Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
08/2010
08/04/2010CN101794748A Packaging structure of rectangular radiating block for chip of printed circuit board
08/04/2010CN101794747A Packaging structure of radiating block with locking hole and convex surface for chip of printed circuit board
08/04/2010CN101794746A Packaging structure of inverse T-shaped radiating block for chip of printed circuit board
08/04/2010CN101794745A Totally-wrapped packaging structure of radiating block for chip of printed circuit board
08/04/2010CN101794744A Packaging structure of radiating block and convex surface for chip of printed circuit board
08/04/2010CN101794743A Island embedded chip rightly mounted package structure with reverse T type heat dissipation block
08/04/2010CN101794742A Power semiconductor module conducting based on pressure contact mode
08/04/2010CN101794741A 散热装置及功率模块 Cooling devices and power modules
08/04/2010CN101794740A 抗高温整流芯片 High-temperature rectification chip
08/04/2010CN101794739A Diode ceramic packaging template
08/04/2010CN101794738A 半导体装置及其制造方法 Semiconductor device and manufacturing method
08/04/2010CN101794735A Methods of forming contact structures and semiconductor devices fabricated using contact structures
08/04/2010CN101794727A Distributed cancellation method of integrated circuit substrate noise and circuit
08/04/2010CN101794723A Dicing tape-integrated wafer back surface protective film
08/04/2010CN101794716A 半导体装置及其制造方法 Semiconductor device and manufacturing method
08/04/2010CN101794715A Marking method for semiconductor device and semiconductor device provided with markings
08/04/2010CN101794708A Semiconductor device, manufacturing method thereof, multi-layer substrate with the semiconductor device built in
08/04/2010CN101794537A 显示驱动半导体装置 Display driver semiconductor device
08/04/2010CN101793472A Heat-transporting device and electronic apparatus
08/04/2010CN101793353A Universal type LED (Light-Emitting Diode) light source module for sealed type outdoor illuminating lamp and lamp thereof
08/04/2010CN101792520A Low-corrosive epoxy resins and production method thereof
08/04/2010CN101792113A Method and apparatus for protecting wiring and integrated circuit device
08/04/2010CN101562191B Photoelectric packaging part with cavity and production method thereof
08/04/2010CN101364573B Test construction and test method
08/04/2010CN101339908B Electroplating method of electric contact mat and semi-conductor substrate having the electric contact mat
08/04/2010CN101325192B Substrate easy to measure temperature and manufacturing method thereof
08/04/2010CN101286506B Multi-chip encapsulation structure having single chip support base
08/04/2010CN101252113B Conducting wire rack with corresponding shape chip seat and joint feet, and corresponding packaging structure
08/04/2010CN101236985B Memory cell device with coplanar electrode surface and method
08/04/2010CN101111528B Resin compositions, cured article obtained therefrom, and sheet
08/04/2010CN101056522B Liquid-cooled radiator and liquid-cooled heat radiator applying the same
08/03/2010US7768786 Heatsink assembly
08/03/2010US7768785 Memory module assembly including heat-sink plates with heat-exchange fins attached to integrated circuits by adhesive
08/03/2010US7768768 Semiconductor device including power switch and power reinforcement cell
08/03/2010US7768754 Ceramic substrate for light emitting diode where the substrate incorporates ESD protection
08/03/2010US7768141 Dicing die attachment film and method for packaging semiconductor using same
08/03/2010US7768139 Power semiconductor module
08/03/2010US7768138 Semiconductor device
08/03/2010US7768137 Semiconductor chip with flip chip contacts and a passivation layer with varying thickness portions surrounding contact surfaces of the semiconductor chip
08/03/2010US7768136 Sealed-by-resin type semiconductor device
08/03/2010US7768135 Semiconductor package with fast power-up cycle and method of making same
08/03/2010US7768134 Interconnect structure and method for semiconductor device
08/03/2010US7768133 Semiconductor device and semiconductor module employing thereof
08/03/2010US7768132 Circuit device and manufacturing method thereof
08/03/2010US7768131 Package structure preventing solder overflow on substrate solder pads
08/03/2010US7768130 back-end-of-line (BEOL) metalization; integrated circuits; etch resistance; photoresists; semiconductors
08/03/2010US7768129 Metal etching method for an interconnect structure and metal interconnect structure obtained by such method
08/03/2010US7768128 Semiconductor memory devices including a damascene wiring line
