Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
06/2010
06/23/2010CN101373783B Photodiode array and method for manufacturing same
06/23/2010CN101373741B Semiconductor shielding structure and manufacturing method thereof
06/23/2010CN101371358B Package for a light emitting diode with integrated electrostatic discharge protection
06/23/2010CN101364586B Construction for packaging substrate
06/23/2010CN101359649B Programmable through-hole devices, maufacturing method thereof and integrated logic circuit
06/23/2010CN101351088B Inside imbedded type line structure and technique thereof
06/23/2010CN101312168B 半导体器件 Semiconductor devices
06/23/2010CN101295726B Image sensor and method of manufacturing the same
06/23/2010CN101295693B 半导体器件 Semiconductor devices
06/23/2010CN101295686B Semiconductor device and method of manufacturing the same
06/23/2010CN101273454B Wafer with scribe lanes comprising external pads and/or active circuits for die testing
06/23/2010CN101256985B Thin-film transistor array substrate and manufacturing method thereof
06/23/2010CN101251976B Display apparatus, driving method thereof, and electronic system
06/23/2010CN101236963B Semiconductor device and packaging structure therefor
06/23/2010CN101231989B Semiconductor packaging supported films and packaging construction for increasing heat sinking efficiency
06/23/2010CN101226902B Pixel structure of liquid crystal display panel and manufacturing method thereof
06/23/2010CN101222117B Semiconductor light emitting device and method for fabricating same
06/23/2010CN101221961B Pixel structure and its production method
06/23/2010CN101211904B Bidirectional switch module
06/23/2010CN101211899B Stack package having reduced electrical connection length suitable for high speed operations and method of manufacturing the same
06/23/2010CN101207138B Thin film transistor substrate and fabricating method thereof
06/23/2010CN101197355B Electronic device and method for producing the same, LBD display unit and method for producing the same
06/23/2010CN101188194B Bonded wafer and method for producing bonded wafer
06/23/2010CN101162481B Semiconductor integrated circuit layout designing apparatus
06/23/2010CN101151726B Radiation curable cycloaliphatic barrier sealants
06/23/2010CN101145565B Thin film transistor array substrate with multiple chamfers and liquid crystal display device
06/23/2010CN101131969B Semiconductor substrate
06/23/2010CN101114638B Stack type semiconductor packaging structure containing flexible circuit board
06/23/2010CN101090605B Printed circuit board and circuit structure for power supply
06/23/2010CN101071802B Semiconductor device and method for cutting electric fuse
06/23/2010CN101060120B 半导体集成电路 The semiconductor integrated circuit
06/23/2010CN101018473B Mirroring shielding structure
06/23/2010CN101010794B Method for manufacturing semiconductor device and semiconductor device manufactured by such method
06/23/2010CN101006578B Wafer with improved conductive loops in the dicing lines
06/22/2010US7742843 Method for the structured application of a laminatable film to a substrate for a semiconductor module
06/22/2010US7742313 Stacked microfeature devices
06/22/2010US7742302 Axial-flow fan unit and heat-emitting element cooling
06/22/2010US7742297 Ceramic foam electronic component cooling
06/22/2010US7742296 Computer having apparatuses for cooling elements
06/22/2010US7742295 Cooling device and electronic device
06/22/2010US7742142 Display and tape carrier package structure
06/22/2010US7741726 Integrated circuit underfill package system
06/22/2010US7741725 Semiconductor apparatus and method of producing the same
06/22/2010US7741724 Semiconductor device
06/22/2010US7741722 Through-wafer vias
06/22/2010US7741721 Electrical fuses and resistors having sublithographic dimensions
06/22/2010US7741720 Electronic device with wire bonds adhered between integrated circuits dies and printed circuit boards
06/22/2010US7741719 Integrated circuit system with dummy region
06/22/2010US7741717 Metal line of semiconductor device and method of fabricating the same
06/22/2010US7741716 Integrated circuit bond pad structures
06/22/2010US7741715 Crack stop and moisture barrier
06/22/2010US7741714 Bond pad structure with stress-buffering layer capping interconnection metal layer
