film-coated substrate and process for its production
07/06/2010US7749430 Member for semiconductor device and production method thereof
07/06/2010US7749038 Light emitting device fabrication method
07/06/2010US7748440 Patterned structure for a thermal interface
07/06/2010CA2672629A1 Energy transducing apparatus and energy transducing equipment
07/01/2010WO2010075331A1 Embedded through silicon stack 3-d die in a package substrate
07/01/2010WO2010074939A1 System and method for isolated nmos-based esd clamp cell
07/01/2010WO2010074842A2 Stacked power converter structure and method
07/01/2010WO2010074840A2 Acrylic thermal conductive sheet and method for producing the same
07/01/2010WO2010074716A1 Ultraviolet light filter layer in image sensors
07/01/2010WO2010074649A1 Via structure and method thereof
07/01/2010WO2010074510A2 Structure for multi-row leadframe and semiconductor package thereof and manufacture method thereof
07/01/2010WO2010074127A1 Piezoelectric oscillation device, method for manufacturing a piezoelectric oscillation device, and etching method of structural components forming a piezoelectric oscillation device
07/01/2010WO2010073880A1 Heat-conductive pressure-sensitive adhesive laminated sheet and electronic component
07/01/2010WO2010073832A1 Semiconductor package
07/01/2010WO2010073831A1 Multilayer circuit board and method for manufacturing same
07/01/2010WO2010073660A1 Lead, wiring member, package part, metal part provided with resin and resin-sealed semiconductor device, and methods for producing same
07/01/2010WO2010073559A1 Liquid resin composition and semiconductor device
07/01/2010WO2010073526A1 Thermal transport device producing method and thermal transport device
07/01/2010WO2010073497A1 Semiconductor device
07/01/2010WO2010073457A1 Powder, method for producing same, and resin composition containing same
07/01/2010WO2010073433A1 Semiconductor device and method for manufacturing same
07/01/2010WO2010073425A1 Semiconductor device and method for manufacturing the same
07/01/2010WO2010072667A1 Electrical or electronic composite component and method for producing an electrical or electronic composite component
07/01/2010WO2010072666A1 Method for forming thin film resistor and terminal bond pad simultaneously
07/01/2010WO2010072555A1 Electrical or electronic composite component and method for producing an electrical or electronic composite component
07/01/2010WO2010072492A1 Chip design having integrated fuse and method for the production thereof
07/01/2010WO2010072455A1 Device and method for producing a device
07/01/2010WO2010072221A2 Cooling device with bended flat tube and related manufacturing method
07/01/2010WO2010072017A1 Solar battery, its identification method and correlative identification mark manufacturing system
07/01/2010WO2010036709A3 Overmolded semiconductor package with an integrated antenna
07/01/2010WO2009058973A3 Bga package with traces for plating pads under the chip
07/01/2010US20100168659 Analyte Monitoring Device and Methods of Use
07/01/2010US20100168658 Analyte Monitoring Device and Methods of Use
07/01/2010US20100167561 Structure and process for a contact grid array formed in a circuitized substrate
07/01/2010US20100167430 Apparatus and method for testing a transducer and/or electronic circuitry associated with a transducer
07/01/2010US20100165775 Semiconductor device having electrical fuses with less power consumption and interconnection arrangement
07/01/2010US20100165595 Semiconductor package and plasma display device including the same
07/01/2010US20100164530 Adjusting configuration of a multiple gate transistor by controlling individual fins
07/01/2010US20100164508 System and method for test structure on a wafer
07/01/2010US20100164127 Epoxy resin composition for photosemiconductor element encapsulation and cured product thereof, and photosemiconductor device using the same
07/01/2010US20100164126 Resin composition, resin spacer film, and semiconductor device
07/01/2010US20100164125 Method of evaluating the flame retardancy of sealing resin and test sample for evaluation of flame retardancy
07/01/2010US20100164123 Local silicidation of via bottoms in metallization systems of semiconductor devices
07/01/2010US20100164122 Method of forming conductive layer and semiconductor device
07/01/2010US20100164121 Metallization system of a semiconductor device comprising extra-tapered transition vias
07/01/2010US20100164120 Through-hole electrode substrate and method of manufacturing the same
07/01/2010US20100164119 Semiconductor device and method of manufacturing the same
07/01/2010US20100164118 Method for fabricating semiconductor device including metal contact
07/01/2010US20100164117 Through-Silicon Via With Air Gap
07/01/2010US20100164116 Electromigration resistant via-to-line interconnect
07/01/2010US20100164115 Semiconductor chip package
07/01/2010US20100164114 Wire Structure of Semiconductor Device and Method for Manufacturing the Same
07/01/2010US20100164113 Method for forming copper wiring in semiconductor device
07/01/2010US20100164112 Semiconductor device
07/01/2010US20100164111 Interconnect structure with improved dielectric line to via electromigration resistant interfacial layer and method of fabricating same
07/01/2010US20100164110 Metal silicide nanowires and methods for their production
07/01/2010US20100164109 Backside Metal Treatment of Semiconductor Chips
07/01/2010US20100164108 Integrating a bottomless via to promote adsorption of antisuppressor on exposed copper surface and enhance electroplating superfill on noble metals
07/01/2010US20100164107 SEMICONDUCTOR DEVICE HAVING MULTILAYERED INTERCONNECTION STRUCTURE FORMED BY USING Cu DAMASCENE METHOD, AND METHOD OF FABRICATING THE SAME
07/01/2010US20100164106 CMP Slurry Composition for Barrier Polishing for Manufacturing Copper Interconnects, Polishing Method Using the Composition, and Semiconductor Device Manufactured by the Method
07/01/2010US20100164105 Semiconductor device and method of manufacturing the same
07/01/2010US20100164104 Structures and Methods for Improving Solder Bump Connections in Semiconductor Devices
07/01/2010US20100164103 Semiconductor device
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