08/03/2010US7768127 Semiconductor device including multi-layered interconnection and method of manufacturing the device
08/03/2010US7768126 Barrier formation and structure to use in semiconductor devices
08/03/2010US7768125 Multi-chip package system
08/03/2010US7768124 Semiconductor sensor having a flat mounting plate with banks
08/03/2010US7768123 Stacked dual-die packages, methods of making, and systems incorporating said packages
08/03/2010US7768122 Semiconductor package
08/03/2010US7768121 Apparatus and methods for cooling semiconductor integrated circuit package structures
08/03/2010US7768120 Heat spreader and semiconductor device using the same
08/03/2010US7768119 Carrier structure embedded with semiconductor chip
08/03/2010US7768118 Semiconductor device
08/03/2010US7768117 Microelectronic package having interconnected redistribution paths
08/03/2010US7768116 Semiconductor package substrate having different thicknesses between wire bonding pad and ball pad and method for fabricating the same
08/03/2010US7768115 Stack chip and stack chip package having the same
08/03/2010US7768114 Semiconductor package, stacked semiconductor package having the same, and a method for selecting one semiconductor chip in a stacked semiconductor package
08/03/2010US7768113 Stackable tier structure comprising prefabricated high density feedthrough
08/03/2010US7768112 Semiconductor package fabricated by cutting and molding in small windows
08/03/2010US7768111 Card adapter for use with a storage apparatus
08/03/2010US7768110 Nonvolatile memory apparatus
08/03/2010US7768109 Semiconductor device and method of manufacturing the same
08/03/2010US7768108 Semiconductor die package including embedded flip chip
08/03/2010US7768107 Semiconductor component including semiconductor chip and method for producing the same
08/03/2010US7768106 Multi-chip stack structure and fabrication method thereof
08/03/2010US7768105 Pre-molded clip structure
08/03/2010US7768104 Apparatus and method for series connection of two die or chips in single electronics package
08/03/2010US7768103 Tape distribution substrate having pattern for reducing EMI
08/03/2010US7768100 Semiconductor integrated circuit
08/03/2010US7768097 Integrated circuit package having an inductance loop formed from a multi-loop configuration
08/03/2010US7768094 Semiconductor integrated circuit and wafer having diffusion regions differing in thickness and method for manufacturing the same
08/03/2010US7768093 Power semiconductor device
08/03/2010US7768089 Semiconductor device
08/03/2010US7768074 Dual salicide integration for salicide through trench contacts and structures formed thereby
08/03/2010US7768071 Stabilizing breakdown voltages by forming tunnels for ultra-high voltage devices
08/03/2010US7768065 Semiconductor device
08/03/2010US7768057 NAND-type EEPROM with increased reading speed
08/03/2010US7768054 Semiconductor component with integrated capacitance structure and method for fabrication thereof
08/03/2010US7768043 Semiconductor device having high frequency components and manufacturing method thereof
08/03/2010US7768038 Post vertical interconnects formed with silicide etch stop and method of making
08/03/2010US7768037 Programmable memory cell in an integrated circuit chip
08/03/2010US7768034 Tapered voltage polysilicon diode electrostatic discharge circuit for power MOSFETs and ICs
08/03/2010US7768005 Physically highly secure multi-chip assembly
08/03/2010US7768004 Semiconductor device including chips with electrically-isolated test elements and its manufacturing method
08/03/2010US7767912 Integrated circuit carrier arrangement with electrical connection islands
08/03/2010US7767589 Passivation layer for a circuit device and method of manufacture
08/03/2010US7767587 Method of forming an interconnection structure in a organosilicate glass having a porous layer with higher carbon content located between two lower carbon content non-porous layers
08/03/2010US7767575 Forming robust solder interconnect structures by reducing effects of seed layer underetching
08/03/2010US7767524 Method and structure for forming a shielded gate field effect transistor
08/03/2010US7767502 Method for manufacturing electronic device using thin film transistor with protective cap over flexible substrate
08/03/2010US7767500 Superjunction device with improved ruggedness
08/03/2010US7767494 Method of manufacturing layered chip package
08/03/2010US7767489 Donor substrate for a flat panel display and method of fabricating an organic light emitting diode (OLED) display using the same
08/03/2010US7767024 Method for front end of line fabrication
08/03/2010US7766661 Heat transfer member and connector
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