06/22/2010US7741713 Semiconductor device and method of manufacturing the same
06/22/2010US7741712 Semiconductor device, circuit substrate, electro-optic device and electronic appliance
06/22/2010US7741711 Power semiconductor module with a connected substrate carrier and production method therefor
06/22/2010US7741710 Module with multiple power amplifiers and power sensors
06/22/2010US7741709 Embedded type multifunctional integrated structure for integrating protection components and method for manufacturing the same
06/22/2010US7741708 Semiconductor device
06/22/2010US7741707 Stackable integrated circuit package system
06/22/2010US7741706 Plastic surface mount large area power device
06/22/2010US7741705 Semiconductor device and method of producing the same
06/22/2010US7741704 Leadframe and mold compound interlock in packaged semiconductor device
06/22/2010US7741703 Electronic device and lead frame
06/22/2010US7741702 Semiconductor structure formed using a sacrificial structure
06/22/2010US7741701 Method for reducing stress concentrations on a semiconductor wafer by surface laser treatment
06/22/2010US7741696 Semiconductor integrated circuit including metal mesh structure
06/22/2010US7741692 Integrated circuit device with temperature monitor members
06/22/2010US7741683 Semiconductor device
06/22/2010US7741681 Latchup robust array I/O using through wafer via
06/22/2010US7741680 Electro-static discharge and latchup resistant semiconductor device
06/22/2010US7741679 Semiconductor device, method of manufacturing same and method of designing same
06/22/2010US7741638 Control layer for a nanoscale electronic switching device
06/22/2010US7741634 Josephson junction device for superconductive electronics with a magnesium diboride
06/22/2010US7741412 Curable organopolysiloxane composition
06/22/2010US7741388 A phenol-aldehyde glycidyl either resin, phenolic resin with biphenyl units, inorganic filler, a 3-mercapto-1,2-4-triazole, and curing accelerator; high flame resistance without any flame retardant; high solder reflow resistance; lead-free flowable solder
06/22/2010US7741227 Process for structuring at least one year as well as electrical component with structures from the layer
06/22/2010US7741216 Metal line of semiconductor device and method for forming the same
06/22/2010US7741213 Semiconductor device, DRAM integrated circuit device, and method of producing the same
06/22/2010US7741207 Semiconductor device with multilayered metal pattern
06/22/2010US7741162 Method for manufacturing high-frequency module device
06/22/2010US7741161 Method of making integrated circuit package with transparent encapsulant
06/22/2010US7741158 Method of making thermally enhanced substrate-base package
06/22/2010US7741155 Method of manufacturing semiconducting device with stacked dice
06/22/2010US7741154 Integrated circuit package system with stacking module
06/22/2010US7741132 Display panel, display panel inspection method, and display panel manufacturing method
06/22/2010US7739883 Computer cooling apparatus
06/22/2010CA2687936A1 Low cost manufacturing of micro-channel heatsink
06/17/2010WO2010068872A1 Via first plus via last technique for ic interconnect
06/17/2010WO2010068699A2 Semiconductor die interconnect formed by aerosol application of electrically conductive material
06/17/2010WO2010068652A2 Semiconductor die package with clip interconnection
06/17/2010WO2010068648A2 Semiconductor die package including low stress configuration
06/17/2010WO2010068577A2 Anchor pin lead frame
06/17/2010WO2010068515A2 Electronic devices including flexible electrical circuits and related methods
06/17/2010WO2010068490A1 Die-to-die power consumption optimization
06/17/2010WO2010068488A1 Methods for protecting a die surface with photocurable materials
06/17/2010WO2010068164A1 An arrangement related to a gas sensor
06/17/2010WO2010067725A1 Circuit module
06/17/2010WO2010067683A1 Composition
06/17/2010WO2010067610A1 Semiconductor module, method for manufacturing semiconductor module, and portable apparatus
06/17/2010WO2010067548A1 Electronic component for wiring, method for manufacturing the electronic component, electronic device package to be used with the electronic component packaged therein, and method for manufacturing the electronic device package
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